JPS59116927U - liquid crystal element - Google Patents
liquid crystal elementInfo
- Publication number
- JPS59116927U JPS59116927U JP982183U JP982183U JPS59116927U JP S59116927 U JPS59116927 U JP S59116927U JP 982183 U JP982183 U JP 982183U JP 982183 U JP982183 U JP 982183U JP S59116927 U JPS59116927 U JP S59116927U
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- crystal element
- lead terminal
- terminal portion
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図ａ、 ｂは従来の液晶素子の構造と、素子の折
り曲げ状態を示す図、第２図ａは本考案の一実施例の平
面図、第２図すは、第１図ａのＢ−Ｂ矢視断面図、第２
図Ｃは第１図ａのＣ−Ｃ矢視断面図である。
２．１６・・・接着剤、５・・・熱融着部。Figures 1a and b are diagrams showing the structure of a conventional liquid crystal element and the folded state of the element; Figure 2a is a plan view of an embodiment of the present invention; -B cross-sectional view, 2nd
Figure C is a sectional view taken along the line CC in Figure 1a. 2.16... Adhesive, 5... Heat fusion part.
Claims (1)
、その上に配向処理を行なった後、シール材を用いて組
立てる液晶素子において、リード端子部を除く素子周辺
シール部をフィルム同士の熱融着により補強したことを
特徴とする液晶素子。 ２ リード端子部となる部分で、接着剤を上、下基板に
またがるように外側から塗布し、硬化させたことを特徴
とする実用新案登録請求の範囲第１項記載の液晶素子。[Scope of Claim for Utility Model Registration] 1. In a liquid crystal device that is assembled using a sealing material after forming a transparent conductive film on the surface of a plastic film and performing alignment treatment thereon, the sealing portion around the device excluding the lead terminal portion A liquid crystal element characterized by being reinforced by heat fusion between films. 2. The liquid crystal element according to claim 1, wherein an adhesive is applied from the outside so as to span the upper and lower substrates in the portion that will become the lead terminal portion, and is cured.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP982183U JPS59116927U (en) | 1983-01-28 | 1983-01-28 | liquid crystal element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP982183U JPS59116927U (en) | 1983-01-28 | 1983-01-28 | liquid crystal element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59116927U true JPS59116927U (en) | 1984-08-07 |
Family
ID=30141268
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP982183U Pending JPS59116927U (en) | 1983-01-28 | 1983-01-28 | liquid crystal element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59116927U (en) |
-
1983
- 1983-01-28 JP JP982183U patent/JPS59116927U/en active Pending
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