JPH0359659U - - Google Patents
Info
- Publication number
- JPH0359659U JPH0359659U JP11963389U JP11963389U JPH0359659U JP H0359659 U JPH0359659 U JP H0359659U JP 11963389 U JP11963389 U JP 11963389U JP 11963389 U JP11963389 U JP 11963389U JP H0359659 U JPH0359659 U JP H0359659U
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- flexible
- substrate
- bent
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 2
- 230000001681 protective effect Effects 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 1
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000057 synthetic resin Substances 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図及び第２図は本考案になるフレキシブル
基板を示す概略断面図、第３図は本考案になるフ
レキシブル基板の形成方法を説明するための概略
断面図、第４図ａは従来のフレキシブル基板を示
す平面図、同図ｂは同図ａの一部概略断面図であ
る。
１１……フレキシブル基板、１８……保護材、
３０……フレキシブル基板、３１……接続部、３
２……略中間位置、３３……接着剤、３４……境
界部。
1 and 2 are schematic cross-sectional views showing the flexible substrate according to the present invention, FIG. 3 is a schematic cross-sectional view for explaining the method for forming the flexible substrate according to the present invention, and FIG. 4a is a conventional flexible substrate. FIG. 1B is a plan view showing the substrate, and FIG. 11...Flexible board, 18...Protective material,
30...Flexible board, 31...Connection part, 3
2...approximately intermediate position, 33...adhesive, 34...border portion.
Claims (1)
基板に挟持された導電材からなるパターンを有し
、このパターンの端部に外部回路との接合部を露
出形成してなるフレキシブル基板であつて、 前記接合部に一部または全体を外側にして折り
曲げ下地基板同志を接着してなることを特徴とす
るフレキシブル基板。[Claims for Utility Model Registration] It has a pattern made of a conductive material sandwiched between a flexible protective material made of synthetic resin and a base substrate, and a connection part with an external circuit is formed exposed at the end of this pattern. What is claimed is: 1. A flexible substrate, characterized in that the base substrates are bent and bonded to each other with a part or the whole thereof facing outside at the joint portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11963389U JPH0359659U (en) | 1989-10-12 | 1989-10-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11963389U JPH0359659U (en) | 1989-10-12 | 1989-10-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0359659U true JPH0359659U (en) | 1991-06-12 |
Family
ID=31667748
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11963389U Pending JPH0359659U (en) | 1989-10-12 | 1989-10-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0359659U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6081671A (en) * | 1983-10-11 | 1985-05-09 | Toshiba Corp | Money transfer processing system |
| JPS6141270U (en) * | 1984-08-20 | 1986-03-15 | 富士通株式会社 | vertical magnetic head |
-
1989
- 1989-10-12 JP JP11963389U patent/JPH0359659U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6081671A (en) * | 1983-10-11 | 1985-05-09 | Toshiba Corp | Money transfer processing system |
| JPS6141270U (en) * | 1984-08-20 | 1986-03-15 | 富士通株式会社 | vertical magnetic head |
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