JPH01166320U - - Google Patents
Info
- Publication number
- JPH01166320U JPH01166320U JP6133888U JP6133888U JPH01166320U JP H01166320 U JPH01166320 U JP H01166320U JP 6133888 U JP6133888 U JP 6133888U JP 6133888 U JP6133888 U JP 6133888U JP H01166320 U JPH01166320 U JP H01166320U
- Authority
- JP
- Japan
- Prior art keywords
- panel
- driver
- mounting structure
- connection electrode
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000008642 heat stress Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
Description
第１図は、本考案を示す断面図。第２図は、Ｔ
ＡＢにてドライバＩＣの実装した断面図。第３図
は、硬質基板にＣＯＢにてドライバＩＣを実装し
た断面図。第４図は、ＴＡＢを利用したパネル実
装構造の断面図。第５図は、ＣＯＢとフレキを利
用したパネル実装構造の断面図。第６図は、熱ス
トレスを試算した結果図。第７図は、パネル実装
構造体の試験結果図。
１……ドライバーＩＣ、２……ＴＡＢ用テープ
、３……異方性導電膜（接着剤）、４……基板（
プリント配線板）、５……ワイヤ、６……フレキ
シブルテープ（フレキシブルプリント配線板）、
７……パネル、８……フイルム、９……電極ガラ
ス、１０……配線、１１……接合電極、１２……
モールド剤、１３……押え材。
FIG. 1 is a sectional view showing the present invention. Figure 2 shows T
A cross-sectional view of the driver IC mounted at AB. FIG. 3 is a sectional view of a driver IC mounted on a hard substrate using COB. FIG. 4 is a sectional view of a panel mounting structure using TAB. FIG. 5 is a sectional view of a panel mounting structure using COB and flexible. Figure 6 shows the results of a trial calculation of heat stress. FIG. 7 is a diagram showing the test results of the panel mounting structure. 1... Driver IC, 2... TAB tape, 3... Anisotropic conductive film (adhesive), 4... Substrate (
(printed wiring board), 5...wire, 6...flexible tape (flexible printed wiring board),
7... Panel, 8... Film, 9... Electrode glass, 10... Wiring, 11... Bonding electrode, 12...
Molding agent, 13...pressing material.
Claims (1)
との実装構造において、ドライバーＩＣをテープ
キヤリアに実装して、パネルとの接続電極を、パ
ネルの電極にパネルのガラスと熱膨脹係数の差が
２０×１０−７以下の硬資材にて接続電極側から
加圧圧接させ、その間を接着剤で固めたことを特
徴とするパネルの実装構造体。 LCD panel and driver IC
In the mounting structure, the driver IC is mounted on a tape carrier, and the connection electrode to the panel is made of a hard material whose coefficient of thermal expansion differs from that of the panel glass by 20 × 10 -7 or less on the connection electrode side. A panel mounting structure characterized in that the panels are pressure-welded together and the space between them is solidified with adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6133888U JPH01166320U (en) | 1988-05-10 | 1988-05-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6133888U JPH01166320U (en) | 1988-05-10 | 1988-05-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01166320U true JPH01166320U (en) | 1989-11-21 |
Family
ID=31287013
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6133888U Pending JPH01166320U (en) | 1988-05-10 | 1988-05-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01166320U (en) |
-
1988
- 1988-05-10 JP JP6133888U patent/JPH01166320U/ja active Pending
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