JPH02133346U - - Google Patents

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Publication number
JPH02133346U
JPH02133346U JP4109689U JP4109689U JPH02133346U JP H02133346 U JPH02133346 U JP H02133346U JP 4109689 U JP4109689 U JP 4109689U JP 4109689 U JP4109689 U JP 4109689U JP H02133346 U JPH02133346 U JP H02133346U
Authority
JP
Japan
Prior art keywords
heat
generating
board
support plate
generating substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4109689U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4109689U priority Critical patent/JPH02133346U/ja
Publication of JPH02133346U publication Critical patent/JPH02133346U/ja
Pending legal-status Critical Current

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Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は一実施例を示す側面図、第２図は同実
施例と従来のサーマルヘツドの平面度の温度変化
を示す図、第３図は従来のサーマルヘツドを示す
側面図である。 １１……支持板、１２……発熱基板、１４……
フレキシブル印刷配線板、１５……圧接ゴム、１
６……カバー、１７……圧接ねじ、１８……両面
接着テープ。 FIG. 1 is a side view showing one embodiment, FIG. 2 is a diagram showing temperature changes in flatness of the same embodiment and a conventional thermal head, and FIG. 3 is a side view showing a conventional thermal head. 11... Support plate, 12... Heat generating board, 14...
Flexible printed wiring board, 15...Pressure rubber, 1
6...Cover, 17...Pressure screw, 18...Double-sided adhesive tape.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 発熱抵抗体が形成され表面に駆動ＩＣが実装さ
れた発熱基板の入力用配線にフレキシブル印刷配
線板が圧接されて電気的接続が施され、前記発熱
基板は裏面側が支持板に対向するように支持板上
に載置され、かつ、発熱基板裏面で前記圧接部下
部を除く一部の領域で両面接着テープにより発熱
基板と支持板が接着されているサーマルヘツド。 A flexible printed wiring board is press-contacted to the input wiring of a heat-generating board on which a heat-generating resistor is formed and a drive IC is mounted on the surface to make an electrical connection, and the heat-generating board is supported so that its back side faces a support plate. A thermal head that is placed on a plate and has a heat generating substrate and a support plate bonded to each other with a double-sided adhesive tape in a part of the back surface of the heat generating substrate except for the lower part of the pressure contact portion.
JP4109689U 1989-04-07 1989-04-07 Pending JPH02133346U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4109689U JPH02133346U (en) 1989-04-07 1989-04-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4109689U JPH02133346U (en) 1989-04-07 1989-04-07

Publications (1)

Publication Number Publication Date
JPH02133346U true JPH02133346U (en) 1990-11-06

Family

ID=31551467

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4109689U Pending JPH02133346U (en) 1989-04-07 1989-04-07

Country Status (1)

Country Link
JP (1) JPH02133346U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04278363A (en) * 1991-03-05 1992-10-02 Mitsubishi Electric Corp Thermal head

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04278363A (en) * 1991-03-05 1992-10-02 Mitsubishi Electric Corp Thermal head

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