JPS60184268U - heat crimp connector - Google Patents
heat crimp connectorInfo
- Publication number
- JPS60184268U JPS60184268U JP7237284U JP7237284U JPS60184268U JP S60184268 U JPS60184268 U JP S60184268U JP 7237284 U JP7237284 U JP 7237284U JP 7237284 U JP7237284 U JP 7237284U JP S60184268 U JPS60184268 U JP S60184268U
- Authority
- JP
- Japan
- Prior art keywords
- melt adhesive
- adhesive layer
- hot melt
- crimp connector
- terminal portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Non-Insulated Conductors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図〜第3図はこの考案の一実施例を示したもので、
第1図は加熱圧着コネクタの一部分の斜視図、第2図は
第1図のA−A線に沿う拡大断面図、第3図は加熱圧着
コネクタの使用状態図である。第4図及び第5図は従来
の加熱圧着コネクタの斜視図及びその一部分の拡大図、
第6図は第5図のB−B線に沿う拡大断面図である。
1・・・基板、2・・・配線、3・・・導電性ホットメ
ルト接着剤層、・4・・・絶縁性ホットメルト接着剤層
、5・・・導電部、5a・・・端子部、6・・・絶縁性
ホットメルト接着剤、7・・・回路基板、8・・・液晶
表示パネル、9・・・表示パネル接続端子。Figures 1 to 3 show an example of this invention.
FIG. 1 is a perspective view of a portion of the heat crimping connector, FIG. 2 is an enlarged sectional view taken along the line A--A in FIG. 1, and FIG. 3 is a diagram showing the heat crimping connector in use. FIGS. 4 and 5 are a perspective view of a conventional heat crimping connector and an enlarged view of a portion thereof,
FIG. 6 is an enlarged sectional view taken along line B--B in FIG. 5. DESCRIPTION OF SYMBOLS 1... Board, 2... Wiring, 3... Conductive hot melt adhesive layer, 4... Insulating hot melt adhesive layer, 5... Conductive part, 5a... Terminal part , 6... Insulating hot melt adhesive, 7... Circuit board, 8... Liquid crystal display panel, 9... Display panel connection terminal.
Claims (1)
た導電性ホットメルト接着剤層と、各導電性ホットメル
ト接着剤層間の基板間に塗着された絶縁性ホットメルト
接着剤層とを交互に形成した加熱圧着コネクタにおいて
、前記配線の端子部上に塗着される導電性ホットメルト
接着剤層を前記端子部の巾方向中央部を除いて形成し、
前記端子部の巾方向中央部には絶縁性ホットメルト接着
剤を塗着したことを特徴とする加熱圧着コネクタ。A conductive hot melt adhesive layer coated on the wiring and an insulating hot melt adhesive layer coated between the substrates between each conductive hot melt adhesive layer on a substrate surface on which a plurality of wirings are formed. A conductive hot melt adhesive layer is formed on the terminal portion of the wiring except for the center portion in the width direction of the terminal portion, and
A heat-crimped connector characterized in that an insulating hot-melt adhesive is applied to the center portion in the width direction of the terminal portion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7237284U JPS60184268U (en) | 1984-05-17 | 1984-05-17 | heat crimp connector |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7237284U JPS60184268U (en) | 1984-05-17 | 1984-05-17 | heat crimp connector |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60184268U true JPS60184268U (en) | 1985-12-06 |
Family
ID=30610724
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7237284U Pending JPS60184268U (en) | 1984-05-17 | 1984-05-17 | heat crimp connector |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60184268U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007053031A (en) * | 2005-08-18 | 2007-03-01 | Fujitsu Component Ltd | Terminal connecting structure |
JP2008227310A (en) * | 2007-03-14 | 2008-09-25 | Fujitsu Ltd | Hybrid substrate, electronic device having the same, and manufacturing method of hybrid substrate |
-
1984
- 1984-05-17 JP JP7237284U patent/JPS60184268U/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007053031A (en) * | 2005-08-18 | 2007-03-01 | Fujitsu Component Ltd | Terminal connecting structure |
JP2008227310A (en) * | 2007-03-14 | 2008-09-25 | Fujitsu Ltd | Hybrid substrate, electronic device having the same, and manufacturing method of hybrid substrate |
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