JPS6364054B2 - - Google Patents

Info

Publication number
JPS6364054B2
JPS6364054B2 JP57066823A JP6682382A JPS6364054B2 JP S6364054 B2 JPS6364054 B2 JP S6364054B2 JP 57066823 A JP57066823 A JP 57066823A JP 6682382 A JP6682382 A JP 6682382A JP S6364054 B2 JPS6364054 B2 JP S6364054B2
Authority
JP
Japan
Prior art keywords
chip
connection
pins
pads
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57066823A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58182841A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP57066823A priority Critical patent/JPS58182841A/ja
Publication of JPS58182841A publication Critical patent/JPS58182841A/ja
Publication of JPS6364054B2 publication Critical patent/JPS6364054B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Wire Bonding (AREA)
JP57066823A 1982-04-21 1982-04-21 モノリシツク集積回路 Granted JPS58182841A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57066823A JPS58182841A (ja) 1982-04-21 1982-04-21 モノリシツク集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57066823A JPS58182841A (ja) 1982-04-21 1982-04-21 モノリシツク集積回路

Publications (2)

Publication Number Publication Date
JPS58182841A JPS58182841A (ja) 1983-10-25
JPS6364054B2 true JPS6364054B2 (OSRAM) 1988-12-09

Family

ID=13326943

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57066823A Granted JPS58182841A (ja) 1982-04-21 1982-04-21 モノリシツク集積回路

Country Status (1)

Country Link
JP (1) JPS58182841A (OSRAM)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6098645A (ja) * 1983-11-02 1985-06-01 Mitsubishi Electric Corp 集積回路パツケ−ジの製造方法

Also Published As

Publication number Publication date
JPS58182841A (ja) 1983-10-25

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