JPS6362920B2 - - Google Patents
Info
- Publication number
- JPS6362920B2 JPS6362920B2 JP56106753A JP10675381A JPS6362920B2 JP S6362920 B2 JPS6362920 B2 JP S6362920B2 JP 56106753 A JP56106753 A JP 56106753A JP 10675381 A JP10675381 A JP 10675381A JP S6362920 B2 JPS6362920 B2 JP S6362920B2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- insulating film
- circuit
- hole
- flexible insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10675381A JPS589399A (ja) | 1981-07-08 | 1981-07-08 | 金属芯印刷配線板の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10675381A JPS589399A (ja) | 1981-07-08 | 1981-07-08 | 金属芯印刷配線板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS589399A JPS589399A (ja) | 1983-01-19 |
JPS6362920B2 true JPS6362920B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1988-12-05 |
Family
ID=14441665
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10675381A Granted JPS589399A (ja) | 1981-07-08 | 1981-07-08 | 金属芯印刷配線板の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS589399A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4845313A (en) * | 1985-07-22 | 1989-07-04 | Tokyo Communication Equipment Co., Ltd. | Metallic core wiring substrate |
JPS6222497A (ja) * | 1985-07-22 | 1987-01-30 | 東洋通信機株式会社 | メタルコア配線基板 |
JPS63229897A (ja) * | 1987-03-19 | 1988-09-26 | 古河電気工業株式会社 | リジツド型多層プリント回路板の製造方法 |
US6175084B1 (en) | 1995-04-12 | 2001-01-16 | Denki Kagaku Kogyo Kabushiki Kaisha | Metal-base multilayer circuit substrate having a heat conductive adhesive layer |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5136569A (en) * | 1974-09-21 | 1976-03-27 | Mitsubishi Electric Corp | Konseishusekikairo no seizohoho |
JPS5910770Y2 (ja) * | 1978-06-28 | 1984-04-04 | 松下電器産業株式会社 | プリント配線板 |
-
1981
- 1981-07-08 JP JP10675381A patent/JPS589399A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS589399A (ja) | 1983-01-19 |