JPS6362315B2 - - Google Patents

Info

Publication number
JPS6362315B2
JPS6362315B2 JP58157087A JP15708783A JPS6362315B2 JP S6362315 B2 JPS6362315 B2 JP S6362315B2 JP 58157087 A JP58157087 A JP 58157087A JP 15708783 A JP15708783 A JP 15708783A JP S6362315 B2 JPS6362315 B2 JP S6362315B2
Authority
JP
Japan
Prior art keywords
flux
group
compounds
compound
ococh
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58157087A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6049859A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15708783A priority Critical patent/JPS6049859A/ja
Publication of JPS6049859A publication Critical patent/JPS6049859A/ja
Publication of JPS6362315B2 publication Critical patent/JPS6362315B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613Polymers, e.g. resins

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP15708783A 1983-08-30 1983-08-30 半田用フラツクスの這上り防止剤 Granted JPS6049859A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15708783A JPS6049859A (ja) 1983-08-30 1983-08-30 半田用フラツクスの這上り防止剤

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15708783A JPS6049859A (ja) 1983-08-30 1983-08-30 半田用フラツクスの這上り防止剤

Publications (2)

Publication Number Publication Date
JPS6049859A JPS6049859A (ja) 1985-03-19
JPS6362315B2 true JPS6362315B2 (US20020051482A1-20020502-M00012.png) 1988-12-01

Family

ID=15641958

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15708783A Granted JPS6049859A (ja) 1983-08-30 1983-08-30 半田用フラツクスの這上り防止剤

Country Status (1)

Country Link
JP (1) JPS6049859A (US20020051482A1-20020502-M00012.png)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0528178Y2 (US20020051482A1-20020502-M00012.png) * 1988-03-02 1993-07-20
USD823645S1 (en) 2016-06-06 2018-07-24 Reynolds Consumer Products LLC Plate
USD823644S1 (en) 2016-06-06 2018-07-24 Reynolds Consumer Products LLC Plate

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007099760A1 (ja) * 2006-03-01 2007-09-07 Agc Seimi Chemical Co., Ltd. 半田用フラックス這い上がり防止組成物
WO2008059654A1 (fr) * 2006-11-17 2008-05-22 Agc Seimi Chemical Co., Ltd. Composition pour empêcher un brouillage du flux pour brasage, élément électronique pour un brasage enrobé avec la composition, procédé de brasage de l'élément et produit électrique
JP5247291B2 (ja) * 2008-08-07 2013-07-24 Agcセイミケミカル株式会社 はんだ用フラックス這い上がり防止組成物、該組成物を被覆したはんだ用電子部材、該部材のはんだ付け方法および電気製品
WO2011105223A1 (ja) * 2010-02-26 2011-09-01 アルプス電気株式会社 電気接点用表面処理剤

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4926074A (US20020051482A1-20020502-M00012.png) * 1973-03-12 1974-03-08
JPS5323270A (en) * 1976-08-13 1978-03-03 Mitsubishi Electric Corp Formation method of schottky diode electrodes
JPS6010694A (ja) * 1983-06-30 1985-01-19 石井 銀弥 プリント配線板のはんだ付け方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4926074A (US20020051482A1-20020502-M00012.png) * 1973-03-12 1974-03-08
JPS5323270A (en) * 1976-08-13 1978-03-03 Mitsubishi Electric Corp Formation method of schottky diode electrodes
JPS6010694A (ja) * 1983-06-30 1985-01-19 石井 銀弥 プリント配線板のはんだ付け方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0528178Y2 (US20020051482A1-20020502-M00012.png) * 1988-03-02 1993-07-20
USD823645S1 (en) 2016-06-06 2018-07-24 Reynolds Consumer Products LLC Plate
USD823644S1 (en) 2016-06-06 2018-07-24 Reynolds Consumer Products LLC Plate

Also Published As

Publication number Publication date
JPS6049859A (ja) 1985-03-19

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