JPS635842B2 - - Google Patents
Info
- Publication number
- JPS635842B2 JPS635842B2 JP56175058A JP17505881A JPS635842B2 JP S635842 B2 JPS635842 B2 JP S635842B2 JP 56175058 A JP56175058 A JP 56175058A JP 17505881 A JP17505881 A JP 17505881A JP S635842 B2 JPS635842 B2 JP S635842B2
- Authority
- JP
- Japan
- Prior art keywords
- ceramic capacitor
- oxide
- lead
- bismuth
- borosilicate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000203 mixture Substances 0.000 claims description 42
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 25
- 239000003985 ceramic capacitor Substances 0.000 claims description 22
- 238000010586 diagram Methods 0.000 claims description 16
- 229910052797 bismuth Inorganic materials 0.000 claims description 15
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 15
- 229910044991 metal oxide Inorganic materials 0.000 claims description 11
- 150000004706 metal oxides Chemical class 0.000 claims description 11
- 239000000919 ceramic Substances 0.000 claims description 9
- 229910000416 bismuth oxide Inorganic materials 0.000 claims description 6
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 claims description 6
- 229910000464 lead oxide Inorganic materials 0.000 claims description 6
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 19
- 229910052709 silver Inorganic materials 0.000 description 18
- 239000004332 silver Substances 0.000 description 18
- 239000011521 glass Substances 0.000 description 14
- 238000000034 method Methods 0.000 description 14
- 229910052573 porcelain Inorganic materials 0.000 description 14
- 229910052802 copper Inorganic materials 0.000 description 11
- 239000010949 copper Substances 0.000 description 11
- 229910000679 solder Inorganic materials 0.000 description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 9
- 239000005388 borosilicate glass Substances 0.000 description 8
- 239000000843 powder Substances 0.000 description 7
- 239000010408 film Substances 0.000 description 6
- 230000005012 migration Effects 0.000 description 6
- 238000013508 migration Methods 0.000 description 6
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 description 5
- 230000007935 neutral effect Effects 0.000 description 5
- 238000007650 screen-printing Methods 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 239000010953 base metal Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000007772 electroless plating Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- HTUMBQDCCIXGCV-UHFFFAOYSA-N lead oxide Chemical compound [O-2].[Pb+2] HTUMBQDCCIXGCV-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 2
- 229910002113 barium titanate Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229920002678 cellulose Polymers 0.000 description 2
- 239000001913 cellulose Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000012808 vapor phase Substances 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000010946 fine silver Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910001923 silver oxide Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
Landscapes
- Conductive Materials (AREA)
- Glass Compositions (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17505881A JPS5879837A (ja) | 1981-10-31 | 1981-10-31 | 磁器コンデンサ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17505881A JPS5879837A (ja) | 1981-10-31 | 1981-10-31 | 磁器コンデンサ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5879837A JPS5879837A (ja) | 1983-05-13 |
| JPS635842B2 true JPS635842B2 (US06826419-20041130-M00005.png) | 1988-02-05 |
Family
ID=15989490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17505881A Granted JPS5879837A (ja) | 1981-10-31 | 1981-10-31 | 磁器コンデンサ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5879837A (US06826419-20041130-M00005.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH054943U (ja) * | 1991-07-09 | 1993-01-26 | エヌデーシー株式会社 | 自動車用シ−トリクライニング装置 |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07118575B2 (ja) * | 1986-03-14 | 1995-12-18 | 株式会社東芝 | 厚膜回路基板とその製造方法 |
| JP4254136B2 (ja) * | 2002-06-04 | 2009-04-15 | 株式会社村田製作所 | 導電性ペーストおよびセラミック電子部品 |
| US20060102228A1 (en) * | 2004-11-12 | 2006-05-18 | Ferro Corporation | Method of making solar cell contacts |
| JP5059042B2 (ja) | 2009-02-25 | 2012-10-24 | 株式会社ノリタケカンパニーリミテド | 太陽電池電極用ペースト組成物 |
| US9799421B2 (en) * | 2013-06-07 | 2017-10-24 | Heraeus Precious Metals North America Conshohocken Llc | Thick print copper pastes for aluminum nitride substrates |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49116594A (US06826419-20041130-M00005.png) * | 1973-03-14 | 1974-11-07 | ||
| JPS51119973A (en) * | 1975-03-25 | 1976-10-20 | Philips Nv | Screen printing paste and thick film electrically conductive array |
| US4072771A (en) * | 1975-11-28 | 1978-02-07 | Bala Electronics Corporation | Copper thick film conductor |
| JPS5349296A (en) * | 1976-10-15 | 1978-05-04 | Du Pont | Metalization composition |
| US4172919A (en) * | 1977-04-22 | 1979-10-30 | E. I. Du Pont De Nemours And Company | Copper conductor compositions containing copper oxide and Bi2 O3 |
| JPS5693396A (en) * | 1979-11-08 | 1981-07-28 | Du Pont | Thick film conductor composition |
-
1981
- 1981-10-31 JP JP17505881A patent/JPS5879837A/ja active Granted
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49116594A (US06826419-20041130-M00005.png) * | 1973-03-14 | 1974-11-07 | ||
| JPS51119973A (en) * | 1975-03-25 | 1976-10-20 | Philips Nv | Screen printing paste and thick film electrically conductive array |
| US4072771A (en) * | 1975-11-28 | 1978-02-07 | Bala Electronics Corporation | Copper thick film conductor |
| JPS5349296A (en) * | 1976-10-15 | 1978-05-04 | Du Pont | Metalization composition |
| US4172919A (en) * | 1977-04-22 | 1979-10-30 | E. I. Du Pont De Nemours And Company | Copper conductor compositions containing copper oxide and Bi2 O3 |
| JPS5693396A (en) * | 1979-11-08 | 1981-07-28 | Du Pont | Thick film conductor composition |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH054943U (ja) * | 1991-07-09 | 1993-01-26 | エヌデーシー株式会社 | 自動車用シ−トリクライニング装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5879837A (ja) | 1983-05-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2001307947A (ja) | 積層チップ部品及びその製造方法 | |
| US4130854A (en) | Borate treated nickel pigment for metallizing ceramics | |
| JP2000048642A (ja) | 導電性ペースト及びガラス回路基板 | |
| JPH0817671A (ja) | 導電性ペースト | |
| JPS635842B2 (US06826419-20041130-M00005.png) | ||
| JPS6310887B2 (US06826419-20041130-M00005.png) | ||
| JPH0423308A (ja) | セラミックコンデンサ | |
| JPH0616461B2 (ja) | チップ型積層磁器コンデンサ | |
| JP3257036B2 (ja) | チップ型電子部品用導電性ペースト | |
| JPH0136243B2 (US06826419-20041130-M00005.png) | ||
| US4168519A (en) | Capacitor with tin-zinc electrodes | |
| JP2973558B2 (ja) | チップ型電子部品用導電性ペースト | |
| JPH0834168B2 (ja) | セラミックコンデンサ端子電極用導電性組成物 | |
| JP3291831B2 (ja) | チップ型電子部品用導電性ペースト | |
| JPS6127003A (ja) | 導電性ペ−スト組成物 | |
| JPH0817140B2 (ja) | セラミックコンデンサ端子電極用導電性組成物 | |
| JPH08153414A (ja) | 導電ペースト | |
| JPH08138969A (ja) | 電子部品の製造方法 | |
| JP2996016B2 (ja) | チップ型電子部品の外部電極 | |
| JPH0440803B2 (US06826419-20041130-M00005.png) | ||
| JPS634327B2 (US06826419-20041130-M00005.png) | ||
| JP2968316B2 (ja) | 積層型セラミックコンデンサ | |
| JP2996015B2 (ja) | チップ型電子部品の外部電極 | |
| JPH0652721A (ja) | 導電体 | |
| JP2000260654A (ja) | 極小チップ型電子部品 |
