JPS6358397B2 - - Google Patents
Info
- Publication number
- JPS6358397B2 JPS6358397B2 JP15579281A JP15579281A JPS6358397B2 JP S6358397 B2 JPS6358397 B2 JP S6358397B2 JP 15579281 A JP15579281 A JP 15579281A JP 15579281 A JP15579281 A JP 15579281A JP S6358397 B2 JPS6358397 B2 JP S6358397B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- printed circuit
- circuit board
- jig
- plating jig
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 31
- 238000009713 electroplating Methods 0.000 claims description 14
- 238000007772 electroless plating Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 7
- 239000006223 plastic coating Substances 0.000 claims description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 210000000078 claw Anatomy 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Chemically Coating (AREA)
Description
【発明の詳細な説明】
本発明はプリント基板のめつき方法に係り、詳
しくはプリント基板を保持しためつき用治具に不
要な電気めつきができるだけ施されないようにし
たプリント基板のめつき方法に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for plating printed circuit boards, and more specifically, a method for plating printed circuit boards in which unnecessary electroplating is avoided as much as possible on a plating jig that holds a printed circuit board. It is related to.
プリント基板の製造に於いて、プリント基板に
無電解めつき及び電気めつきを施す際、プリント
基板を同じめつき用治具（通称ラツク）に保持し
たまま行うことをワンラツクシステムという。 In the production of printed circuit boards, electroless plating and electroplating are performed on printed circuit boards while the printed circuit boards are held in the same plating jig (commonly known as a rack), which is called a one-rack system.
ところで前記めつき用治具は、ステンレス系統
の素材を用いて製作されているものが多く、この
ステンレス系の素材から成るめつき用治具にプリ
ント基板を保持して、無電解めつきの前処理、無
電解めつき及び電解めつきを連続的に行うと、め
つき用治具にまで電気めつきされてしまうもので
ある。 By the way, most of the plating jigs mentioned above are manufactured using stainless steel materials, and the printed circuit board is held in the plating jig made of stainless steel material, and pretreatment for electroless plating is carried out. If electroless plating and electrolytic plating are performed continuously, even the plating jig will be electroplated.
この為繰返し使用するめつき用治具は、その都
度電気めつきされた金属を剥離しなければならな
いので甚だ面倒で、プリント基板の生産性向上の
溢路となつている。まためつき用治具にまで電気
めつきが施されるので、めつき時に消費される電
気量が必要以上に多くなり、しかもめつき用治具
を繰返し使用の度毎に電気めつきされた金属の剥
離を行うには薬品等が必要である為にプリント基
板の生産コストの増大を余儀なくされるものであ
る。 For this reason, the plating jig that is used repeatedly is extremely troublesome because the electroplated metal must be peeled off each time, and this has become an overflow in improving the productivity of printed circuit boards. In addition, since electroplating is applied to the plating jig, the amount of electricity consumed during plating increases more than necessary, and moreover, the plating jig is electroplated every time it is used repeatedly. Since chemicals and the like are required to remove the metal, the production cost of printed circuit boards inevitably increases.
本発明はかかる問題点を解決すべくなされたも
ので、プリント基板を保持しためつき用治具がプ
リント基板に無電解めつきの前処理−無電解めつ
き−電解めつきを行つてもめつき用治具に施され
る電気めつきを大幅に減少するようにしたプリン
ト基板のめつき方法を提供せんとするものであ
る。 The present invention has been made in order to solve such problems, and the plating jig that holds the printed circuit board performs electroless plating pretreatment, electroless plating, and electrolytic plating on the printed circuit board. It is an object of the present invention to provide a method for plating printed circuit boards in which the amount of electroplating applied to a jig is significantly reduced.
以下本発明によるプリント基板のめつき方法の
一実施例を図によつて説明する。第１図に示す如
く上端を逆Ｕ字状に曲成した左右両側のロツド１
間に上中下３本の水平材２を張架結合し、各水平
材２の相対向する面の左右方向に等間隔に爪３を
複数本設けたステンレス鋼より成るめつき用治具
４の表面に、第２図に示す如く塩化ビニール、ポ
リエチレン等のプラスチツクスコーテイング５を
施す。次にこのめつき用治具４の最も良く電気め
つきされそうな左右両側のロツド１の各水平材２
間の上下位置に第３図に示す如くマスキングテー
プ６を巻き付ける。次いで第４図に示す如くめつ
き用治具４の各水平材２の相対向する爪３の間に
プリント基板７を保持する。次にめつき用治具４
もろともに無電解めつきの前処理を行つた後第５
図に示す如く銅又はニツケルの無電解めつき８を
施し、次いで第６図に示す如くめつき用治具４の
左右両側のロツド１からマスキングテープ６を剥
離して除去し、プラスチツクスコーテイング５を
露出する。然る後プリント基板７に第７図に示す
如く銅、ニツケル、クローム、半田等のいずれか
の電解めつき９を施す。この電解めつきの際、め
つき用治具４の左右のロツド１は、プラスチツク
スコーテイング５が露出している部分が導通を切
断しているので、この部分及び各水平材２間に於
けるロツド１の外周には電解めつきが施されず、
プリント基板７を係止している爪３、水平材２及
び水平材２が結合されている部分のロツド１の外
周の僅かな部分にしか電解めつき９が施されな
い。 An embodiment of the printed circuit board plating method according to the present invention will be described below with reference to the drawings. As shown in Figure 1, the rods 1 on both the left and right sides have their upper ends bent into an inverted U shape.
A plating jig 4 made of stainless steel, in which three horizontal members 2, top, middle, and bottom, are strung together in between, and a plurality of claws 3 are provided at equal intervals in the left-right direction on the opposing surfaces of each horizontal member 2. A plastic coating 5 made of vinyl chloride, polyethylene, etc. is applied to the surface of the substrate as shown in FIG. Next, each horizontal member 2 of the rod 1 on both the left and right sides of this plating jig 4 that is most likely to be electroplated.
Masking tape 6 is wrapped around the upper and lower positions in between as shown in FIG. Next, as shown in FIG. 4, the printed circuit board 7 is held between the opposing claws 3 of each horizontal member 2 of the plating jig 4. Next, plating jig 4
After pre-treatment for electroless plating, the fifth
As shown in the figure, electroless plating 8 of copper or nickel is applied, and then, as shown in FIG. to expose. Thereafter, the printed circuit board 7 is electrolytically plated 9 with copper, nickel, chrome, solder, etc., as shown in FIG. During this electrolytic plating, the conductivity of the left and right rods 1 of the plating jig 4 is broken at the exposed part of the plastic coating 5, so the rods 1 at this part and between each horizontal member 2 are disconnected. Electrolytic plating is not applied to the outer periphery of 1,
Electrolytic plating 9 is applied only to a small portion of the outer periphery of the rod 1 where the claws 3 that hold the printed circuit board 7, the horizontal member 2, and the horizontal member 2 are connected.
以上の如く本発明のプリント基板のめつき方法
によれば、プリント基板に電解めつきを施した
際、めつき用治具４に施される電解めつきが大幅
に減少するので、繰返し使用の度毎にめつき用治
具４から剥離する電気めつきされた金属の量が極
めて少なく、短時間に簡単に剥離できて、プリン
ト基板７の生産性の向上に寄与できる。まためつ
き用治具４に施される電気めつきが大幅に減少す
ることにより、プリント基板７のめつき時に消費
される電気量を減少することができ、しかもめつ
き用治具４の繰返し使用の度毎に電気めつきされ
た金属の剥離に使用される薬品も大幅に減少する
ので、プリント基板の生産コストの低減に寄与で
きる等の効果を奏する。 As described above, according to the printed circuit board plating method of the present invention, when electrolytic plating is applied to a printed circuit board, the electrolytic plating applied to the plating jig 4 is significantly reduced, so that repeated use is possible. The amount of electroplated metal that peels off from the plating jig 4 each time is extremely small, and can be easily peeled off in a short time, contributing to improved productivity of the printed circuit board 7. Furthermore, by significantly reducing the amount of electroplating applied to the plating jig 4, the amount of electricity consumed when plating the printed circuit board 7 can be reduced, and moreover, the plating jig 4 can be used repeatedly. Since the amount of chemicals used to peel off electroplated metal each time it is used is also significantly reduced, it can contribute to reducing the production cost of printed circuit boards.
第１図乃至第７図は本発明によるプリント基板
のめつき方法の工程を示す斜視図である。
１……ロツド、２……水平材、３……爪、４…
…めつき用治具、５……プラスチツクスコーテイ
ング、６……マスキングテープ、７……プリント
基板、８……無電解めつき、９……電解めつき。
1 to 7 are perspective views showing the steps of the printed circuit board plating method according to the present invention. 1... Rod, 2... Horizontal material, 3... Claw, 4...
...Plating jig, 5...Plastic coating, 6...Masking tape, 7...Printed circuit board, 8...Electroless plating, 9...Electrolytic plating.
Claims (1)
スコーテイングを施し、次にその上に必要な個所
のみテープを巻いて該めつき用治具に保持したプ
リント基板に無電解めつきを施し、次いでそのめ
つき用治具からテープを除去し該部分の導通を切
断してプリント基板に電解めつきを施すことを特
徴とするプリント基板のめつき方法。1 Apply plastic coating to a plating jig for a printed circuit board, then wrap tape only in the necessary areas and apply electroless plating to the printed circuit board held in the plating jig. A method for plating a printed circuit board, which comprises removing the tape from a plating jig, cutting the conduction at the part, and applying electrolytic plating to the printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15579281A JPS5874095A (en) | 1981-09-30 | 1981-09-30 | Method of plating printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15579281A JPS5874095A (en) | 1981-09-30 | 1981-09-30 | Method of plating printed board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5874095A JPS5874095A (en) | 1983-05-04 |
| JPS6358397B2 true JPS6358397B2 (en) | 1988-11-15 |
Family
ID=15613527
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15579281A Granted JPS5874095A (en) | 1981-09-30 | 1981-09-30 | Method of plating printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5874095A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0212792U (en) * | 1988-07-08 | 1990-01-26 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6223196A (en) * | 1985-07-23 | 1987-01-31 | 株式会社 丸五技研 | Through hole plating method and automatic plating apparatus for printed wiring board |
| JP5339403B2 (en) * | 2008-03-24 | 2013-11-13 | 株式会社イースタン | Electroplating jig |
-
1981
- 1981-09-30 JP JP15579281A patent/JPS5874095A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0212792U (en) * | 1988-07-08 | 1990-01-26 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5874095A (en) | 1983-05-04 |
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