JP5339403B2 - Electroplating jig - Google Patents

Description

  The present invention relates to an electroplating jig, and more specifically, when an electroplating is performed on a substrate on which through holes and vias are formed, and the through holes and vias are filled with a plating metal, the current for electroplating. The present invention relates to an electroplating jig that holds the substrate in a state in which an electrode for supplying power is connected and is immersed in an electroplating bath containing a plating accelerator.

When manufacturing a substrate used for a semiconductor device or the like, electrolytic plating is performed on the substrate in order to form various patterns on the substrate. During the electrolytic plating, an electrolytic plating jig that holds the substrate and is immersed in an electrolytic plating bath is used.
As such an electroplating jig, the following Patent Document 1 proposes an electroplating jig shown in FIG.
In the electrolytic plating jig shown in FIG. 7, a substrate 120 is provided at a predetermined position of a frame body formed of plastic rod-like bodies 100a and 100a and rod-like bodies 100b and 100b provided orthogonal to the rod-like bodies 100a and 100a. Are provided for positioning pins 102, 102,.
Further, each of the rod-shaped bodies 100a, 100a is provided with a shielding member 106 that can be opened and closed with respect to one surface side of the rod-shaped bodies 100a, 100a by hinges 104, 104. In this shielding member 106, a narrow shielding plate 106 b is attached to a rod-like body 106 a provided on each of the rod-like bodies 100 a, 100 a via hinges 104, 104. A large number of through holes 106c, 106c,... Are formed in the shielding plate 106b.
Such a shielding plate 106b is also attached to the other surface side of the rod-like bodies 100a and 100a.

Further, when the rod-like bodies 106a, 106a are overlapped on one surface side of the rod-like bodies 100a, 100a, the respective surfaces of the rod-like bodies 100a, 100a, 106a, 106a which are opposite surfaces are connected to the lead wires 110, 110. The electrodes 108, 108,... Are provided alternately.
As shown in FIG. 7, the mounting of the substrate 120 on the electrolytic plating jig is performed by placing the substrate 120 on the rod-like bodies 106a and 106a with the shielding members 106 and 106 of the electrolytic plating jig opened. Then, after positioning by the pins 102, 102,..., The rods 106a, 106a are stacked on the rods 100a, 100a and the clips 112, 112,. .
At this time, the electrodes 108, 108,... Provided on each surface of the rod-shaped bodies 100a, 100a, 106a, 106a abut against the substrate 120, and the lead wires 110, 110 and the substrate 120 are electrically connected. The shielding members 106 and 106 are positions that cover the upper side of the substrate 100.
JP2002-161398

The electroplating jig shown in FIG. 8 equipped with the substrate 120 is immersed in an electroplating bath to perform electroplating on the substrate 120. At that time, the current density is concentrated in the edge portion which is a corner portion of the substrate 120 than in the central portion of the substrate 120, but the electrolytic plating solution enters and exits the shielding members 106 and 106 at the edge portion of the substrate 120. Limited by. For this reason, it is possible to suppress the plating metal from being deposited on the edge portion of the substrate 120 and to form a plating metal layer having a uniform thickness on the entire surface of the substrate 120.
By the way, when the plated metal is filled in the through holes and vias formed in the substrate 120 by electrolytic plating, usually, bis (3-sulfopropyl) disulfide [[Bis (3-sulfopropyl) disulfid] (SPS) or the like. An electroplating bath for fill to which a plating accelerator is added is used.
In electrolytic plating using such an electrolytic plating bath for filling, needle-like burrs are likely to be formed on the peripheral surface of the substrate 120, and dust and the like are likely to be caused in a post-processing step of the substrate 120.
Therefore, the present invention solves the problems of conventional electrolytic plating jigs in which acicular burrs are likely to occur on the peripheral surface of a substrate when electrolytic plating is performed in an electrolytic plating bath for a fill to which a plating accelerator is added. The present invention also provides an electrolytic plating jig in which needle-like burrs are hardly generated on the peripheral surface of a substrate even when electrolytic plating is performed in an electrolytic plating bath for fill.

In order to solve the above-mentioned problems, the present inventors first made the entire peripheral surface of the substrate 120 an insulator such as rubber so that the peripheral surface of the substrate 120 is not exposed and does not directly contact the electrolytic plating. As a result of trying to contact, even when the electrolytic plating jig was immersed in the electrolytic plating bath for filling and electrolytic plating was performed, no acicular burrs were formed on the peripheral surface of the substrate 120.
However, it has been found that it is not easy to take out the substrate 120 from the electrolytic plating jig after the electrolytic plating is completed, and there is a possibility that the substrate 120 may be deformed when the substrate 120 is taken out.
For this reason, as a result of further investigations, the present inventors have conducted electrolytic plating by immersing in the electrolytic plating solution for filling even if a slight gap is formed between the peripheral surface of the substrate 120 and the insulator. When applied, it was found that needle-like burrs were hardly formed on the peripheral surface of the substrate 120, and the present invention was achieved.

That is, according to the present invention, when the substrate (10) on which through holes and vias are formed is subjected to electrolytic plating, and the through holes and vias are filled with plating metal, the electrodes for supplying current for the electrolytic plating ( 26) is a jig for electrolytic plating that holds the substrate (10) in a connected state and is immersed in an electrolytic plating bath containing a plating accelerator, and the jig for electrolytic plating is the substrate (10). ) Plastic left and right rod-like bodies (12, 12) and rod-like bodies (14, 14) perpendicular to the same are arranged in a rectangular shape so as to surround the peripheral surface, and hinges (16, 16) at least on both sides of the substrate (10). ) Through a pair of rod-like bodies (12, 20) that can be opened and closed, and a pair of rod-like bodies (12, 20) that can be opened and closed. ) Opposite The electrodes (26, 26) that are alternately provided and are capable of supplying power by contacting the both surfaces of the substrate (10) by superimposing the rod-like bodies (12, 20) at positions facing each other; A pair of insulators (30, 30) sandwiched between opposing surfaces of a pair of rod bodies (12, 20) provided so as to be opposed to both peripheral surfaces of the substrate (10), By overlapping the pair of rod-like bodies (12, 20) provided to be openable and closable so as to face each other, the pair of orthogonal rod-like bodies (14, 14) opposed to the peripheral surfaces of the substrate (10) and the above-mentioned A gap having a width of 6 mm or less is formed between the insulator (30, 30) and the rod-like body (14, 14) surrounded by the pair of insulators (30, 30) and facing the peripheral surface of the substrate (10). The substrate (10) is formed and the rectangular frame is formed Characterized in that it is gripped.
In the present invention, the gap is preferably a gap having a width of 2 mm or less, which can further suppress the occurrence of acicular burrs on the peripheral surface of the substrate.
In addition, the insulator is arranged so that the substrate (10) is positioned at the center of the corresponding surface of the widest insulator among the corresponding surfaces of the insulator corresponding to the peripheral surface of the substrate (10). By being provided, the thickness of the plated metal layer formed on both sides of the substrate can be made uniform.
In addition, the pair of rods provided with shielding plates (22, 22) that cover the peripheral edges exposed on both surfaces of the substrate (10) held by the rectangular frame in a rectangular frame shape so as to be opened and closed. You may each be provided in the opposite surface side with respect to the opposing surface of a body (12, 20).

In the electroplating jig according to the present invention, an insulator is disposed over the entire peripheral surface of the substrate, and between the at least part of the peripheral surface of the peripheral surface of the substrate and the end surface of the insulator, A gap having a width capable of suppressing the occurrence of acicular burrs made of plated metal is formed on the peripheral surface.
For this reason, even when the substrate held by the electrolytic plating jig is immersed in an electrolytic plating bath for filling and electrolytic plating is performed, the occurrence of needle-like burrs on the peripheral surface of the substrate can be suppressed. For this reason, the generation of dust or the like due to the needle-like burrs formed on the peripheral surface of the substrate can be prevented, and a gap is formed between at least a part of the peripheral surface of the peripheral surface of the substrate and the end surface of the insulator. Therefore, even when the substrate is taken out after the electrolytic plating is completed, it can be easily taken out without deforming the substrate.

An example of a jig for electrolytic plating according to the present invention is shown in FIG. In the electroplating jig shown in FIG. 1, a frame body is formed that includes left and right rod-shaped bodies 12, 12 made of plastic and rod-shaped bodies 14, 14 orthogonal to the rod-shaped bodies 12, 12.
Each of the rod-like bodies 12 and 12 is provided with a shielding member 18 that can be opened and closed with respect to one surface side of the rod-like bodies 12 and 12 by stainless hinges 16 and 16. In this shielding member 18, a strip-shaped shielding plate 22 is attached to a rod-like body 20 provided on each of the rod-like bodies 12, 12 via hinges 16, 16. The shield plate 22 has a plurality of through holes 22a, 22a,. The through holes 22a, 22a,... Can be formed in an arbitrary shape. Such a shielding plate 22 is also attached to the other side of the rod-like bodies 12 and 12.
Further, when the rod-like bodies 20, 20 are stacked on one surface side of the rod-like bodies 12, 12, the electrodes 26, 26 connected to the lead wires 24, 24 are provided on the respective surfaces of the rod-like bodies 12, 20 as opposed surfaces.・ ・ Are provided alternately. In order to correspond to the electrodes 26, 26,..., Rubber members 28, 28,.
Further, the frame 32 on which the substrate 10 is gripped is provided with a hook 32, and the electrolytic plating jig can be used in and out of the electrolytic plating bath.

The plastic rods 14 and 14 constituting the electrolytic plating jig shown in FIG. 1 are insulators corresponding to the peripheral surfaces of the two sides of the rectangular substrate 10. Further, the narrow insulator 30 provided on one surface side of the rod-like bodies 12 and 12 corresponds to the peripheral surfaces of the other two sides of the substrate 10. As shown in FIG. 2, which is a cross-sectional view of the electroplating jig shown in FIG. 1, the insulator 30 is provided with the tip portion protruding from one surface side of the rod-like bodies 12, 12.
For this reason, when the one surface side of the rod-shaped bodies 20 and 20 is overlapped with the one surface side of the rod-shaped bodies 12 and 12 by the hinges 16 and 16, the distal end portion of the insulator 30 protruding from the one surface side of the rod-shaped bodies 12 and 12 is inserted. As described above, a concave groove 20a is formed on one surface side of the rod-like bodies 20 and 20.
In the electrolytic plating jig shown in FIGS. 1 and 2, the substrate 10 is positioned by the plastic rod-like bodies 14, 14 and the tip of the insulator 30 protruding from one surface side of the rod-like bodies 12, 12. Is called.
When the one surface side of the rod-shaped bodies 20 and 20 are overlapped with the one surface side of the rod-shaped bodies 12 and 12, the electrodes 26, 26,. In contact with each other, the lead wire 24 and the substrate 10 are electrically connected.

In the electrolytic plating jig shown in FIGS. 1 and 2, the electrolytic plating jig is provided between at least one circumferential surface of the rectangular substrate 10 and the end surfaces of the rod-like bodies 14 and 14 and the insulators 30 and 30. When the substrate 10 held by the tool is immersed in an electrolytic plating bath for filling and the lead wire 24 is subjected to electrolytic plating by applying a direct current, the width of the peripheral surface of the substrate 10 can suppress the occurrence of needle-like burrs. It is important that a gap is formed.
Here, in the electrolytic plating jig in which the entire peripheral surface of the square substrate 10 is in contact with the end surfaces of the rod-like bodies 14 and 14 and the insulators 30 and 30, the substrate 10 held by the electrolytic plating jig is electroplated for filling. When electrolytic plating is performed by immersion in a bath, the generation of needle-like burrs on the peripheral surface of the substrate 10 can be suppressed. However, it is difficult to remove the substrate 10 from the electrolytic plating jig after completion of electrolytic plating.
On the other hand, when electrolytic plating is performed by dipping in the electrolytic plating bath for fill between the peripheral surface of the substrate 10 and the end surfaces of the rod-like bodies 14 and 14 and the insulators 30 and 30, needles are attached to the peripheral surface of the substrate 10. In the electroplating jig in which a gap in which burrs are likely to occur is formed, the substrate 10 can be easily taken out after the end of the electroplating, but needle-like burrs are formed on the peripheral surface of the substrate 10.
The gap formed between the peripheral surface of the substrate 10 and the end faces of the rod-like bodies 14 and 14 and the insulators 30 and 30 is preferably a gap having a width of 6 mm or less, particularly 2 mm or less. When the width exceeds 6 mm, acicular burrs tend to be easily formed on the peripheral surface of the substrate 10 after the completion of the electrolytic plating.

Thus, in the electrolytic plating jig shown in FIG. 1 in which a gap having a predetermined width is formed and positioned on at least a part of the peripheral surface of the substrate 10, as shown in FIGS. 3 (a) and 3 (b), The rod-like bodies 20, 20 are stacked on the rod-like bodies 12, 12, and the clips 34, 34,... Are attached to hold the substrate 10 at a predetermined position. At this time, the shielding plates 22, 22 attached to the rod-like bodies 20, 20 are positions that cover both ends of the substrate 10 and the vicinity thereof.
The electrolytic plating jig shown in FIGS. 3A and 3B that holds the substrate 10 is immersed in a fill electrolytic plating bath to which a plating accelerator such as SPS is added, and is subjected to electrolytic plating to the substrate 10. The formed through hole or via is filled with plating metal.
At that time, the current density is concentrated in the edge portion which becomes the corner portion of the substrate 10 than in the central portion of the substrate 10, but the electrolytic plating solution enters and leaves the shielding plates 22 and 22 in the edge portion of the substrate 10. Limited by. For this reason, precipitation of the plating metal in the edge part of the board | substrate 10 can be suppressed, and the plating metal layer of uniform thickness can be formed in the whole surface of the board | substrate 10. FIG.

Here, as shown in FIG. 2, of the corresponding surfaces of the rod-shaped bodies 14 and 14 and the insulators 30 and 30 corresponding to the peripheral surface of the substrate 10, It is preferable to arrange the rod-like bodies 14 and 14 so that the substrate 10 is located in the center. Thus, when the substrate 10 is held by the electrolytic plating jig in which the rod-like bodies 14 and 14 are disposed and the electrolytic plating is performed, the amount of the electrolytic plating solution entering and exiting the both sides of the substrate 10 can be made equal. The thickness of the plated metal layer formed on the both sides of 10 can be made uniform.
In the above-described electrolytic plating jig, the rectangular substrate 10 is gripped, but the present invention can of course be applied to an electrolytic plating jig that grips a circular substrate.

In the electrolytic plating jig shown in FIG. 1, the rectangular substrate 10 is positioned and held by the rod-like bodies 14 and 14 and the insulators 30 and 30 and immersed in an electrolytic plating bath for fill having the composition shown in Table 1 below. Electrolytic plating was performed.
When the substrate 10 was positioned, a gap having a maximum width of 2 mm was formed between the peripheral surface of the substrate 10 and the end surfaces of the rod-like bodies 14 and 14 and the insulators 30 and 30.

After the electrolytic plating was completed, the substrate 10 could be easily taken out from the electrolytic plating jig.
Further, although some needle-like burrs are formed on the peripheral surface of the substrate 10 as in the photomicrograph shown in FIG. 4, the degree thereof is extremely small and does not cause any problem.

In Example 1, when the substrate 10 was positioned, a gap having a maximum width of 6 mm was formed between the peripheral surface of the substrate 10 and the end surfaces of the rod-like bodies 14 and 14 and the insulators 30 and 30. Electrolytic plating was performed in the same manner as in 1.
After the electrolytic plating was completed, the substrate 10 could be easily taken out from the electrolytic plating jig.
Further, as shown in the micrograph shown in FIG. 5, more needle-like burrs were formed on the peripheral surface of the substrate 10 than in the case shown in FIG. 4, but it was within an allowable range.

Comparative example

In Example 1, when the substrate 10 was positioned, a gap having a maximum width of 10 mm was formed between the peripheral surface of the substrate 10 and the end surfaces of the rod-like bodies 14 and 14 and the insulators 30 and 30. Electrolytic plating was performed in the same manner as in 1.
After the electrolytic plating was completed, the substrate 10 could be easily taken out from the electrolytic plating jig.
However, many acicular burrs were formed on the peripheral surface of the substrate 10 as compared with the peripheral surface of the substrate 10 shown in FIGS.

It is a front view explaining an example of the jig for electroplating concerning the present invention. It is a cross-sectional view of the jig for electrolytic plating shown in FIG. FIG. 3 is a front view [FIG. 3A] and a side view [FIG. 3B] in a state in which the shielding plates 22 of the electrolytic plating jig shown in FIG. 1 are closed. The electrolytic plating jig shown in FIG. 1 is gripped by forming a gap having a maximum width of 2 mm between the peripheral surface of the substrate 10 and the end surfaces of the rod-like bodies 14 and 14 and the insulators 30 and 30. It is a microscope picture explaining the grade of the acicular burr | flash formed in the surrounding surface of the board | substrate which gave plating. The electrolytic plating jig shown in FIG. 1 is gripped by forming a gap having a maximum width of 6 mm between the peripheral surface of the substrate 10 and the end surfaces of the rod-like bodies 14 and 14 and the insulators 30 and 30. It is a microscope picture explaining the grade of the acicular burr | flash formed in the surrounding surface of the board | substrate which gave plating. The electrolytic plating jig shown in FIG. 1 is gripped by forming a gap having a maximum width of 10 mm between the peripheral surface of the substrate 10 and the end surfaces of the rod-like bodies 14 and 14 and the insulators 30 and 30. It is a microscope picture explaining the grade of the acicular burr | flash formed in the surrounding surface of the board | substrate which gave plating. It is a front view explaining the conventional jig for electrolytic plating. It is a front view of the state which closed the shielding plates 106b and 106b of the jig for electrolytic plating shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Board | substrate 12, 14, 20 Rod-shaped body 16 Hinge 18 Shield member 20a Groove 22 Shield plate 22a Through hole 24 Lead wire 26 Electrode 28 Rubber member 30 Insulator 32 Hook 34 Clip

Claims (4)

The electrode (26) for supplying the current for electrolytic plating was connected when electrolytic plating was performed on the substrate (10) on which the through holes and vias were formed and the through holes and vias were filled with plating metal. An electrolytic plating jig that holds the substrate (10) in a state and is immersed in an electrolytic plating bath containing a plating accelerator,
In the electrolytic plating jig, plastic left and right rod-like bodies (12, 12) and rod-like bodies (14, 14) orthogonal to the rectangular shape are disposed so as to surround the peripheral surface of the substrate (10), and at least the A rectangular frame for gripping both surfaces of the substrate (10) by a pair of rod-like bodies (12, 20) provided on both sides of the substrate (10) via hinges (16, 16);
The substrate (10) of the substrate (10) is provided by being alternately provided on opposing surfaces of the pair of rod-like bodies (12, 20) provided so as to be openable and closable at positions facing each other. Electrodes (26, 26) capable of supplying power by abutting on both surfaces;
A pair of insulators (30, 30) sandwiched between opposing surfaces of the pair of rod-like bodies (12, 20) provided so as to be openable and closable and opposed to both peripheral surfaces of the substrate (10). And
By overlapping the pair of rod-like bodies (12, 20) provided to be openable and closable so as to face each other, the pair of orthogonal rod-like bodies (14, 14) opposed to the peripheral surfaces of the substrate (10) and the above-mentioned A gap having a width of 6 mm or less is formed between the insulator (30, 30) and the rod-like body (14, 14) surrounded by the pair of insulators (30, 30) and facing the peripheral surface of the substrate (10). An electroplating jig, wherein the substrate (10) is formed and held by the rectangular frame.   The jig for electrolytic plating according to claim 1, wherein the gap is a gap having a width of 2 mm or less.   Of the corresponding surfaces of the insulator corresponding to the peripheral surface of the substrate (10), the insulator is disposed so that the substrate (10) is positioned at the center of the corresponding surface of the insulator formed to be widest. The jig for electrolytic plating according to claim 1 or 2.   A pair of rod-shaped bodies (22, 22) provided with shielding plates (22, 22) that cover the peripheral edges exposed on both surfaces of the substrate (10) held by the rectangular frame body in a rectangular frame shape so as to be openable and closable ( The jig for electroplating according to any one of claims 1 to 3, wherein the jig is provided on a side opposite to the facing surface of (12, 20).