JP6210298B2 - Plating substrate holder - Google Patents

Description

  The present invention relates to an improvement of a substrate holder for plating mainly used in a carrier and pusher type plating apparatus. Specifically, the present invention is characterized by an improvement in the clamp member of the plating substrate holder.

  Conventionally, there has been a substrate holder for plating of a type in which a substrate holding frame and a substrate pressing plate are attached with a double door and a substrate is held by closing both members. In this type of plating substrate holder, a substantially U-shaped clamp member for clamping the substrate holding frame and the substrate pressing plate in a closed state is used in order to ensure the holding of the substrate. .

  However, this type of conventional clamping member directly clamps the substrate holding frame and the substrate pressing plate between the upper side plate portion and the lower side plate portion constituting the mouth portion by the elasticity of the clamp member. In addition, as shown in Patent Document 1, the mouth of the clamp member is brought into contact with the outside of both the substrate holding frame and the substrate pressing plate in the closed state, and the clamp is pushed in the direction in which the substrate is held. Open the mouth of the member using elasticity, insert it so that the substrate holding frame and the substrate pressing plate are positioned inside the clamp member, and sandwich both members between the upper and lower side plate portions of the clamp member It was clamped in shape.

  Thus, when the clamp member is pushed toward the side of the substrate held from the outside direction of the substrate holding frame and the substrate pressing plate, the clamping member gives a force toward the substrate direction to the substrate pressing plate. Met. As a result, the substrate sandwiched between the two members has been subjected to a force inward from the outside. In addition, since the substrate held by this type of plating substrate holder is extremely thin, it has been difficult to prevent generation of wrinkles, sagging, deformation, and the like of the substrate due to the mounting of the clamp member.

Japanese Patent No. 4730489

  In the first invention, the clamp member does not apply a force from the outside to the inside of the two members when mounting the substrate holding frame and the substrate pressing plate in the closed state. As a result of only the pressing force from the orthogonal direction, the thin substrate held between the substrate holding frame and the substrate pressing plate is not pushed inward from both sides. It is an object of the present invention to provide a plating substrate holder that does not cause wrinkles, sagging, or deformation.

  In the second invention, the thin substrate between the substrate holding frame and the substrate pressing plate is held by being pulled outward on both sides, so that the substrate holding for plating that is free from wrinkles, sagging, deformation, etc. to the substrate is achieved. The purpose is to provide ingredients.

In order to solve the above problem, the first invention employs the following means for the plating substrate holder. First, the substrate holding frame and a substrate holding plate attached to both sides of the substrate holding frame are closed, and the substrate is held, specifically, a plating substrate holder for holding the substrate.
Secondly, the substrate for plating used by clamping the substrate holding frame and the substrate pressing plate by attaching a substantially U-shaped clamp member from the outside of the substrate holding frame and the substrate pressing plate in the closed state. Use as a holder.
Third, the clamp member includes a clamp frame having a substantially U-shaped mouth portion and a clamp lever pivotally attached to the clamp frame.
Fourth, the distance between the inner side surface of the lower side plate portion that is a contact surface with the substrate holding frame in the clamp frame and the inner side surface of the upper side plate portion is that of the substrate holder for plating in a state where the substrate is held. A passage window of the clamp lever is opened in the upper side plate portion of the clamp frame.
Fifth, by operating the clamp lever, the substrate pressing plate is pressed in the direction orthogonal to the substrate holding frame through the passage window, and both members are clamped.

  In the second invention, the clamp surface of the clamp lever in the first invention is an inclined surface having an inclination for inclining the clamp lever in a direction opposite to the substrate held by the substrate holder for plating. Is added.

In the third invention, the following means is added to the plating substrate holder in the first invention.
First, the rubber mask includes a flat plate contact that feeds power to the substrate as a power feeding portion on at least one of the substrate holding surfaces of the substrate holding frame and the substrate pressing plate, and a rubber mask that surrounds the flat plate contact. It is formed at a height that does not hinder contact with the substrate and is in contact with the substrate with the substrate sandwiched therebetween.
Second, a pressing rubber mask having a width covering the flat plate contact point is provided on the substrate holding surface opposite to the power feeding unit.

  According to the present invention, when the clamp member is mounted on the substrate holding frame and the substrate pressing plate in the closed state, the clamp member does not apply a pressing force to the members from the outside to the inside, and both members are used at the time of clamping. The thin substrate held between the substrate holding frame and the substrate pressing plate is prevented from being pushed inward from both sides by being made only by the pressing force from the direction orthogonal to the substrate. Even if it was a board | substrate, it became the board | substrate holder for plating which does not raise | generate a wrinkle, sagging, a deformation | transformation, etc.

  Although it is an effect of the second invention, the clamp surface of the clamp lever is an inclined surface that descends in a direction opposite to the substrate held by the plating substrate holder, that is, an inclination that inclines the clamp lever in the direction opposite to the substrate. By using the inclined surface having the clamp surface, the clamp surface pulls the left and right substrate pressing plates in the direction opposite to the substrate mounting direction by the clamping force. As a result, the substrate itself was pulled outward on both sides, and the substrate holder for plating did not cause wrinkling, sagging, or deformation of the substrate when the substrate was held.

  The effect of the third invention will be described. The present invention provides a plating mask in which a rubber mask surrounding a flat plate contact for supplying power to the substrate is formed on the substrate holding surface, and a holding rubber mask having a width covering the flat plate contact is provided on the substrate holding surface opposite to the power feeding portion. The present invention relates to a substrate holder. In this type of plating substrate holder, when clamping the substrate holding frame and the substrate pressing plate with a conventional clamp member, the conventional clamp member gives a pressing force from the outside to the inside of both members, In some cases, the substrate pressing plate may move inward, and the rubber mask and the pressing rubber mask may be displaced.

  However, as in the third invention, even in the case of a plating substrate holder using this type of rubber mask, the clamp member does not apply a pressing force from the outside to the inside on both members, and the clamp frame of the clamp member The clamp surface of the clamp lever pivotally attached to the substrate pressed and clamped the substrate holding frame and the substrate pressing plate in a direction orthogonal to each other, thereby preventing the positional displacement between the rubber mask and the pressing rubber mask. As a result, in the plating process, it was possible to reduce the possibility that the plating solution entered between the flat plate contact and the substrate to cause precipitation, thereby improving the life of the plating substrate holder.

It is explanatory drawing which shows the state before the clamp of the clamp member in one Example of this invention, (A) is a horizontal state explanatory drawing, (B) is the side explanatory drawing. It is explanatory drawing which shows the state at the time of the same clamp start, (A) is horizontal state explanatory drawing, (B) is the side explanatory drawing. It is explanatory drawing which shows the state at the time of the completion of the clamp, (A) is a horizontal state explanatory drawing, (B) is the side explanatory drawing. It is explanatory drawing of the open state before bending of the clamp frame in an Example. It is explanatory drawing which shows a clamp lever, (A) is a front view, (B) is a rear view, (C) is a top view, (D) is a side view. It is front explanatory drawing which shows the usage method of a clamp member, (A) shows the state which the clamp member before a clamp rotates to the clamp position from the position away from the board | substrate holding frame and board | substrate holding plate of the closed state. It is front explanatory drawing, (B) is front explanatory drawing which shows the clamp member of a clamped state. It is front explanatory drawing of the board | substrate holder for plating.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. FIG. 7 is an explanatory front view of this embodiment. This embodiment is a plating substrate holder with a shielding plate. In FIG. 7, reference numeral 1 denotes a plating substrate holder, and reference numeral 2 denotes a substrate to be plated. The plating substrate holder 1 holds the substrate 2 as indicated by reference numeral 2 in FIGS.

  The plating substrate holder 1 includes a rectangular substrate holding frame 3 and left and right substrate holding plates 5 and 6 corresponding to the left and right substrate holding surfaces 4 of the substrate holding frame 3. The substrate holding frame 3 and the substrate pressing plates 5 and 6 are attached to the left and right sides of the substrate holding frame 3 in a double door that can be opened and closed by a hinge (not shown). The substrate holding plate 5 on the left side of the substrate holding frame 3 in FIG. 7 is drawn in an open state without the substrate 2, and the substrate holding plate 6 on the right side of the substrate holding frame 3 in FIG. These are drawn in a closed state, and show a state where the substrate 2 is pressed and the substrate holding frame 3 and the substrate pressing plate 6 are clamped.

  In addition to the substrate pressing plates 5 and 6, a shielding plate 7 and a clamp member 10 are mounted on the substrate holding frame 3. In FIG. 7, the shielding plate 7 attached to the substrate holding frame 3 is not visible as a whole because the right side depicts the holding state of the substrate 2, but the whole is centered along the frame shape of the substrate holding frame 3. It is formed in the shape of a rectangular frame as a space. Note that not only the substrate holding frame 3 but also the substrate holding plates 5 and 6 are mounted with shielding plates 8 and 9 that are divided so as to be substantially the same shape as the shielding plate 7 of the substrate holding frame 3 in the left-right direction.

  The shielding plates 7, 8, 9 are attached to make the plating thickness on the substrate 2 uniform. The shielding plates 7, 8, and 9 are formed with a large number of openings of a calculated size, and are constituted by impact-resistant vinyl chloride plates in the embodiment. The shielding plates 7, 8 and 9 have different shapes and sizes and numbers of openings depending on the substrate 2 to be plated.

  The substrate holding surface 4 of the substrate holding frame 3 and the substrate holding surface 30 of the substrate pressing plates 5, 6 have a height at which a desired number of power feeding portions 31 are in contact with the substrate 2 with the substrate 2 sandwiched in a desired position. It is formed with. The power feeding section 31 is formed by a flat plate contact 32 that feeds power to the substrate 2 and a rubber mask 33 surrounding the flat plate contact 32, and the rubber mask 33 does not become an obstacle to contact between the flat plate contact 32 and the substrate 2. It is formed as follows. In the embodiment, the power feeding unit 31 is provided at six locations on the left and right substrate holding surfaces 4 and at six locations on the left and right substrate holding surfaces 30. Of course, the power feeding unit 31 of the substrate holding surface 4 and the power feeding unit 31 of the substrate holding surface 30 are provided at different positions.

  The left and right substrate holding surfaces 4 and the substrate holding surface 30 on the opposite side of the power feeding unit 31 are provided with pressing rubber masks 34 having a width that covers the flat plate contacts 32 formed on the substrate holding surface 4 and the substrate holding surface 30. Yes. Thus, even when the substrate 2 held by the substrate holding frame 3 and the substrate pressing plates 5 and 6 is clamped by the clamp member 10 and plated, the rubber mask 33 and the flat plate contact surrounding the flat plate contact 32 are surrounded. The flat plate contact 32 is guarded by the presser rubber mask 34 covering the area 32, and the occurrence of precipitation can be prevented.

  Stoppers 35 are erected on the left and right substrate holding surfaces 4 of the substrate holding frame 3. The stopper 35 is for positioning the substrate 2 mounted on the substrate holding surface 4. A stopper receiving counterbore 36 for receiving the stopper 35 is provided in a concave shape at a position corresponding to the stopper 35 of the substrate holding frame 3 on the substrate holding surface 30 of the other substrate pressing plates 5 and 6. Thereby, the presence of the stopper 35 prevents inconvenience in holding the substrate 2.

  The plating substrate holder 1 according to the embodiment includes the substrate holding frame 3 and the substrate pressing plates 5 and 6 in a state where the substrate pressing plates 5 and 6 are closed, and the clamp member 10 having a substantially U-shape from the outside of both members. After mounting, the substrate holding frame 3 and the substrate pressing plates 5 and 6 are clamped to hold and use the substrate.

  In the embodiment shown in FIG. 7, the substrate holding frame 3 and the substrate holding plate 6 on the right side in FIG. 7 are clamped with five clamp members 10 so as to appear on the right side of the plating substrate holder 1. Yes. Although not drawn, the left substrate holding frame 3 and the substrate pressing plate 5 are also clamped by the five clamp members 10.

  The clamp member 10 includes a clamp frame 11 having a substantially U-shaped mouth portion and a clamp lever 20 pivotally attached to the clamp frame 11. The clamp member 10 is rotatably mounted on the surface of the substrate holding frame 3 opposite to the substrate holding surface 4.

  The clamp member 10 is made of a metal having elasticity suitable for clamping, for example, stainless steel. The shape of the clamp member 10 is a substantially U-shaped cross section because the closed substrate holding frame 3 and the substrate pressing plates 5 and 6 are held together. It is formed by bending it into a shape.

  FIG. 4 is an explanatory plan view showing a state before the clamp frame 11 is bent in the embodiment. In FIG. 4, reference numeral 12 denotes a lower side plate part constituting a substantially U-shaped lower side, reference numeral 13 denotes a side plate part for securing a space, and reference numeral 14 denotes an upper side plate part constituting an approximately U-shaped upper side. Reference numeral 15 denotes a connecting plate portion having a shaft hole 16 that serves as a fulcrum of the clamp lever 20.

  The lower side plate portion 12 is formed longer than the upper side plate portion 14 and is separated from the upper side plate portion 14 in order to form a shaft hole 17 for rotatably mounting the clamp member 10 to the substrate holding frame 3. A shaft hole 17 is formed in the vicinity. Note that the window opened in the upper side plate portion 14 is a passing window 18 of the clamp lever 20.

  A portion indicated by a two-dot chain line in FIG. 4 is a bent portion, and the clamp frame 11 is bent at this portion, as shown in FIG. 1 (B), FIG. 2 (B) and FIG. 3 (B). It is formed in a substantially U-shaped cross section. This shape is the basic shape of the clamp member 10.

  The clamp frame 11 has a substantially U-shaped interval, that is, the interval between the inner side surface of the lower side plate portion 12 and the inner side surface of the upper side plate portion 14 is determined by the height of the side plate portion 13. As shown in FIGS. 1 (B), 2 (B), and 3 (B), the thickness is secured to be larger than the combined thickness of the substrate holding frame 3 and the substrate pressing plate 5 in a state where the substrate 2 is held. .

  The end portion of the upper side plate portion 14 of the clamp frame 11, that is, the connection plate portion 15 at the left end in FIG. 4 is an upper side plate as shown in FIGS. 1 (B), 2 (B) and 3 (B). The substrate holding frame 3 and the substrate pressing plate 5 are bent vertically at a substantially right angle with respect to the portion 14 and are erected vertically. A clamp lever 20 is pivotally attached to the shaft hole 16 of the connecting plate portion 15 via a fulcrum pin 19.

  As shown in the side explanatory view of FIG. 5D, the clamp lever 20 has a fulcrum hole 22 drilled in the head near the upper end serving as a fulcrum for the clamping operation, and a slightly longer length depending on the position of the fulcrum hole 22. When the operating portion 21 of the operating portion 21 (the position away from the fulcrum of the operating portion 21 is a force point), the plane is a point of action in a direction substantially perpendicular to the line between the fulcrum and the force point, and is a plane in contact with the held substrate pressing plates 5 and 6. And a clamping surface 23. In FIG. 5D, the notch 24 present in the head is a notch for smooth movement when entering the clamping operation.

  The abdomen of the clamp lever 20, that is, the groove 25 appearing in the rear view of FIG. 5B and the back of the clamp lever 20, that is, the groove 25 appearing in FIG. It is a groove | channel for making it not become the obstruction | occlusion of pushing down and raising operation | movement.

  When the clamp lever 20 is pushed down, the clamp surface 23 of the clamp lever 20 presses and clamps the substrate pressing plates 5 and 6 in the orthogonal direction, and the clamp lever 20 is lifted to release the clamp.

  Although not shown, the clamp surface 23 of the clamp lever 20 is a horizontal plane parallel to the upper surfaces of the substrate pressing plates 5 and 6 in the first and third inventions. That is, the substrate holding frame 3 and the substrate 2 are parallel to each other. However, in the second invention, as shown in FIGS. 2 (B) and 3 (B), the clamp surface 23 is in the opposite direction to the substrate 2 held by the substrate holding frame 3 and the substrate pressing plates 5 and 6. In other words, the inclined surface has a direction to descend, that is, an inclined surface having an inclination for inclining the clamp lever 20 to the outside in the opposite direction to the held substrate 2.

  2B and 3B, the left side is the side on which the substrate 2 is held by the closed substrate holding frame 3 and the substrate pressing plate 5, and the right side in FIG. It is the opposite direction that is the direction in which the inclined surface is lowered. 5A and 5C, the right side is the side on which the substrate 2 is held by the closed substrate holding frame 3 and the substrate pressing plate 5, and the left side in FIG. It is the opposite direction that is the direction in which the inclined surface is lowered.

Hereinafter, the usage method of the substrate holder 1 for plating which concerns on an Example is demonstrated.
First, the substrate pressing plates 5 attached to the left and right sides of the substrate holding frame 3 in a double door are opened as shown on the left side in FIG. At the same time, the right substrate holding plate 6 is opened. Next, the substrate 2 is brought into contact with the stoppers 35 of the left and right substrate holding surfaces 4 of the substrate holding frame 3 and positioned for holding. Further, the substrate pressing plates 5 and 6 are closed as shown on the right side of FIG. Thereafter, the substrate holding frame 3 and the substrate pressing plates 5 and 6 are clamped by the clamp member 10 mounted on the substrate holding frame 3.

  Specifically, as shown in FIG. 6A, the clamp member 10 in a state in which the clamp lever 20 is released is rotated from the outside of the substrate holding frame 3 and the substrate pressing plate 5 in a closed state, thereby both members. Include it. Thereafter, as shown in FIG. 6B, by pressing down the operation portion 21 of the clamp lever 20, the clamp surface 23 of the clamp lever 20 is pressed in a direction perpendicular to the substrate pressing plate 5, The substrate holding frame 3 and the substrate pressing plate 5 are clamped. The reverse side substrate pressing plate 6 is clamped in the same manner.

  The plating substrate holder 1 clamped by the clamp member 10 is then placed in the plating tank. In the plating tank, an electric current is passed through the substrate 2 through the flat plate contact 32 to perform electrolytic plating.

Next, how to use the clamp member 10 according to the second invention will be described in detail with reference to FIGS.
As shown in FIGS. 1 (A) and 1 (B), in a state before the clamp member 10 clamps the substrate holding frame 3 and the substrate pressing plate 5, the clamp lever 20 has its clamping surface 23 placed on the substrate pressing plate 5. It is rotated to the position to retreat from. At this time, in the side view of FIG. 1 (B), the clamp surface 23 which is an inclined surface appears and cannot be seen, so as shown in FIG. 1 (B), the tip of the head of the clamp lever 20 is shown in FIG. As shown in B), it appears as a line parallel to the substrate pressing plate 5.

  First, when the clamp lever 20 of the clamp member 10 is rotated as shown in FIG. 2A, the end of the clamp surface 23 comes into contact with the substrate pressing plate 5. At this time, the clamp surface 23 appears as a hypotenuse as shown in FIG. In this state, the clamp surface 23 is not pressed by the substrate pressing plate 5, and the clamp lever 20 is not yet inclined with respect to the outward direction of the plating substrate holder 1, that is, the direction opposite to the position of the substrate 2.

  When the clamp member 10 clamps the substrate holding frame 3 and the substrate pressing plate 5, the clamp lever 20 is pushed down, and in the process shown in FIGS. 2B to 3B, the mounted substrate 2 and The clamping operation is continued while gradually increasing the area of the clamping surface 23 that is inclined in the opposite direction to press the substrate pressing plate 5.

  At this time, the clamping surface 23 of the clamp lever 20 exerts a force to push the substrate pressing plate 5 in the substrate mounting direction. The force of the clamp lever 20 depends on the weight of the substrate pressing plate 5 and the mounting force. The substrate pressing plate 5 mounted on the holding frame 3 cannot be moved, and the clamp lever 20 is inclined in the direction opposite to the substrate mounting direction, that is, outward. This inclination causes the clamp lever 20 to pull the clamp frame 11 in the direction opposite to the board mounting direction, and deforms the clamp frame 11.

  As a result, as shown in FIG. 3B, when the clamping of the substrate holding frame 3 and the substrate pressing plate 5 by the clamp member 10 is completed, the force of the clamp lever 20 includes a force that pushes the substrate pressing plate 5 downward. In this state, the force pulling the clamp frame 11 in the direction opposite to the substrate mounting direction is combined.

  Since the clamp surface 23 of the clamp lever 20 is an inclined surface having an inclination to incline the clamp lever 20 in the opposite direction to the substrate 2, the clamp surface 20 causes the substrate pressing plate 5 to be opposite to the substrate mounting direction by the clamping force. Will be pulled to. As a result, the substrate 2 itself was pulled outwardly on both sides, and the substrate holder 1 for plating did not cause wrinkling, sagging, or deformation of the substrate when the substrate 2 was held.

DESCRIPTION OF SYMBOLS 1 ... Plating board holder 2 ... Board 3 ... Board holding frame 3
4... Substrate holding surface 5, 6 .. substrate holding plate 7, 8, 9, shielding plate 10... Clamp member 11... Clamp frame 12. ... Side plate part 14 ... Upper side plate part 15 ... Connecting plate part 16, 17 / Shaft hole 18 ... Passing plate 19 ... Support pin 20 ... Clamp lever 21 ... Operation part 22 ... fulcrum hole 23 ... Clamp surface 24 ... Notch 25 ... Groove 30 ... Substrate holding surface 31 ... Power feeding part 32 ...・ ・ Flat plate contact 33 ・ ・ ・ ・ Rubber mask 34 ・ ・ ・ ・ Presser rubber mask 35 ・ ・ ・ ・ Stopper 36 ・ ・ ・ ・ Stopper receiving counterbore

Claims (3)

Holding the substrate by closing the substrate holding frame and the substrate pressing plate attached to the both sides of the substrate holding frame in a double-sided manner,
In the substrate holder for plating that is used by clamping the substrate holding frame and the substrate pressing plate by attaching a substantially U-shaped clamp member from the outside of the substrate holding frame and the substrate pressing plate in the closed state,
The clamp member comprises a clamp frame having a substantially U-shaped mouth and a clamp lever pivotally attached to the clamp frame,
The distance between the inner side surface of the lower side plate portion that is a contact surface with the substrate holding frame in the clamp frame and the inner side surface of the upper side plate portion is formed larger than the thickness of the substrate holder for plating in a state of holding the substrate. And the passage window of the clamp lever is opened in the upper side plate of the clamp frame,
By operating the clamp lever, the clamping surface of the clamp lever passes through the passage window, presses the substrate pressing plate in a direction orthogonal to the substrate holding frame, and clamps both members. A substrate holder for plating.
The plating surface according to claim 1, wherein the clamping surface of the clamping lever is an inclined surface having an inclination for inclining the clamping lever in a direction opposite to the substrate held by the plating substrate holder. Board holder.
A flat plate contact that feeds power to the substrate as a power feeding portion on at least one of the substrate holding surfaces of the substrate holding frame and the substrate holding plate, and a rubber mask that surrounds the flat plate contact contacts the substrate. And at a height that contacts the substrate with the substrate sandwiched therebetween,
The plating substrate holder according to claim 1, wherein a pressing rubber mask having a width covering the flat plate contact is provided on the substrate holding surface opposite to the power feeding portion.

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