JPS6355863B2 - - Google Patents

Info

Publication number
JPS6355863B2
JPS6355863B2 JP9612083A JP9612083A JPS6355863B2 JP S6355863 B2 JPS6355863 B2 JP S6355863B2 JP 9612083 A JP9612083 A JP 9612083A JP 9612083 A JP9612083 A JP 9612083A JP S6355863 B2 JPS6355863 B2 JP S6355863B2
Authority
JP
Japan
Prior art keywords
resin
lead
semiconductor device
resin sealing
sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP9612083A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59220934A (ja
Inventor
Masamichi Shindo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP9612083A priority Critical patent/JPS59220934A/ja
Publication of JPS59220934A publication Critical patent/JPS59220934A/ja
Publication of JPS6355863B2 publication Critical patent/JPS6355863B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP9612083A 1983-05-31 1983-05-31 樹脂封止型半導体装置の製造方法 Granted JPS59220934A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9612083A JPS59220934A (ja) 1983-05-31 1983-05-31 樹脂封止型半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9612083A JPS59220934A (ja) 1983-05-31 1983-05-31 樹脂封止型半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS59220934A JPS59220934A (ja) 1984-12-12
JPS6355863B2 true JPS6355863B2 (ko) 1988-11-04

Family

ID=14156518

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9612083A Granted JPS59220934A (ja) 1983-05-31 1983-05-31 樹脂封止型半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS59220934A (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62172735A (ja) * 1986-01-27 1987-07-29 Fuji Seiki Seizosho:Kk バリ取り方法
US7635418B2 (en) * 2004-12-03 2009-12-22 Nordson Corporation Plasma processing apparatus and methods for removing extraneous material from selected areas on a substrate
US7842223B2 (en) * 2004-12-22 2010-11-30 Nordson Corporation Plasma process for removing excess molding material from a substrate

Also Published As

Publication number Publication date
JPS59220934A (ja) 1984-12-12

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