JPS6355860B2 - - Google Patents

Info

Publication number
JPS6355860B2
JPS6355860B2 JP58048217A JP4821783A JPS6355860B2 JP S6355860 B2 JPS6355860 B2 JP S6355860B2 JP 58048217 A JP58048217 A JP 58048217A JP 4821783 A JP4821783 A JP 4821783A JP S6355860 B2 JPS6355860 B2 JP S6355860B2
Authority
JP
Japan
Prior art keywords
sealed chamber
carrier
processing
wafer
semiconductor substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58048217A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59175122A (ja
Inventor
Hidemi Amai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP58048217A priority Critical patent/JPS59175122A/ja
Publication of JPS59175122A publication Critical patent/JPS59175122A/ja
Publication of JPS6355860B2 publication Critical patent/JPS6355860B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)
JP58048217A 1983-03-23 1983-03-23 半導体基板塗布前処理装置 Granted JPS59175122A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58048217A JPS59175122A (ja) 1983-03-23 1983-03-23 半導体基板塗布前処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58048217A JPS59175122A (ja) 1983-03-23 1983-03-23 半導体基板塗布前処理装置

Publications (2)

Publication Number Publication Date
JPS59175122A JPS59175122A (ja) 1984-10-03
JPS6355860B2 true JPS6355860B2 (fa) 1988-11-04

Family

ID=12797241

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58048217A Granted JPS59175122A (ja) 1983-03-23 1983-03-23 半導体基板塗布前処理装置

Country Status (1)

Country Link
JP (1) JPS59175122A (fa)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6364031U (fa) * 1986-10-16 1988-04-27
JPS63199423A (ja) * 1987-02-16 1988-08-17 Toshiba Corp 半導体基板表面処理方法
JP5287913B2 (ja) * 2011-03-18 2013-09-11 東京エレクトロン株式会社 塗布、現像装置、塗布、現像方法及び記憶媒体

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52142972A (en) * 1976-05-25 1977-11-29 Toshiba Corp Semiconductor production device
JPS5731151A (en) * 1980-08-04 1982-02-19 Toshiba Corp Automatic continuous treating device for semiconductor substrate
JPS5753933A (en) * 1980-09-18 1982-03-31 Toshiba Corp Manufacture of semiconductor element

Also Published As

Publication number Publication date
JPS59175122A (ja) 1984-10-03

Similar Documents

Publication Publication Date Title
JP3227642B2 (ja) 塗布装置
JP3587776B2 (ja) 塗布装置及び塗布方法
KR101522437B1 (ko) 기판 처리 장치, 기판 처리 방법, 도포, 현상 장치, 도포, 현상 방법 및 기억 매체
JP4410121B2 (ja) 塗布、現像装置及び塗布、現像方法
US20100326353A1 (en) Coating and developing apparatus
KR100455904B1 (ko) 세정처리방법및세정처리장
CN100539017C (zh) 显影装置及显影方法
TW202447841A (zh) 基板處理系統及基板處理方法
US20160079099A1 (en) Substrate treating apparatus
US7403260B2 (en) Coating and developing system
KR102030896B1 (ko) 기판 처리 장치 및 기판 처리 방법
KR20120030058A (ko) 템플릿 처리 장치 및 임프린트 시스템
US20100129526A1 (en) Substrate processing apparatus
JP2009021275A (ja) 基板処理装置
KR20240016213A (ko) 기판 처리 시스템 및 기판 처리 방법
US11927886B2 (en) Substrate treating method
JP3818631B2 (ja) 基板処理装置
KR20190053341A (ko) 기판 처리 장치 및 기판 처리 방법
JPS6355860B2 (fa)
JPH10261689A (ja) 基板処理装置
US20090023297A1 (en) Method and apparatus for hmds treatment of substrate edges
KR20170133992A (ko) 기판 처리 장치 및 기판 처리 방법
US20080069954A1 (en) Method and apparatus for dispense of chemical vapor in a track lithography tool
JP4372901B2 (ja) ケース開閉装置
JPH04314349A (ja) 真空リソグラフィ装置