JPS6355843B2 - - Google Patents
Info
- Publication number
- JPS6355843B2 JPS6355843B2 JP57139728A JP13972882A JPS6355843B2 JP S6355843 B2 JPS6355843 B2 JP S6355843B2 JP 57139728 A JP57139728 A JP 57139728A JP 13972882 A JP13972882 A JP 13972882A JP S6355843 B2 JPS6355843 B2 JP S6355843B2
- Authority
- JP
- Japan
- Prior art keywords
- paste
- fatty acid
- acid metal
- metal salt
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 150000003839 salts Chemical class 0.000 claims description 14
- SVOAENZIOKPANY-CVBJKYQLSA-L copper;(z)-octadec-9-enoate Chemical group [Cu+2].CCCCCCCC\C=C/CCCCCCCC([O-])=O.CCCCCCCC\C=C/CCCCCCCC([O-])=O SVOAENZIOKPANY-CVBJKYQLSA-L 0.000 claims description 8
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 7
- 239000000194 fatty acid Substances 0.000 claims description 7
- 229930195729 fatty acid Natural products 0.000 claims description 7
- 150000004665 fatty acids Chemical class 0.000 claims description 7
- 150000003304 ruthenium compounds Chemical class 0.000 claims description 7
- 239000011230 binding agent Substances 0.000 claims description 4
- 229910001925 ruthenium oxide Inorganic materials 0.000 claims description 4
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 claims description 4
- 150000004670 unsaturated fatty acids Chemical group 0.000 claims description 4
- 235000021122 unsaturated fatty acids Nutrition 0.000 claims description 4
- 150000004671 saturated fatty acids Chemical group 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 5
- 230000003746 surface roughness Effects 0.000 description 5
- 239000001856 Ethyl cellulose Substances 0.000 description 2
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 2
- 239000005388 borosilicate glass Substances 0.000 description 2
- 229920001249 ethyl cellulose Polymers 0.000 description 2
- 235000019325 ethyl cellulose Nutrition 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- JXSRRBVHLUJJFC-UHFFFAOYSA-N 7-amino-2-methylsulfanyl-[1,2,4]triazolo[1,5-a]pyrimidine-6-carbonitrile Chemical compound N1=CC(C#N)=C(N)N2N=C(SC)N=C21 JXSRRBVHLUJJFC-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- LHEFLUZWISWYSQ-CVBJKYQLSA-L cobalt(2+);(z)-octadec-9-enoate Chemical compound [Co+2].CCCCCCCC\C=C/CCCCCCCC([O-])=O.CCCCCCCC\C=C/CCCCCCCC([O-])=O LHEFLUZWISWYSQ-CVBJKYQLSA-L 0.000 description 1
- AMFIJXSMYBKJQV-UHFFFAOYSA-L cobalt(2+);octadecanoate Chemical compound [Co+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O AMFIJXSMYBKJQV-UHFFFAOYSA-L 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- XYXLRVFDLJOZJC-CVBJKYQLSA-L manganese(2+);(z)-octadec-9-enoate Chemical compound [Mn+2].CCCCCCCC\C=C/CCCCCCCC([O-])=O.CCCCCCCC\C=C/CCCCCCCC([O-])=O XYXLRVFDLJOZJC-CVBJKYQLSA-L 0.000 description 1
- SZINCDDYCOIOJQ-UHFFFAOYSA-L manganese(2+);octadecanoate Chemical compound [Mn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O SZINCDDYCOIOJQ-UHFFFAOYSA-L 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- VDRDGQXTSLSKKY-UHFFFAOYSA-K ruthenium(3+);trihydroxide Chemical compound [OH-].[OH-].[OH-].[Ru+3] VDRDGQXTSLSKKY-UHFFFAOYSA-K 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Landscapes
- Non-Adjustable Resistors (AREA)
- Paints Or Removers (AREA)
Description
【発明の詳細な説明】
本発明は、例えばチユーナ、ホームコンバータ
ー、サーマルプリンタ、H.I.C回路ブロツク用な
どの抵抗層の形成用ペーストに関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a paste for forming a resistive layer for tuners, home converters, thermal printers, HIC circuit blocks, and the like.
抵抗層形成用ペーストとしてルテニウム−ガラ
ス系のものが一般に知られており、このペースト
をステンレススクリーンやシルクスクリーンなど
の方法で印刷して抵抗層を形成していた。抵抗値
の調整はルテニウム、ガラス結合剤、その他添加
剤の混合割合を調整することによつて行なわれて
いた。しかし従来の抵抗層形成用ペーストでは、
印刷をするときに膜厚を一定にすることが難し
く、膜中にクラツクが発生したりして、特性のバ
ラツキが大きかつた。 A ruthenium-glass based paste is generally known as a paste for forming a resistive layer, and the resistive layer is formed by printing this paste using a method such as a stainless steel screen or a silk screen. The resistance value has been adjusted by adjusting the mixing ratio of ruthenium, glass binder, and other additives. However, with conventional pastes for forming resistance layers,
It was difficult to maintain a constant film thickness during printing, and cracks occurred in the film, resulting in large variations in properties.
本発明の目的はこのような従来技術の欠点を解
消し、膜がほぼ一定で、クラツクの発生がない特
性の安定した抵抗層が得られる抵抗層形成用ペー
ストを提供するにある。 An object of the present invention is to overcome the drawbacks of the prior art and to provide a paste for forming a resistive layer, which provides a resistive layer with a substantially constant film thickness and stable characteristics without cracks.
この目的を達成するため、本発明は、ルテニウ
ム化合物とガラス質結合剤とをビヒクル中に分散
してなるペースト中に不飽和脂肪酸金属塩あるい
は飽和脂肪酸金属塩などの脂肪酸金属塩を添加し
たことを特徴とするものである。 In order to achieve this object, the present invention proposes that a fatty acid metal salt such as an unsaturated fatty acid metal salt or a saturated fatty acid metal salt is added to a paste formed by dispersing a ruthenium compound and a vitreous binder in a vehicle. This is a characteristic feature.
本発明で用いられるルテニウム化合物としては
酸化ルテニウムあるいは水酸化ルテニウムなどが
あり、それのペースト中の含有率は約５〜25重量
％の範囲が適当である。 Examples of the ruthenium compound used in the present invention include ruthenium oxide and ruthenium hydroxide, and the content thereof in the paste is suitably in the range of about 5 to 25% by weight.
ガラス質結合剤としてはホウ硅酸ガラスなどが
用いられ、それのペースト中の含有率は約23〜39
重量％の範囲が適当である。ビヒクルとしては、
エチルセルローズやブチラール樹脂などをタービ
ネオールやブチルカルドトールなどに溶解したも
のが用いられ、それのペースト中の含有率は約36
重量％前後が適当である。 Borosilicate glass is used as the vitreous binder, and its content in the paste is approximately 23 to 39
A range of weight percent is suitable. As a vehicle,
Ethyl cellulose, butyral resin, etc. dissolved in turbineol, butyl caldotol, etc. are used, and the content in the paste is approximately 36%.
Around % by weight is appropriate.
脂肪酸金属塩としては、オレイン酸銅、オレイ
ン酸コバルト、オレイン酸マンガンなどの不飽和
脂肪酸金属塩、あるいはステアリン酸銅、ステア
リン酸コバルト、ステアリン酸マンガンなどの飽
和脂肪酸金属が用いられ、中でもオレイン酸銅は
好適である。脂肪酸金属塩のペースト中の含有率
は、約９〜36重量％が適当である。 As fatty acid metal salts, unsaturated fatty acid metal salts such as copper oleate, cobalt oleate, and manganese oleate, and saturated fatty acid metal salts such as copper stearate, cobalt stearate, and manganese stearate are used. Among them, copper oleate is suitable. The content of the fatty acid metal salt in the paste is suitably about 9 to 36% by weight.
次に本発明の抵抗層形成用ペーストを用いて作
成したチツプ状抵抗体を第１図および第２図とと
もに説明する。アルミナなどからなる絶縁基板１
上に、所定の間隔をおいてほぼ平行に銀ペースト
を塗布し、これを850℃で10分間程度焼成して２
つの電極２，２を形成する。 Next, a chip-shaped resistor made using the paste for forming a resistive layer of the present invention will be explained with reference to FIGS. 1 and 2. Insulating substrate 1 made of alumina etc.
Silver paste is applied almost parallel to the top at predetermined intervals, and this is baked at 850℃ for about 10 minutes.
Two electrodes 2, 2 are formed.
これより別にヒビクル（エチルセルロースをタ
ービネオールに溶解させたもの）に酸化ルテニウ
ムを15.93重量％、ホウ硅酸ガラスを29.53重量％
ならびにオレイン酸銅を18重量％それぞれ添加し
てペーストを作成する。 Apart from this, 15.93% by weight of ruthenium oxide and 29.53% by weight of borosilicate glass were added to Hivekuru (ethylcellulose dissolved in turbineol).
and 18% by weight of copper oleate to prepare a paste.
このペーストを前記一方の電極２から他方の電
極２にかかるようにスクリーン印刷し、850℃で
10分間程度焼成して抵抗層３を形成してチツプ状
抵抗体を得る。 This paste was screen printed so as to cover from one electrode 2 to the other electrode 2, and heated at 850℃.
The resistor layer 3 is formed by firing for about 10 minutes to obtain a chip-shaped resistor.
第３図および第４図は、抵抗層形成用ペースト
にオレイン酸銅を添加しない試料No.１のもの（第
３図）と、前記実施例のようにオレイン酸銅を18
重量％添加した試料No.２のもの（第４図）をそれ
ぞれ用いて形成した抵抗層の表面粗さを測定した
結果を示す図である。第３図から明らかなように
オレイン酸銅を添加しないものは、形成された抵
抗層の表面粗さが大きく、約4.5μmにも達してい
た。これに対しオレイン酸銅を添加した第４図の
ものは、表面粗さが約1μm程度と小さく、極めて
平坦で緻密な抵抗層が形成されている。なお、こ
こでいう表面粗さとは、抵抗層中の凹部の最低位
置と凸部の最高位置との差を示している。 Figures 3 and 4 show Sample No. 1 (Figure 3) in which copper oleate was not added to the resistance layer forming paste, and Sample No. 1 (Figure 3) in which copper oleate was not added to the resistive layer forming paste.
FIG. 4 is a diagram showing the results of measuring the surface roughness of resistive layers formed using Sample No. 2 (FIG. 4) to which % by weight was added. As is clear from FIG. 3, in the case where copper oleate was not added, the surface roughness of the formed resistance layer was large, reaching about 4.5 μm. On the other hand, the one shown in FIG. 4 in which copper oleate is added has a small surface roughness of about 1 μm, and an extremely flat and dense resistance layer is formed. Note that the surface roughness referred to here indicates the difference between the lowest position of the concave portion and the highest position of the convex portion in the resistance layer.
第５図は、前記試料No.１と試料No.２でそれぞれ
ルテニウム化合物（酸化ルテニウム）の含有率を
変化させた場合の抵抗層の抵抗値を測定した結果
を示す特性図である。 FIG. 5 is a characteristic diagram showing the results of measuring the resistance value of the resistance layer when the content of the ruthenium compound (ruthenium oxide) was changed in Sample No. 1 and Sample No. 2.
この図で曲線Ａは試料No.１の、曲線Ｂは試料No.
２の特性曲線で、本発明に係る試料No.２のものは
全体的に小さな抵抗値が得られ、しかも同じ抵抗
値のものを得ようとする場合には、高価なルテニ
ウム化合物の含有量が少なくてすみ、コストの低
減が図れる。 In this figure, curve A is for sample No. 1, and curve B is for sample No.
In the characteristic curve No. 2, sample No. 2 according to the present invention has an overall small resistance value, and when trying to obtain the same resistance value, the content of expensive ruthenium compounds must be reduced. It is possible to reduce the cost by using less amount.
第６図および第７図は、前記試料No.１および試
料No.２を用いてそれぞれ形成したチツプ抵抗体の
拡大平面図で、第６図が試料No.１を第７図が試料
No.２をそれぞれ用いたチツプ抵抗体の図である。
第６図に示すように試料No.１を用いたものは、抵
抗層３の表面にスクリーン印刷の際に用いたネツ
トの形状に沿つて大小のクラツク４が多数発生
し、このクラツク４が特性のバラツキの一因にな
つている。一方、第７図に示すように試料No.２を
用いたものは、抵抗層３の表面にほとんどクラツ
クの発生が認められず、緻密な表面状態を有して
おり、特性的にも安定している。 FIGS. 6 and 7 are enlarged plan views of chip resistors formed using Sample No. 1 and Sample No. 2, respectively, with FIG. 6 showing sample No. 1 and FIG.
FIG. 2 is a diagram of a chip resistor using No. 2.
As shown in FIG. 6, in the case where sample No. 1 was used, many large and small cracks 4 were generated on the surface of the resistive layer 3 along the shape of the net used during screen printing, and these cracks 4 had characteristics. This is a contributing factor to the variation in On the other hand, as shown in Figure 7, in the case of sample No. 2, almost no cracks were observed on the surface of the resistance layer 3, the surface was dense, and the characteristics were stable. ing.
本発明は前述のように、抵抗層形成用ペースト
中に脂肪酸金属塩を添加することにより、表面が
非常に平坦でクラツクの発生がなく、しかも抵抗
値の低い抵抗層が得られる抵抗層形成用ペースト
を提供することができる。 As mentioned above, the present invention is a resistive layer forming paste that has a very flat surface, no cracks, and a low resistance value by adding a fatty acid metal salt to a resistive layer forming paste. paste can be provided.
第１図および第２図は本発明の実施例によつて
得られたチツプ抵抗体の平面図および断面図、第
３図および第４図は抵抗層の表面粗さを示す図、
第５図はルテニウム化合物の含有率と抵抗値との
関係を示す特性図、第６図および第７図はチツプ
状抵抗体の一部拡大平面図である。
１……絶縁基板、２……電極、３……抵抗層。
1 and 2 are a plan view and a sectional view of a chip resistor obtained by an example of the present invention, and FIGS. 3 and 4 are diagrams showing the surface roughness of the resistance layer.
FIG. 5 is a characteristic diagram showing the relationship between ruthenium compound content and resistance value, and FIGS. 6 and 7 are partially enlarged plan views of the chip-like resistor. 1... Insulating substrate, 2... Electrode, 3... Resistance layer.
Claims (1)
クル中に分散してなるペースト中に脂肪酸金属塩
を添加したことを特徴とする抵抗層形成用ペース
ト。 ２ 特許請求の範囲第１項記載において、前記ル
テニウム化合物が酸化ルテニウムであることを特
徴とする抵抗層形成用ペースト。 ３ 特許請求の範囲第１項記載において、前記脂
肪酸金属塩が不飽和脂肪酸金属塩であることを特
徴とする抵抗層形成用ペースト。 ４ 特許請求の範囲第３項記載において、前記不
飽和脂肪酸金属塩がオレイン酸銅であることを特
徴とする抵抗層形成用ペースト。 ５ 特許請求の範囲第１項記載において、前記脂
肪酸金属塩が飽和脂肪酸金属塩であることを特徴
とする抵抗層形成用ペースト。[Scope of Claims] 1. A paste for forming a resistance layer, characterized in that a fatty acid metal salt is added to a paste prepared by dispersing a ruthenium compound and a vitreous binder in a vehicle. 2. A paste for forming a resistance layer according to claim 1, wherein the ruthenium compound is ruthenium oxide. 3. The paste for forming a resistance layer according to claim 1, wherein the fatty acid metal salt is an unsaturated fatty acid metal salt. 4. The paste for forming a resistance layer according to claim 3, wherein the unsaturated fatty acid metal salt is copper oleate. 5. The paste for forming a resistance layer according to claim 1, wherein the fatty acid metal salt is a saturated fatty acid metal salt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57139728A JPS5931001A (en) | 1982-08-13 | 1982-08-13 | Paste for forming resistance layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57139728A JPS5931001A (en) | 1982-08-13 | 1982-08-13 | Paste for forming resistance layer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5931001A JPS5931001A (en) | 1984-02-18 |
| JPS6355843B2 true JPS6355843B2 (en) | 1988-11-04 |
Family
ID=15252001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57139728A Granted JPS5931001A (en) | 1982-08-13 | 1982-08-13 | Paste for forming resistance layer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5931001A (en) |
-
1982
- 1982-08-13 JP JP57139728A patent/JPS5931001A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5931001A (en) | 1984-02-18 |
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