JPH01232797A - Ceramic multilayer circuit board - Google Patents
Ceramic multilayer circuit boardInfo
- Publication number
- JPH01232797A JPH01232797A JP5891088A JP5891088A JPH01232797A JP H01232797 A JPH01232797 A JP H01232797A JP 5891088 A JP5891088 A JP 5891088A JP 5891088 A JP5891088 A JP 5891088A JP H01232797 A JPH01232797 A JP H01232797A
- Authority
- JP
- Japan
- Prior art keywords
- weight
- parts
- ruo2
- green sheet
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 21
- 229910052709 silver Inorganic materials 0.000 claims abstract description 7
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 6
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 abstract description 28
- 239000000843 powder Substances 0.000 abstract description 16
- 229910052804 chromium Inorganic materials 0.000 abstract description 4
- 238000007606 doctor blade method Methods 0.000 abstract description 3
- 239000000463 material Substances 0.000 abstract description 3
- 239000011230 binding agent Substances 0.000 abstract description 2
- 239000004014 plasticizer Substances 0.000 abstract description 2
- 239000002002 slurry Substances 0.000 abstract description 2
- 238000005476 soldering Methods 0.000 abstract description 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 12
- 239000010948 rhodium Substances 0.000 description 11
- 239000000758 substrate Substances 0.000 description 9
- 239000004020 conductor Substances 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 239000011651 chromium Substances 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 4
- 238000010304 firing Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 235000019441 ethanol Nutrition 0.000 description 3
- 229910052707 ruthenium Inorganic materials 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 239000001856 Ethyl cellulose Substances 0.000 description 2
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 2
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 2
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 2
- 229920001249 ethyl cellulose Polymers 0.000 description 2
- 235000019325 ethyl cellulose Nutrition 0.000 description 2
- 239000002241 glass-ceramic Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 229910052703 rhodium Inorganic materials 0.000 description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 2
- -1 ruthenium alkoxide Chemical class 0.000 description 2
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229940116411 terpineol Drugs 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- 239000006121 base glass Substances 0.000 description 1
- 235000013405 beer Nutrition 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 150000001845 chromium compounds Chemical class 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- 238000010344 co-firing Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- SJLOMQIUPFZJAN-UHFFFAOYSA-N oxorhodium Chemical compound [Rh]=O SJLOMQIUPFZJAN-UHFFFAOYSA-N 0.000 description 1
- 239000011505 plaster Substances 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 150000003284 rhodium compounds Chemical class 0.000 description 1
- 229910003450 rhodium oxide Inorganic materials 0.000 description 1
- 150000003304 ruthenium compounds Chemical class 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
Abstract
Description
【発明の詳細な説明】
イ１発明の目的
産 土の１
本発明はセラミック多層回路基板、特に低温焼成可能な
セラミックの多層配線基板に関する。DETAILED DESCRIPTION OF THE INVENTION (1) Objects of the Invention (1) The present invention relates to a ceramic multilayer circuit board, and particularly to a ceramic multilayer wiring board that can be fired at a low temperature.
【１へ１証
従来、一般的にはＷ又はＭＯを導体とするアルミナ系の
高温焼成多層基板では、アルミナの誘電率高く、導通抵
抗も高いため、信号伝播遅延時間も長くなりコンピュタ
−等の高速化、高性能化の障害となっている。[1 to 1 proof] Conventionally, alumina-based high-temperature fired multilayer substrates that use W or MO as conductors generally have a high dielectric constant and high conduction resistance, so the signal propagation delay time becomes long and is used in computers, etc. This is an obstacle to increasing speed and performance.
このため、高温焼成多層基板に代わるものとして低融点
ガラスにアルミナを添加したセラミック、結晶化ガラス
セラミック等を基板材料として、Ａｇ、Ｃｕ、 Ａｇ−
Ｐｄ等の低抵抗金属を導体とし、これ等を多層に積層し
た低温焼成セラミック多層基板の開発が進められている
。For this reason, as an alternative to high-temperature fired multilayer substrates, ceramics made by adding alumina to low-melting glass, crystallized glass ceramics, etc. are used as substrate materials such as Ag, Cu, Ag-
2. Description of the Related Art Low-temperature firing ceramic multilayer substrates are being developed in which low-resistance metals such as Pd are used as conductors and are laminated in multiple layers.
明が ゛しようとする口頭
８００〜１０００℃で焼成可能な低温焼成基板に、Ａｇ
−Ｐｄ系導体を表面用導体として同時焼成法により形成
させる場合、その導体の特性として重要な要因は■半田
に良く濡れる事■接着強度が強い事の２点である。しか
し、低温焼成基板上へ従来の混成集積回路（ＨＩＣ）用
Ａｇ、 Ｐｄペーストを用いたメタライズ法では、ペー
スト中の強度向上用として添加しているガラスフリット
成分が多く、半田に濡れない欠点が出る。又このフリッ
ト成分を除くと接着強度が劣化する０本発明者等は特願
昭６１１３８７１５に示されるように、導体の周辺を絶
縁性セラミックで被覆する方法を提案している。しかし
導体のファインライン化、高密度化ができにくくなる欠
点を有していた。Ag is applied to a low-temperature firing substrate that can be fired at 800 to 1000°C, which is what the company is trying to do.
- When a Pd-based conductor is formed as a surface conductor by a co-firing method, two important factors are important characteristics of the conductor: (1) good wettability with solder; and (2) strong adhesive strength. However, in the conventional metallization method using Ag and Pd paste for hybrid integrated circuits (HIC) on low-temperature fired substrates, there is a large amount of glass frit component added to the paste to improve strength, and the disadvantage is that it does not wet with solder. Get out. Moreover, if this frit component is removed, the adhesive strength will deteriorate.The present inventors have proposed a method of covering the periphery of the conductor with an insulating ceramic, as shown in Japanese Patent Application No. 6,113,8715. However, it has the disadvantage that it is difficult to make fine lines and increase the density of the conductor.
ロ を ° るための
本発明は、８００〜１０００℃で焼成可能な低温焼成セ
ラミック多層回路基板において、グリーンシート上にＡ
ｇとＰｄの合計を１００重量部とし、Ａｇ＋７０〜１０
０重量部、Ｐｄ：０〜３０重量部にＣｒ ０．０１〜８
．０重量部及びＲｕＯ２とＲｈをそれぞれ下記式の範囲
内のＸ 、Ｙの各重量部
（−１／７）Ｘ＋１．０ ≧ Ｙ ≧ −０，０５Ｘ
＋０．０１ 、 Ｘ ＞０ 、Ｙ２Ｏ（但し、
ＸはＲｕＯ２重量部、ＹはＲｈ重量部を表す）の各粉末
と有機ビヒクル成分よりなる導体ペーストを被覆し、焼
成してなることを特徴とするセラミック多層回路基板で
ある。The present invention is to provide a low-temperature fired ceramic multilayer circuit board that can be fired at 800 to 1000°C.
The total of g and Pd is 100 parts by weight, Ag+70 to 10
0 parts by weight, Pd: 0 to 30 parts by weight, Cr 0.01 to 8
．． 0 parts by weight and each part by weight of X and Y within the range of the following formula (-1/7)X + 1.0 ≧ Y ≧ -0,05X
+0.01, X>0, Y2O (however,
This is a ceramic multilayer circuit board characterized in that it is coated with a conductive paste consisting of powders (X represents parts by weight of RuO2 and Y represents parts by weight of Rh) and an organic vehicle component and is fired.
具体的には酸化ルテニウムならば０．１〜７．０重量部
、ロジウムならば０．０１−１．０重量部を結んだ線内
（第１図の斜線部分）の重量部にＣ「を０．０１１ｉ量
部以上８重量部以下加えた粉末を有機ビヒクル中に分散
混合させ作成したペーストを被覆し、必要に応じて所定
枚数積層し同時焼成を行って作製されることを特徴とし
ているセラミック多層回路基板である。Specifically, add C to the weight part within the line connecting 0.1 to 7.0 parts by weight for ruthenium oxide and 0.01 to 1.0 parts by weight for rhodium (the shaded area in Figure 1). A ceramic characterized by being coated with a paste prepared by dispersing and mixing powder containing 0.011 parts by weight or more and 8 parts by weight or less in an organic vehicle, laminated in a predetermined number of sheets as necessary, and fired at the same time. It is a multilayer circuit board.
本発明に用いる低温焼成セラミックとはＳｌＯ□−Ｂ２
０３系からＰｂＯ−３ｉ０２−ＡＩｚＯｓ−ＢｚＯｓ系
ガラス、ＣａＯ−９１０□−Ａ１□０．−Ｂ、０．系ガ
ラス等にＡｌ２Ｏ５，ＳｉＯ□等の膏剤成分を加えたガ
ラス−セラミック複合系やＭｇ０−ＡＩ、０．−８ｉ０
２系結晶化ガラスなどである。The low-temperature fired ceramic used in the present invention is SlO□-B2
03 series to PbO-3i02-AIzOs-BzOs series glass, CaO-910□-A1□0. -B, 0. A glass-ceramic composite system in which plaster components such as Al2O5 and SiO□ are added to base glass, Mg0-AI, 0. -8i0
These include 2-system crystallized glass.
又、前記のセラミック粉末をグリーンシートとする方法
は、前記粉末と有機バインダーは、例えばポリビニール
ブチラール、メタクリル酸エステル樹脂等と、可塑剤は
、例えばジブチルフタレート等と、又溶剤は、例えばエ
チルアルコール、プロピルアルコール、トルエン等とを
ボールミル内で混合しスラリーとしドクターブレード法
にてグリーンシートとする方法が利用できる。Further, in the method of making the ceramic powder into a green sheet, the powder and the organic binder are, for example, polyvinyl butyral, methacrylic acid ester resin, etc., the plasticizer is, for example, dibutyl phthalate, and the solvent is, for example, ethyl alcohol. , propyl alcohol, toluene, etc. can be mixed in a ball mill to form a slurry, and a green sheet can be formed using a doctor blade method.
又、ＡｇとＰｄの粒子径は共に平均粒子径０．０１〜１
０μｍ程度のものが利用できる。 ＲｕＯ２成分として
は平均粒子径０．０１〜１０μ膳酸化ルテニウム粉の外
、焼成することによってＲｕＯ２となるルテニウムレジ
ネート、ルテニウムアルコキシド等の有機ルテニウム化
合物及び金属ルテニウムでもよい、ロジウム成分は、ロ
ジウム粉の外、酸化ロジウム、ロジウムレジネート等の
有機ロジウム化合物等も使用できる。クロム成分は同じ
く金属クロム粉、酸化クロム粉、クロムレジネート等の
有機クロム化合物が使用可能である。In addition, the average particle diameter of both Ag and Pd is 0.01 to 1.
A material with a diameter of about 0 μm can be used. As the RuO2 component, in addition to ruthenium oxide powder with an average particle size of 0.01 to 10 μm, organic ruthenium compounds such as ruthenium resinate and ruthenium alkoxide, which become RuO2 by firing, and metal ruthenium may be used. , organic rhodium compounds such as rhodium oxide and rhodium resinate can also be used. Similarly, organic chromium compounds such as metallic chromium powder, chromium oxide powder, and chromium resinate can be used as the chromium component.
Ａｇは導通成分の主体をなすものであり、低導通抵抗を
有している。ＰｄはＡｇのエレクトロマイグレーシラン
を抑える目的に用いられる。しかし導通抵抗が高い為３
０重量部以下が好ましい添加量範囲である。 ＲｕＯ２
及びＲｈは接着強度の改善に用いられ、使用量が少ない
とその効果が小さい、一方その量が多い場合、半田濡れ
性が劣化する：その範囲は第１図斜線の範囲内である。Ag is the main conductive component and has low conductive resistance. Pd is used for the purpose of suppressing electromigration of Ag. However, because the conduction resistance is high, 3
The preferred addition amount range is 0 parts by weight or less. RuO2
and Rh are used to improve adhesive strength, and if the amount used is small, the effect will be small, while if the amount is large, the solder wettability will deteriorate; the range is within the shaded area in FIG.
Ｃｒは半田濡れ性の改良に用いられるがその効果が表
れるのは０．０１〜８重量部の範囲である。Cr is used to improve solder wettability, but its effect becomes apparent within the range of 0.01 to 8 parts by weight.
導電ペーストは上記の粉末を有機ビヒクルと共に３本ロ
ールでよく混合して作製される。有機ビヒクルはエチル
セルローズやアクリル樹脂をテレピネオール、ブチルカ
ルピトールアセテート、ブチルカルピトール等の溶剤で
溶解させた溶液が用いられる。The conductive paste is prepared by thoroughly mixing the above powder with an organic vehicle in a three-roller. The organic vehicle used is a solution in which ethyl cellulose or acrylic resin is dissolved in a solvent such as terpineol, butylcarpitol acetate, butylcarpitol, or the like.
こうして得られたペーストは、セラミックグリーンシー
ト上にスクリーン印刷され、必要により積層され次いで
８００〜１０００℃に焼成される。この場合必要に応じ
ＲｕＯ２抵抗ペースト等による抵抗回路やＢａＴｉ０１
ペースト等によるコンデンサー回路を同時に形成しても
良い。The paste thus obtained is screen printed on a ceramic green sheet, laminated if necessary, and then fired at 800 to 1000°C. In this case, if necessary, a resistor circuit using RuO2 resistor paste, etc. or BaTi01
A capacitor circuit using paste or the like may be formed at the same time.
Ｌ［Ｌ
低温焼成セラミック基板は第１表に示した組成のガラス
と平均粒径０．６μ園のアルミナ粉を混合した組成を用
いた。L [L The low-temperature firing ceramic substrate used was a mixture of glass having the composition shown in Table 1 and alumina powder having an average particle size of 0.6 μm.
セラミックグリーンシートは上記粉末と重量比でアクリ
ル樹脂１０％ 、トルエン３０％ 、イソプロビ第１表
（単位は重量％）
ルアルコール１０％及びジブチルフタレート５％をボー
ルミルで混合しドクターブレード法にて膜厚０．４１の
グリーンシートを作製した０次いで粒径ｏ、ｔ μｍの
Ａｇ粉、０．８ μｍのＰｄ粉、０．１ ｔｔ−のＲｕ
Ｏ２粉、０．Ｏ１μｌｌのＲｈ粉、２μｍのＣｒ粉を用
いて第２表に示した割合でエチルセルローズをテレピネ
オールに溶解したビヒクル中に３本ロールにて混合しペ
ースト化した０次いでグリーンシート上に導体ペースト
をスクリーン印刷法で印刷し、さらにグリーンシート２
枚を重ね合わせ加熱圧着した後、９００℃で焼成した。Ceramic green sheets are made by mixing the above powder with 10% acrylic resin, 30% toluene, isopropylene alcohol (Table 1 by weight), 10% alcohol and 5% dibutyl phthalate in a ball mill, and then adjusting the film thickness using a doctor blade method. A green sheet of 0.41 was made using Ag powder with a particle size of o and t μm, Pd powder of 0.8 μm, and Ru of 0.1 tt-.
O2 powder, 0. Using 1 μl of Rh powder and 2 μm of Cr powder, they were mixed in a vehicle containing ethyl cellulose dissolved in terpineol in the ratio shown in Table 2 using three rolls to form a paste.Then, the conductor paste was screened onto a green sheet. Printed using printing method, and then green sheet 2
After stacking the sheets and heat-pressing them, they were fired at 900°C.
焼成した基板はロジン入りフラックス中に浸漬し、２３
０℃で２ＸＡｇ入り５ｎ−Ｐｂ共晶半田に浸漬し、半田
濡れ性を評価した。 ９０％以上半田で濡れている場合
は優とし、それ以下を劣とした。The fired substrate was immersed in rosin-containing flux, and
The solder wettability was evaluated by immersing it in 5n-Pb eutectic solder containing 2XAg at 0°C. If it was wet with solder by 90% or more, it was rated as excellent, and if it was less than that, it was rated as poor.
接着強度は、２ｎ口のパッド上に０．６■φのＳｎめつ
き軟銅線を半田付けし１５０℃の恒温槽中に第２表
（注）率及び井について
実施例のテストＮ［Ｌ２．５はテープ２の組成で、その
他はテープ１の組成
実施例子スト隨９のＲｈの０．１重量部はＲｈレジネー
トを使用した。The adhesive strength was determined by soldering a 0.6 φ Sn-plated annealed copper wire onto a 2n pad and placing it in a constant temperature oven at 150°C using the test N [L2. 5 is the composition of Tape 2, and the others are the compositions of Tape 1. 0.1 parts by weight of Rh in Example 9 was Rh resinate.
（以下余白）
４８時間放置後ビール法で測定した。その結果を第２表
に示す。(The following is a blank space) After standing for 48 hours, it was measured by the beer method. The results are shown in Table 2.
実施例１〜１０は優れた半田濡れ性で接着強度２．３ｋ
ｇ以上で強い値を示した。比較例１はＲｕＯ２やＲｈが
含有されていないため接着強度は弱く、又Ｃｒが含まれ
ていないため半田濡れ性が悪い、比較例２はＲｕＯ２が
過剰な例で、又比較例３はＲｕＯ２とＲｈが過剰に含有
されている例で、共に半田濡れ性が悪いことが示されて
いる。比較例４はＣｒ成分が過剰な例で半田濡れ性が悪
くなっている。Examples 1 to 10 have excellent solder wettability and adhesive strength of 2.3k.
It showed a strong value above g. Comparative Example 1 has weak adhesive strength because it does not contain RuO2 or Rh, and poor solder wettability because it does not contain Cr. Comparative Example 2 has an excessive amount of RuO2, and Comparative Example 3 has RuO2 and Rh. It has been shown that solder wettability is poor in both examples in which Rh is contained in excess. Comparative Example 4 has an excessive Cr content and has poor solder wettability.
ハ０発明の効果
本発明によれば接着強度が強くかつ半田濡れ性に優れ、
さらに高密度ファインパターン化が可能な低温焼成セラ
ミック多層基板を得ることができる。Effects of the Invention According to the present invention, the adhesive strength is strong and the solder wettability is excellent.
Furthermore, it is possible to obtain a low-temperature fired ceramic multilayer substrate that can be formed into a high-density fine pattern.
第１図は本発明のＲｈとＲｕＯ２、特許請求の範囲を図
示したもので、斜線が該当する。FIG. 1 illustrates Rh and RuO2 of the present invention, as well as the claims, and the hatched areas correspond to the claims.
Claims (1)
層回路基板において、グリーンシート上に、ＡｇとＰｄ
の合計を１００重量部とし、Ａｇ７０〜１００重量部、
Ｐｄ０〜３０重量部にＣｒ０．０１〜８．０重量部、及
びＲｕＯ＿２とＲｈがそれぞれ下記式の範囲内のＸ，Ｙ
の各重量部 （−１／７）Ｘ＋１．０≧Ｙ≧−０．０５Ｘ＋０．０１
、Ｘ＞０、Ｙ≧０（但し、ＸはＲｕＯ＿２重量部、Ｙは
Ｒｈ重量部を表す）の各粉末と有機ビヒクル成分よりな
る導体ペーストを被覆し焼成してなることを特徴とする
セラミック多層回路基板。[Claims] In a low-temperature fired ceramic multilayer circuit board that can be fired at 800 to 1000°C, Ag and Pd are formed on a green sheet.
The total of is 100 parts by weight, 70 to 100 parts by weight of Ag,
0 to 30 parts by weight of Pd, 0.01 to 8.0 parts by weight of Cr, and X, Y in which RuO_2 and Rh are each within the range of the following formula
Each weight part (-1/7)X+1.0≧Y≧-0.05X+0.01
, X>0, Y≧0 (where, X represents RuO_2 parts by weight, Y represents Rh parts by weight) and a conductive paste made of an organic vehicle component is coated and fired. circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5891088A JPH01232797A (en) | 1988-03-11 | 1988-03-11 | Ceramic multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5891088A JPH01232797A (en) | 1988-03-11 | 1988-03-11 | Ceramic multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01232797A true JPH01232797A (en) | 1989-09-18 |
Family
ID=13097971
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5891088A Pending JPH01232797A (en) | 1988-03-11 | 1988-03-11 | Ceramic multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01232797A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1994001377A1 (en) | 1992-07-07 | 1994-01-20 | Toray Industries, Inc. | Ceramic green sheet |
| US6596382B2 (en) * | 2000-07-21 | 2003-07-22 | Murata Manufacturing Co. Ltd. | Multilayered board and method for fabricating the same |
| GB2391116A (en) * | 2002-07-15 | 2004-01-28 | Sumitomo Metal | Conductor paste for low temperature co-fired ceramic circuits |
| JP5364833B1 (en) * | 2012-10-03 | 2013-12-11 | Ｔｄｋ株式会社 | Conductive paste and ceramic substrate using the same |
-
1988
- 1988-03-11 JP JP5891088A patent/JPH01232797A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1994001377A1 (en) | 1992-07-07 | 1994-01-20 | Toray Industries, Inc. | Ceramic green sheet |
| US6596382B2 (en) * | 2000-07-21 | 2003-07-22 | Murata Manufacturing Co. Ltd. | Multilayered board and method for fabricating the same |
| GB2391116A (en) * | 2002-07-15 | 2004-01-28 | Sumitomo Metal | Conductor paste for low temperature co-fired ceramic circuits |
| GB2391116B (en) * | 2002-07-15 | 2006-02-22 | Sumitomo Metal | Conductor paste,method of printing the conductor paste and method of fabricating ceramic circuit board |
| JP5364833B1 (en) * | 2012-10-03 | 2013-12-11 | Ｔｄｋ株式会社 | Conductive paste and ceramic substrate using the same |
| WO2014054671A1 (en) * | 2012-10-03 | 2014-04-10 | Tdk株式会社 | Conductive paste, and ceramic substrate produced using same |
| KR20150054935A (en) * | 2012-10-03 | 2015-05-20 | 티디케이가부시기가이샤 | Conductive paste, and ceramic substrate produced using same |
| US9585250B2 (en) | 2012-10-03 | 2017-02-28 | Tdk Corporation | Conductive paste and ceramic substrate manufactured using the same |
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