GB2391116B - Conductor paste,method of printing the conductor paste and method of fabricating ceramic circuit board - Google Patents
Conductor paste,method of printing the conductor paste and method of fabricating ceramic circuit boardInfo
- Publication number
- GB2391116B GB2391116B GB0315957A GB0315957A GB2391116B GB 2391116 B GB2391116 B GB 2391116B GB 0315957 A GB0315957 A GB 0315957A GB 0315957 A GB0315957 A GB 0315957A GB 2391116 B GB2391116 B GB 2391116B
- Authority
- GB
- United Kingdom
- Prior art keywords
- conductor paste
- printing
- circuit board
- ceramic circuit
- fabricating ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004020 conductor Substances 0.000 title 2
- 239000000919 ceramic Substances 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4867—Applying pastes or inks, e.g. screen printing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Automation & Control Theory (AREA)
- Ceramic Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Conductive Materials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0327735A GB2393332B (en) | 2002-07-15 | 2003-07-08 | Conductor paste, method of printing the conductor paste and method of fabricating ceramic circuit board |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002205152A JP2004047856A (en) | 2002-07-15 | 2002-07-15 | Conductive paste and printing method as well as manufacturing method of ceramic multilayer circuit board |
JP2002326959A JP2004165274A (en) | 2002-11-11 | 2002-11-11 | Manufacturing method of low-temperature calcination ceramic circuit substrate |
Publications (3)
Publication Number | Publication Date |
---|---|
GB0315957D0 GB0315957D0 (en) | 2003-08-13 |
GB2391116A GB2391116A (en) | 2004-01-28 |
GB2391116B true GB2391116B (en) | 2006-02-22 |
Family
ID=27759763
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0315957A Expired - Lifetime GB2391116B (en) | 2002-07-15 | 2003-07-08 | Conductor paste,method of printing the conductor paste and method of fabricating ceramic circuit board |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE10331811A1 (en) |
GB (1) | GB2391116B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9240526B2 (en) * | 2010-04-23 | 2016-01-19 | Cree, Inc. | Solid state light emitting diode packages with leadframes and ceramic material |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5727506A (en) * | 1980-07-25 | 1982-02-13 | Central Glass Co Ltd | Conductive paste |
US4514321A (en) * | 1983-08-25 | 1985-04-30 | E. I. Du Pont De Nemours And Company | Thick film conductor compositions |
JPH01232797A (en) * | 1988-03-11 | 1989-09-18 | Narumi China Corp | Ceramic multilayer circuit board |
JPH06216617A (en) * | 1993-01-18 | 1994-08-05 | Ngk Insulators Ltd | Dielectric filter and its manufacture and dielectric wiring board |
JP2002026528A (en) * | 2000-07-12 | 2002-01-25 | Hitachi Metals Ltd | Conductive paste and multilayer ceramic substrate |
JP2002141625A (en) * | 2000-10-30 | 2002-05-17 | Kyocera Corp | Circuit board |
-
2003
- 2003-07-08 GB GB0315957A patent/GB2391116B/en not_active Expired - Lifetime
- 2003-07-14 DE DE2003131811 patent/DE10331811A1/en not_active Withdrawn
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5727506A (en) * | 1980-07-25 | 1982-02-13 | Central Glass Co Ltd | Conductive paste |
US4514321A (en) * | 1983-08-25 | 1985-04-30 | E. I. Du Pont De Nemours And Company | Thick film conductor compositions |
JPH01232797A (en) * | 1988-03-11 | 1989-09-18 | Narumi China Corp | Ceramic multilayer circuit board |
JPH06216617A (en) * | 1993-01-18 | 1994-08-05 | Ngk Insulators Ltd | Dielectric filter and its manufacture and dielectric wiring board |
JP2002026528A (en) * | 2000-07-12 | 2002-01-25 | Hitachi Metals Ltd | Conductive paste and multilayer ceramic substrate |
JP2002141625A (en) * | 2000-10-30 | 2002-05-17 | Kyocera Corp | Circuit board |
Also Published As
Publication number | Publication date |
---|---|
GB2391116A (en) | 2004-01-28 |
GB0315957D0 (en) | 2003-08-13 |
DE10331811A1 (en) | 2004-02-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
732E | Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977) | ||
PE20 | Patent expired after termination of 20 years |
Expiry date: 20230707 |