JP2555536B2 - Method for manufacturing platinum temperature sensor - Google Patents
Method for manufacturing platinum temperature sensorInfo
- Publication number
- JP2555536B2 JP2555536B2 JP5261862A JP26186293A JP2555536B2 JP 2555536 B2 JP2555536 B2 JP 2555536B2 JP 5261862 A JP5261862 A JP 5261862A JP 26186293 A JP26186293 A JP 26186293A JP 2555536 B2 JP2555536 B2 JP 2555536B2
- Authority
- JP
- Japan
- Prior art keywords
- platinum
- paste
- resistor
- temperature sensor
- glaze
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Thermistors And Varistors (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Non-Adjustable Resistors (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は白金温度センサに係り、
特に厚膜印刷方式による白金温度センサの製造方法に関
する。BACKGROUND OF THE INVENTION The present invention relates to a platinum temperature sensor,
Especially regarding to <br/> to the method of manufacturing a platinum temperature sensor according to the thick film printing method.
【０００２】[0002]
【従来の技術】回路の温度補償、あるいは一般の温度計
測に用いられる白金温度センサは、抵抗体としての白金
被膜の抵抗が温度により変化することを利用したもので
ある。この温度センサは、従来薄膜方式と厚膜方式によ
って製造されていたが、厚膜方式では抵抗体に白金グレ
ーズペーストを用いるものと、白金有機化合物ペースト
を用いるものとがあった。2. Description of the Related Art A platinum temperature sensor used for temperature compensation of a circuit or for general temperature measurement utilizes that the resistance of a platinum film as a resistor changes with temperature. This temperature sensor has been conventionally manufactured by a thin film method and a thick film method. In the thick film method, there is a method using a platinum glaze paste for a resistor and a method using a platinum organic compound paste.
【０００３】薄膜方式では、絶縁体基板に白金をスパッ
タ等で着膜した後、王水等特殊な溶液によるエッチング
処理により、抵抗体を形成する方法がとられていた。こ
の方式は、微細加工が出来る半面、高価な白金という貴
金属をスパッタ装置のベルジャー内壁や治具等に余分な
着膜飛散を伴うため、不経済となるばかりでなく、真空
装置の操作等工数の増加により、製品コストが極めて高
くなってしまう。In the thin film method, a method of forming a resistor by depositing platinum on an insulating substrate by sputtering or the like and then performing an etching treatment with a special solution such as aqua regia. This method is not only uneconomical because it involves fine deposition of an expensive precious metal called platinum on the inner wall of the bell jar of the sputtering equipment, jigs, etc. The increase leads to extremely high product costs.
【０００４】厚膜印刷による白金グレーズ抵抗体方式で
は、白金グレーズペースト中に含有するガラス粒子のた
め、絶縁体基板への密着強度が高い安定な抵抗体被膜が
形成できるが、シート抵抗値が極端に低いため、抵抗体
のパターン引き回しが長くなり、小面積チップとしてい
わゆるチップ型部品に製品化することが極めて困難であ
った。In the platinum glaze resistor system by thick film printing, the glass particles contained in the platinum glaze paste can form a stable resistor film with high adhesion strength to the insulating substrate, but the sheet resistance value is extremely high. Since it is very low, the patterning of the resistor becomes long, and it is extremely difficult to commercialize it as a so-called chip type component as a small area chip.
【０００５】厚膜印刷による白金有機化合物抵抗体方式
では、白金有機化合物ペーストは、シート抵抗値が高い
ため、抵抗体パターンの設計がやりやすく、小面積チッ
プとしての製品化を行うことができるばかりでなく、抵
抗体の温度係数が大きいので温度センサとして使いやす
いという利点がある。しかし、ガラス分を含有していな
いため、絶縁体基板への密着強度が低く、製造工程の途
中で、抵抗体皮膜の剥離を引き起こしてしまい、製品歩
留りが悪くなるという、大きな問題点を有していた。In the platinum organic compound resistor system by thick film printing, the platinum organic compound paste has a high sheet resistance value, so that it is easy to design a resistor pattern and can be commercialized as a small area chip. Moreover, since the temperature coefficient of the resistor is large, there is an advantage that it is easy to use as a temperature sensor. However, since it does not contain glass, it has a low adhesion strength to the insulating substrate, causing peeling of the resistor film during the manufacturing process, resulting in poor product yield. Was there.
【０００６】[0006]
【発明が解決しようとする課題】本発明は、係る従来技
術の問題点に鑑み、表面実装等に利用可能な小さなチッ
プ面積で、厚膜抵抗体と絶縁体基板との密着強度が高
く、大きな温度係数を有し、比較的広い範囲で任意の抵
抗値に調整可能であり、且つ、製造コストの低い白金温
度センサを提供することを目的とするものである。SUMMARY OF THE INVENTION In view of the problems of the prior art, the present invention has a small chip area that can be used for surface mounting and the like, and has a high adhesion strength between a thick film resistor and an insulating substrate, which is large. An object of the present invention is to provide a platinum temperature sensor which has a temperature coefficient, can be adjusted to an arbitrary resistance value in a relatively wide range, and has a low manufacturing cost.
【０００７】[0007]
【課題を解決するための手段】本発明の白金温度センサ
の製造方法は、チップ型の絶縁体基板上に白金グレーズ
ペーストを塗布焼成し電極を形成する工程と、該電極間
に白金グレーズペーストと白金有機化合物をペーストを
重量比で約１：２の割合で混合したペーストを塗布焼成
し抵抗体を形成する工程と、該抵抗体に抵抗調整のため
の切込みを設ける工程とを備えたことを特徴とする。The platinum temperature sensor of the present invention.
The manufacturing method is to use a platinum glaze on a chip type insulator substrate.
A step of applying a paste and baking it to form electrodes, and
Platinum glaze paste and platinum organic compound paste
Apply and mix the paste mixed at a weight ratio of about 1: 2
For forming a resistor and adjusting the resistance of the resistor
And a step of providing a notch .
【０００８】[0008]
【作用】白金微粉末とホウケイ酸鉛ガラスを多量に含有
する白金グレーズペーストとガラス分を含有しない白金
有機化合物ペーストを重量比で１：２程度の割合で混合
したペーストを、絶縁体基板上の電極間に印刷し、焼成
することで、絶縁体基板面に密着強度が高く、シート抵
抗値の大きい、且つ抵抗温度係数の大きな、即ち、物理
的特性並びに電気的特性の優れた白金抵抗体を形成する
ことができる。従って、小さなチップ面積で、且つ初期
抵抗値のバラツキ幅が小さい，製品コストの低い、白金
温度センサを提供することが可能になる。[Function] A paste in which a platinum glaze paste containing a large amount of platinum fine powder and lead borosilicate glass and a platinum organic compound paste containing no glass are mixed at a weight ratio of about 1: 2 is formed on an insulating substrate. By printing between electrodes and baking, a platinum resistor with high adhesion strength to the surface of the insulating substrate, a large sheet resistance value, and a large temperature coefficient of resistance, that is, excellent physical and electrical characteristics, can be obtained. Can be formed. Therefore, it is possible to provide a platinum temperature sensor having a small chip area, a small variation width of the initial resistance value, and a low product cost.
【０００９】[0009]
【実施例】図１は、本発明の一実施例の白金温度センサ
で、（Ａ）は上面図、（Ｂ）は断面図である。純度９６
％のアルミナ（Ａｌ2 Ｏ3 ）を主成分とする絶縁体基板
１上には、白金（Ｐt ）グレーズペーストを印刷した
後、９００℃で１０分程度焼成して形成した白金グレー
ズ電極２を両端に配置してある。白金グレーズ電極２の
間には、白金グレーズペーストと白金有機化合物ペース
トを重量比で１：２の割合で充分混ぜ合わせた混合ペー
ストを印刷した後、９００℃で１０分間焼成した抵抗体
皮膜３が形成されている。この抵抗体皮膜は、一実施例
として、厚さ２μｍ、密着強度２kg／mm2 、ＴＲＣ３３
５１ ppm／℃、抵抗値Ｒのバラツキ幅６．２％、シート
抵抗３Ω／□であった。1 is a top view and FIG. 1B is a sectional view of a platinum temperature sensor according to an embodiment of the present invention. Purity 96
% Platinum (Al 2 O 3 ) as a main component, a platinum (P t ) glaze paste is printed on the insulating substrate 1 and then the platinum glaze electrode 2 is formed by firing at 900 ° C. for about 10 minutes. It is arranged at both ends. Between the platinum glaze electrodes 2 was printed a mixed paste in which the platinum glaze paste and the platinum organic compound paste were sufficiently mixed at a weight ratio of 1: 2, and then the resistor film 3 was fired at 900 ° C. for 10 minutes. Has been formed. As an example, this resistor film has a thickness of 2 μm, an adhesion strength of 2 kg / mm 2 , and TRC33.
It was 51 ppm / ° C., the variation width of the resistance value R was 6.2%, and the sheet resistance was 3 Ω / □.
【００１０】ここで、白金グレーズペーストは、粒度
０.３〜２.５μｍの白金微粉末７０ｗｔ％と硼珪酸鉛ガ
ラス１０ｗｔ％、８ｗｔ％エチルセルロースを含んだブ
チルカルビトール２０ｗｔ％を三本ロール等で充分混合
して作成してある。又、白金有機化合物ペーストは白金
のメルカプチド化合物をパインオイルで希釈し、粘度を
１００Ｐａ．Ｓ程度に調整し作成したものである。In the platinum glaze paste, 70 wt% of fine platinum powder having a particle size of 0.3 to 2.5 μm, 10 wt% of lead borosilicate glass, and 20 wt% of butyl carbitol containing 8 wt% ethyl cellulose are used in a three-roll mill or the like. It is made by mixing well. The platinum organic compound paste is prepared by diluting a platinum mercaptide compound with pine oil to give a viscosity of 100 Pa.s. It is prepared by adjusting to S level.
【００１１】こうして得られた混合ペーストの抵抗体皮
膜に、レーザ光トリミング６を１１０μｍピッチで１０
本入れることにより、１００Ωの初期抵抗値を得ること
ができる。Laser light trimming 6 is applied to the resistor film of the mixed paste thus obtained at a pitch of 110 μm.
By inserting this, it is possible to obtain an initial resistance value of 100Ω.
【００１２】レーザ光トリミング後、抵抗体皮膜３上
に、エポキシ樹脂を印刷し、１８０℃で２０分間熱処理
を行うことにより硬化させ、保護膜７を形成する。After the laser light trimming, an epoxy resin is printed on the resistor film 3 and cured by heat treatment at 180 ° C. for 20 minutes to form a protective film 7.
【００１３】この後は角形チップ抵抗と同様の工程即
ち、Ａｇ−Ｐｄ系電極４、並びに、Ｎｉ−半田（Ｓｎ，
Ｐｂ）メッキ層５を被着形成させることにより、チップ
型部品形状の白金温度センサを得ることができる。Thereafter, the same steps as those for the rectangular chip resistor, that is, the Ag-Pd system electrode 4 and the Ni-solder (Sn,
By depositing the Pb) plated layer 5, a platinum temperature sensor in the form of a chip component can be obtained.
【００１４】本発明の白金温度センサの特徴は、白金を
スパッタ等で着膜する不経済な方法を排し、スクリーン
印刷方式による厚膜抵抗体を形成する方法を採用するこ
とで、製造コストを低くおさえることが出来、更に白金
グレーズペーストと白金有機化合物ペーストの混合ペー
ストをスクリーン印刷し、焼成することで抵抗体皮膜を
形成したため、混合前の該両ペーストの欠点が隠れ、利
点がそのまま混合ペーストに残される結果となる。表１
は、本実施例の混合ペーストと従来技術の白金グレーズ
ペーストと白金有機化合物ペーストでそれぞれ製造した
温度センサの諸特性比較表である。The platinum temperature sensor of the present invention is characterized by eliminating the uneconomical method of depositing platinum by sputtering or the like and adopting the method of forming a thick film resistor by the screen printing method, thereby reducing the manufacturing cost. It can be kept low, and because a resistor film is formed by screen-printing a mixed paste of platinum glaze paste and platinum organic compound paste and firing it, the disadvantages of both pastes before mixing are hidden, and the advantage is the mixed paste. Will be left behind. Table 1
[Fig. 6] is a characteristic comparison table of temperature sensors manufactured with the mixed paste of this example, a conventional platinum glaze paste, and a platinum organic compound paste, respectively.
【００１５】[0015]
【表１】 [Table 1]
【００１６】混合前の白金グレーズペーストの抵抗膜厚
さが８μｍから２μｍに４分の１に減少し、シート抵抗
値が３００ｍΩ／□から３Ω／□に１００倍に増加した
ことで抵抗体のパターンの幅（Ｗ）に対する長さ（Ｌ）
の比（Ｌ／Ｗ）が、３００／１から３０／１に１０分の
１に低下させることができたため、従来は温度センサと
して使いやすい１００Ω程度の抵抗値の抵抗体を得るこ
とが殆どできなかったが、本発明の混合ペーストの採用
により、抵抗値の調整が極めて容易になったことが理解
できる。The resistance film thickness of the platinum glaze paste before mixing was reduced to 1/4 from 8 μm to 2 μm, and the sheet resistance was increased 100 times from 300 mΩ / □ to 3Ω / □. Width (W) to length (L)
Since the ratio (L / W) could be reduced to 1/10 from 300/1 to 30/1, it was almost possible to obtain a resistor with a resistance value of about 100Ω which is easy to use as a conventional temperature sensor. Although not, it can be understood that the resistance value can be adjusted extremely easily by adopting the mixed paste of the present invention.
【００１７】混合前の白金有機化合物ペーストの欠点で
あった絶縁体基板への密着強度が１kg／mm2 から２kg／
mm2 と２倍に向上したことで、製造工程中で発生してい
た抵抗体皮膜の剥離がなくなり、抵抗値Ｒのバラツキ幅
も３９％から６．２％に６分の１以下に抑えられる。The adhesion strength to the insulating substrate, which was a drawback of the platinum organic compound paste before mixing, was 1 kg / mm 2 to 2 kg /
mm 2 and it was improved twice, there is no peeling of the resistor film which has been generated in the production process, is suppressed variation range of the resistance value R from 39% to less than one-sixth of the 6.2% .
【００１８】尚、本発明の実施例では、白金グレーズペ
ーストと白金有機化合物ペーストの重量混合比を好適な
実施例として１：２即ち、３３ｗｔ％：６７ｗｔ％とし
た。白金有機化合物ペーストの比率を多くすると白金グ
レインが形成され、焼成温度の影響を受けやすくなり、
均一な皮膜が形成できなくなって、抵抗皮膜が部分的剥
離を起こし、製造工程歩留りと品質の低下を招くことと
なる。In the embodiment of the present invention, the weight mixing ratio of the platinum glaze paste and the platinum organic compound paste is 1: 2, that is, 33 wt%: 67 wt% as a preferred embodiment. When the ratio of the platinum organic compound paste is increased, platinum grains are formed and are easily affected by the firing temperature.
A uniform film cannot be formed, and the resistance film partially peels off, leading to a decrease in manufacturing process yield and quality.
【００１９】一方、白金グレーズペーストの比率を多く
すると、抵抗体皮膜のシート抵抗値Ｒが下がり、レーザ
光トリミングをしても、例えば１００Ω程度の抵抗体皮
膜を形成することが難しくなる。On the other hand, if the ratio of the platinum glaze paste is increased, the sheet resistance value R of the resistor film decreases, and it becomes difficult to form a resistor film of about 100Ω even with laser light trimming.
【００２０】[0020]
【発明の効果】以上に説明したように、本発明の白金温
度センサは、白金グレーズペーストと白金有機化合物ペ
ーストを重量比で約１：２の割合で混合した、ガラス分
を含有する白金有機化合物ペーストを抵抗体として形成
することで、製造工程中の抵抗体皮膜の剥離を起こさな
い、抵抗値Ｒのバラツキ幅の小さい、安定な厚膜抵抗体
を得ることができる。またシート抵抗値も３Ω／□と比
較的に高いため、レーザ光等により切り込みを設けて、
温度センサの抵抗値を例えば１００Ω程度と適当な値に
調整しやすく、抵抗体の温度係数も３３００ ｐｐｍ／
゜Ｃと大きくとれる。このように白金温度センサとして
優れた特性が得られ、量産性が良く、低い製造コストで
良好な諸特性を有する高密度実装等に適したチップ型部
品としての白金温度センサを提供することが可能とな
る。As described above, the platinum temperature sensor of the present invention is a platinum organic compound containing a glass component, which is a mixture of a platinum glaze paste and a platinum organic compound paste in a weight ratio of about 1: 2 . by forming a paste as a resistor, does not cause peeling of the resistor film in the manufacturing process, the variation range of the resistance value R of small, it is possible to obtain a stable thick film resistor. Also, the sheet resistance value is relatively high at 3Ω / □, so make a notch with laser light etc.
It is easy to adjust the resistance value of the temperature sensor to an appropriate value, for example, about 100Ω, and the temperature coefficient of the resistor is 3300 ppm /
° C and size Kutoreru. Thus, as a platinum temperature sensor
Provides excellent properties, mass productivity is good, it is possible to provide a platinum temperature sensor as a chip-type component which is suitable for high-density mounting or the like having a good characteristics at low manufacturing costs.
【図１】本発明の一実施例の白金温度センサの（Ａ）は
上面図、（Ｂ）は断面図。1A is a top view and FIG. 1B is a cross-sectional view of a platinum temperature sensor according to an embodiment of the present invention.
１ 絶縁体基板 ２ 白金グレーズ電極 ３ 白金混合ペーストにより焼成し形成された抵抗体 ４ 銀系電極 ５ メッキ層 ６ 切込み ７ 保護膜 1 Insulator Substrate 2 Platinum Glaze Electrode 3 Resistor Formed by Burning with Platinum Mixed Paste 4 Silver Electrode 5 Plating Layer 6 Notch 7 Protective Film
Claims (1)
ペーストを塗布焼成し電極を形成する工程と、該電極間
に白金グレーズペーストと白金有機化合物ペーストを重
量比で約１：２の割合で混合したペーストを塗布焼成し
抵抗体を形成する工程と、該抵抗体に抵抗調整のための
切込みを設ける工程とを備えたことを特徴とする白金温
度センサの製造方法。1. A step of coating and baking platinum glaze paste on a chip-type insulating substrate to form electrodes, and a platinum glaze paste and a platinum organic compound paste in a weight ratio of about 1: 2 between the electrodes. A method for manufacturing a platinum temperature sensor, comprising: a step of applying and firing the mixed paste to form a resistor; and a step of providing a notch for adjusting the resistance in the resistor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5261862A JP2555536B2 (en) | 1993-09-24 | 1993-09-24 | Method for manufacturing platinum temperature sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5261862A JP2555536B2 (en) | 1993-09-24 | 1993-09-24 | Method for manufacturing platinum temperature sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0792034A JPH0792034A (en) | 1995-04-07 |
| JP2555536B2 true JP2555536B2 (en) | 1996-11-20 |
Family
ID=17367791
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5261862A Expired - Fee Related JP2555536B2 (en) | 1993-09-24 | 1993-09-24 | Method for manufacturing platinum temperature sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2555536B2 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19750123C2 (en) * | 1997-11-13 | 2000-09-07 | Heraeus Electro Nite Int | Method for producing a sensor arrangement for temperature measurement |
| JP2007093453A (en) * | 2005-09-29 | 2007-04-12 | Mitsubishi Materials Corp | Surface-mounted temperature sensor |
| DE102015110607A1 (en) * | 2015-07-01 | 2017-01-05 | Epcos Ag | Method for producing an electrical component |
| KR20190004974A (en) * | 2017-07-05 | 2019-01-15 | 주식회사 이엠따블유 | Manufacturing method of sensor using printing process and sensor manufactured thereby |
| JP7219146B2 (en) * | 2019-04-17 | 2023-02-07 | Koa株式会社 | Manufacturing method of sulfuration detection sensor |
| JP7076045B1 (en) * | 2020-12-15 | 2022-05-26 | 株式会社メイコー | Thin temperature sensor |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0782921B2 (en) * | 1988-07-22 | 1995-09-06 | 松下電器産業株式会社 | Method of manufacturing thermal head |
-
1993
- 1993-09-24 JP JP5261862A patent/JP2555536B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0792034A (en) | 1995-04-07 |
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