JPS6352469B2 - - Google Patents

Info

Publication number
JPS6352469B2
JPS6352469B2 JP17260383A JP17260383A JPS6352469B2 JP S6352469 B2 JPS6352469 B2 JP S6352469B2 JP 17260383 A JP17260383 A JP 17260383A JP 17260383 A JP17260383 A JP 17260383A JP S6352469 B2 JPS6352469 B2 JP S6352469B2
Authority
JP
Japan
Prior art keywords
metal plate
conductive path
package
metal
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP17260383A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6064454A (ja
Inventor
Tomoji Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
YAMAMOTO Manufacturing
Original Assignee
YAMAMOTO Manufacturing
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by YAMAMOTO Manufacturing filed Critical YAMAMOTO Manufacturing
Priority to JP17260383A priority Critical patent/JPS6064454A/ja
Publication of JPS6064454A publication Critical patent/JPS6064454A/ja
Publication of JPS6352469B2 publication Critical patent/JPS6352469B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP17260383A 1983-09-19 1983-09-19 チツプキヤリアおよびその製造方法 Granted JPS6064454A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17260383A JPS6064454A (ja) 1983-09-19 1983-09-19 チツプキヤリアおよびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17260383A JPS6064454A (ja) 1983-09-19 1983-09-19 チツプキヤリアおよびその製造方法

Publications (2)

Publication Number Publication Date
JPS6064454A JPS6064454A (ja) 1985-04-13
JPS6352469B2 true JPS6352469B2 (enrdf_load_stackoverflow) 1988-10-19

Family

ID=15944917

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17260383A Granted JPS6064454A (ja) 1983-09-19 1983-09-19 チツプキヤリアおよびその製造方法

Country Status (1)

Country Link
JP (1) JPS6064454A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0758744B2 (ja) * 1987-04-02 1995-06-21 イビデン株式会社 半導体塔載用基板の製造方法

Also Published As

Publication number Publication date
JPS6064454A (ja) 1985-04-13

Similar Documents

Publication Publication Date Title
US5069626A (en) Plated plastic castellated interconnect for electrical components
US6107679A (en) Semiconductor device
US6389689B2 (en) Method of fabricating semiconductor package
JPH0399456A (ja) 半導体装置およびその製造方法
JPH01235170A (ja) マイクロ入出力ピンおよびその製造方法
KR920000076B1 (ko) 반도체장치
EP0623954B1 (en) Molded plastic packaging of electronic devices
TW518917B (en) A tape carrier for semiconductor and the manufacturing method for the semiconductor and this tape carrier
WO1989000346A1 (en) Plated plastic castellated interconnect for electrical components
JPH11176885A (ja) 半導体装置及びその製造方法、フィルムキャリアテープ、回路基板並びに電子機器
TW442929B (en) Semiconductor device and manufacture thereof
EP1545173A1 (en) Wiring circuit board
US10178768B2 (en) Mounting substrate, method for manufacturing a mounting substrate, and mounted structure including an electronic component
JPS6352469B2 (enrdf_load_stackoverflow)
JPH06177315A (ja) 多層リードフレーム
JPH025014B2 (enrdf_load_stackoverflow)
JP4663172B2 (ja) 半導体装置の製造方法
JPH05183017A (ja) Ｔａｂ用テープキャリア
JPH1074859A (ja) Ｑｆｎ半導体パッケージ
CN112151489B (zh) 引线框架、引线框架的形成方法及引线框架封装体
JP3699573B2 (ja) 半導体装置とそれに用いられる回路部材およびそれらの製造方法
JPS58134450A (ja) 半導体装置およびその製造方法
JPH01132147A (ja) 半導体装置
JPH0653383A (ja) 半導体素子搭載用基板の製造方法
JP2670505B2 (ja) 電子部品搭載用基板