JPS6352108B2 - - Google Patents
Info
- Publication number
- JPS6352108B2 JPS6352108B2 JP56141492A JP14149281A JPS6352108B2 JP S6352108 B2 JPS6352108 B2 JP S6352108B2 JP 56141492 A JP56141492 A JP 56141492A JP 14149281 A JP14149281 A JP 14149281A JP S6352108 B2 JPS6352108 B2 JP S6352108B2
- Authority
- JP
- Japan
- Prior art keywords
- electron beam
- ion plating
- electron gun
- substrate
- evaporated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000010894 electron beam technology Methods 0.000 claims description 19
- 238000007733 ion plating Methods 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 15
- 239000000126 substance Substances 0.000 claims description 14
- 230000008020 evaporation Effects 0.000 claims description 8
- 238000001704 evaporation Methods 0.000 claims description 8
- 230000007246 mechanism Effects 0.000 claims description 7
- 239000007789 gas Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 6
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000012495 reaction gas Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14149281A JPS5842771A (ja) | 1981-09-07 | 1981-09-07 | イオンプレ−テイング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14149281A JPS5842771A (ja) | 1981-09-07 | 1981-09-07 | イオンプレ−テイング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5842771A JPS5842771A (ja) | 1983-03-12 |
| JPS6352108B2 true JPS6352108B2 (xx) | 1988-10-18 |
Family
ID=15293175
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14149281A Granted JPS5842771A (ja) | 1981-09-07 | 1981-09-07 | イオンプレ−テイング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5842771A (xx) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2567843B2 (ja) * | 1986-06-04 | 1996-12-25 | 株式会社 昭和真空 | ハイブリツドイオンプレ−テイング方法とその装置 |
| DE4336680C2 (de) * | 1993-10-27 | 1998-05-14 | Fraunhofer Ges Forschung | Verfahren zum Elektronenstrahlverdampfen |
| JP4613045B2 (ja) * | 2004-10-26 | 2011-01-12 | 大日本印刷株式会社 | 圧力勾配型イオンプレーティング式成膜装置 |
| JP4613048B2 (ja) * | 2004-10-29 | 2011-01-12 | 大日本印刷株式会社 | 圧力勾配型イオンプレーティング式成膜装置 |
| JP4613050B2 (ja) * | 2004-11-04 | 2011-01-12 | 大日本印刷株式会社 | 圧力勾配型イオンプレーティング式成膜装置 |
| JP4613056B2 (ja) * | 2004-12-13 | 2011-01-12 | 大日本印刷株式会社 | 圧力勾配型イオンプレーティング式成膜装置および成膜方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51117984A (en) * | 1975-04-10 | 1976-10-16 | Matsushita Electric Ind Co Ltd | Ionization plating apparatus |
| JPS5223579A (en) * | 1975-08-19 | 1977-02-22 | Ulvac Corp | Activation reaction evaporating apparatus |
-
1981
- 1981-09-07 JP JP14149281A patent/JPS5842771A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51117984A (en) * | 1975-04-10 | 1976-10-16 | Matsushita Electric Ind Co Ltd | Ionization plating apparatus |
| JPS5223579A (en) * | 1975-08-19 | 1977-02-22 | Ulvac Corp | Activation reaction evaporating apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5842771A (ja) | 1983-03-12 |
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