JPS6351447B2 - - Google Patents

Info

Publication number
JPS6351447B2
JPS6351447B2 JP56064178A JP6417881A JPS6351447B2 JP S6351447 B2 JPS6351447 B2 JP S6351447B2 JP 56064178 A JP56064178 A JP 56064178A JP 6417881 A JP6417881 A JP 6417881A JP S6351447 B2 JPS6351447 B2 JP S6351447B2
Authority
JP
Japan
Prior art keywords
weight
resin
epoxy
parts
rubber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56064178A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57180626A (en
Inventor
Masanori Segawa
Masahiro Kitamura
Yasuhide Sugawara
Hiroshi Suzuki
Shunichi Numata
Kunihiko Nishi
Takashi Urano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Hitachi Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP6417881A priority Critical patent/JPS57180626A/ja
Publication of JPS57180626A publication Critical patent/JPS57180626A/ja
Publication of JPS6351447B2 publication Critical patent/JPS6351447B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP6417881A 1981-04-30 1981-04-30 Thermosetting resin composition Granted JPS57180626A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6417881A JPS57180626A (en) 1981-04-30 1981-04-30 Thermosetting resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6417881A JPS57180626A (en) 1981-04-30 1981-04-30 Thermosetting resin composition

Publications (2)

Publication Number Publication Date
JPS57180626A JPS57180626A (en) 1982-11-06
JPS6351447B2 true JPS6351447B2 (en, 2012) 1988-10-14

Family

ID=13250542

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6417881A Granted JPS57180626A (en) 1981-04-30 1981-04-30 Thermosetting resin composition

Country Status (1)

Country Link
JP (1) JPS57180626A (en, 2012)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6162514A (ja) * 1984-09-05 1986-03-31 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物
JPS6162511A (ja) * 1984-09-05 1986-03-31 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物
US5162437A (en) * 1989-03-15 1992-11-10 Sanyo Chemical Industries, Ltd. Epoxy resin composition with hydrogenated diene glycidyl ether
JPH0639563B2 (ja) * 1989-12-15 1994-05-25 株式会社日立製作所 半導体装置の製法
JPH05244493A (ja) * 1992-07-31 1993-09-21 Canon Inc 画像処理方法
JP4098107B2 (ja) * 2003-02-10 2008-06-11 株式会社クラレ 熱硬化性樹脂組成物
JP4098108B2 (ja) * 2003-02-10 2008-06-11 株式会社クラレ エポキシ樹脂組成物
KR100690221B1 (ko) * 2003-02-10 2007-03-12 가부시키가이샤 구라레 에폭시 수지 조성물

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51135936A (en) * 1975-05-20 1976-11-25 Nitto Electric Ind Co Ltd Adhesive composition
JPS53101051A (en) * 1977-02-15 1978-09-04 Matsushita Electric Works Ltd Epoxy resin composition
JPS6035926B2 (ja) * 1978-06-28 1985-08-17 松下電器産業株式会社 エポキシ樹脂組成物

Also Published As

Publication number Publication date
JPS57180626A (en) 1982-11-06

Similar Documents

Publication Publication Date Title
EP0174510B1 (en) Epoxy resin composition for encapsulation of semiconductor device
JPH0329259B2 (en, 2012)
EP0384774A2 (en) Semiconductor device encapsulant
CN107250235A (zh) 用于封装半导体装置的组成物及使用其封装的半导体装置
KR20100130966A (ko) 반도체 밀봉용 에폭시 수지 조성물 및 이를 이용한 반도체 장치
EP0439171B1 (en) Epoxy resin composition and semiconductor device encapsulated therewith
JPS6351447B2 (en, 2012)
KR930003510B1 (ko) 에폭시 수지 조성물
JP2768088B2 (ja) 熱硬化性樹脂組成物及び半導体装置
JPS6248968B2 (en, 2012)
JP2643706B2 (ja) 熱硬化性樹脂組成物及び半導体装置
JP3876944B2 (ja) 半導体封止用エポキシ樹脂組成物及び半導体装置
JP2954412B2 (ja) エポキシ樹脂組成物
JP2001151863A (ja) 半導体封止用エポキシ樹脂組成物
JP2616265B2 (ja) 熱硬化性樹脂組成物
JPH0733429B2 (ja) エポキシ樹脂組成物
KR101933273B1 (ko) 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자
JP2595854B2 (ja) エポキシ樹脂組成物及びその硬化物
JP2816290B2 (ja) 樹脂封止型半導体装置
JPH0588904B2 (en, 2012)
JP2658749B2 (ja) 半導体封止用樹脂組成物及び半導体装置
JP3611439B2 (ja) マイクロカプセル型りん系硬化促進剤とそれを用いた半導体封止用エポキシ樹脂組成物
JP3359445B2 (ja) 樹脂組成物
JPH11335527A (ja) 半導体封止用エポキシ樹脂組成物
KR102126050B1 (ko) 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 장치