JPS6348125Y2 - - Google Patents

Info

Publication number
JPS6348125Y2
JPS6348125Y2 JP19135482U JP19135482U JPS6348125Y2 JP S6348125 Y2 JPS6348125 Y2 JP S6348125Y2 JP 19135482 U JP19135482 U JP 19135482U JP 19135482 U JP19135482 U JP 19135482U JP S6348125 Y2 JPS6348125 Y2 JP S6348125Y2
Authority
JP
Japan
Prior art keywords
wire
spool
bonding
guide
electrical contacts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP19135482U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5996832U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1982191354U priority Critical patent/JPS5996832U/ja
Publication of JPS5996832U publication Critical patent/JPS5996832U/ja
Application granted granted Critical
Publication of JPS6348125Y2 publication Critical patent/JPS6348125Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP1982191354U 1982-12-20 1982-12-20 ワイヤ−ボンデイング装置のワイヤ−供給装置におけるワイヤ−弛みの検知機構 Granted JPS5996832U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982191354U JPS5996832U (ja) 1982-12-20 1982-12-20 ワイヤ−ボンデイング装置のワイヤ−供給装置におけるワイヤ−弛みの検知機構

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982191354U JPS5996832U (ja) 1982-12-20 1982-12-20 ワイヤ−ボンデイング装置のワイヤ−供給装置におけるワイヤ−弛みの検知機構

Publications (2)

Publication Number Publication Date
JPS5996832U JPS5996832U (ja) 1984-06-30
JPS6348125Y2 true JPS6348125Y2 (enExample) 1988-12-12

Family

ID=30412087

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982191354U Granted JPS5996832U (ja) 1982-12-20 1982-12-20 ワイヤ−ボンデイング装置のワイヤ−供給装置におけるワイヤ−弛みの検知機構

Country Status (1)

Country Link
JP (1) JPS5996832U (enExample)

Also Published As

Publication number Publication date
JPS5996832U (ja) 1984-06-30

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