JPS5996832U - ワイヤ−ボンデイング装置のワイヤ−供給装置におけるワイヤ−弛みの検知機構 - Google Patents

ワイヤ−ボンデイング装置のワイヤ−供給装置におけるワイヤ−弛みの検知機構

Info

Publication number
JPS5996832U
JPS5996832U JP1982191354U JP19135482U JPS5996832U JP S5996832 U JPS5996832 U JP S5996832U JP 1982191354 U JP1982191354 U JP 1982191354U JP 19135482 U JP19135482 U JP 19135482U JP S5996832 U JPS5996832 U JP S5996832U
Authority
JP
Japan
Prior art keywords
wire
detection mechanism
supply device
slack detection
bonding equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1982191354U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6348125Y2 (enExample
Inventor
古徳　康郎
知行 生駒
Original Assignee
海上電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 海上電機株式会社 filed Critical 海上電機株式会社
Priority to JP1982191354U priority Critical patent/JPS5996832U/ja
Publication of JPS5996832U publication Critical patent/JPS5996832U/ja
Application granted granted Critical
Publication of JPS6348125Y2 publication Critical patent/JPS6348125Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP1982191354U 1982-12-20 1982-12-20 ワイヤ−ボンデイング装置のワイヤ−供給装置におけるワイヤ−弛みの検知機構 Granted JPS5996832U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982191354U JPS5996832U (ja) 1982-12-20 1982-12-20 ワイヤ−ボンデイング装置のワイヤ−供給装置におけるワイヤ−弛みの検知機構

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982191354U JPS5996832U (ja) 1982-12-20 1982-12-20 ワイヤ−ボンデイング装置のワイヤ−供給装置におけるワイヤ−弛みの検知機構

Publications (2)

Publication Number Publication Date
JPS5996832U true JPS5996832U (ja) 1984-06-30
JPS6348125Y2 JPS6348125Y2 (enExample) 1988-12-12

Family

ID=30412087

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982191354U Granted JPS5996832U (ja) 1982-12-20 1982-12-20 ワイヤ−ボンデイング装置のワイヤ−供給装置におけるワイヤ−弛みの検知機構

Country Status (1)

Country Link
JP (1) JPS5996832U (enExample)

Also Published As

Publication number Publication date
JPS6348125Y2 (enExample) 1988-12-12

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