JPS6348122Y2 - - Google Patents

Info

Publication number
JPS6348122Y2
JPS6348122Y2 JP6648682U JP6648682U JPS6348122Y2 JP S6348122 Y2 JPS6348122 Y2 JP S6348122Y2 JP 6648682 U JP6648682 U JP 6648682U JP 6648682 U JP6648682 U JP 6648682U JP S6348122 Y2 JPS6348122 Y2 JP S6348122Y2
Authority
JP
Japan
Prior art keywords
wiring
circuit
bonding pads
region
pellet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP6648682U
Other languages
English (en)
Japanese (ja)
Other versions
JPS58170833U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1982066486U priority Critical patent/JPS58170833U/ja
Publication of JPS58170833U publication Critical patent/JPS58170833U/ja
Application granted granted Critical
Publication of JPS6348122Y2 publication Critical patent/JPS6348122Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Wire Bonding (AREA)
JP1982066486U 1982-05-07 1982-05-07 半導体集積回路 Granted JPS58170833U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982066486U JPS58170833U (ja) 1982-05-07 1982-05-07 半導体集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982066486U JPS58170833U (ja) 1982-05-07 1982-05-07 半導体集積回路

Publications (2)

Publication Number Publication Date
JPS58170833U JPS58170833U (ja) 1983-11-15
JPS6348122Y2 true JPS6348122Y2 (enExample) 1988-12-12

Family

ID=30076354

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982066486U Granted JPS58170833U (ja) 1982-05-07 1982-05-07 半導体集積回路

Country Status (1)

Country Link
JP (1) JPS58170833U (enExample)

Also Published As

Publication number Publication date
JPS58170833U (ja) 1983-11-15

Similar Documents

Publication Publication Date Title
US6902951B2 (en) Electronic device configured as a multichip module, leadframe, panel with leadframe positions, and method for producing the electronic device
US4654689A (en) Structure of power supply wirings in semiconductor integrated circuit
JPH0362934A (ja) 集積回路パツケージ
JP2580301B2 (ja) 半導体集積回路装置
JP2004207723A (ja) フリップチップｆｅｔ素子
US6306744B1 (en) Filter capacitor construction
JPH09283632A (ja) 半導体集積回路装置
JPH0290651A (ja) 半導体集積回路
JP3407025B2 (ja) 半導体装置及びその製造方法
US6114903A (en) Layout architecture for core I/O buffer
CN1033116C (zh) 互补金属氧化物半导体集成电路
EP0344873B1 (en) Semiconductor integrated-circuit apparatus
JPS621247A (ja) 半導体装置の製造方法
US9659868B2 (en) Semiconductor apparatus
JPS6348122Y2 (enExample)
US9070550B2 (en) Semiconductor device and manufacturing method thereof
JP2001177056A (ja) 半導体集積回路装置
CN216213447U (zh) 功率模块封装
US5554881A (en) Constitution of an electrode arrangement in a semiconductor element
JPH0434307B2 (enExample)
US20040051174A1 (en) Electronic device with a voltage supply structure, semiconductor wafer with electronic devices, and associated production methods
JP3378811B2 (ja) 半導体集積回路装置
JP2008124072A (ja) 半導体装置
JPH0823029A (ja) 半導体集積回路装置及びその設計方法
CN119730255A (zh) 3d芯片封装结构