JPS58170833U - 半導体集積回路 - Google Patents

半導体集積回路

Info

Publication number
JPS58170833U
JPS58170833U JP1982066486U JP6648682U JPS58170833U JP S58170833 U JPS58170833 U JP S58170833U JP 1982066486 U JP1982066486 U JP 1982066486U JP 6648682 U JP6648682 U JP 6648682U JP S58170833 U JPS58170833 U JP S58170833U
Authority
JP
Japan
Prior art keywords
integrated circuit
semiconductor integrated
arranged close
bonding pads
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1982066486U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6348122Y2 (enExample
Inventor
二見　治司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1982066486U priority Critical patent/JPS58170833U/ja
Publication of JPS58170833U publication Critical patent/JPS58170833U/ja
Application granted granted Critical
Publication of JPS6348122Y2 publication Critical patent/JPS6348122Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Wire Bonding (AREA)
JP1982066486U 1982-05-07 1982-05-07 半導体集積回路 Granted JPS58170833U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982066486U JPS58170833U (ja) 1982-05-07 1982-05-07 半導体集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982066486U JPS58170833U (ja) 1982-05-07 1982-05-07 半導体集積回路

Publications (2)

Publication Number Publication Date
JPS58170833U true JPS58170833U (ja) 1983-11-15
JPS6348122Y2 JPS6348122Y2 (enExample) 1988-12-12

Family

ID=30076354

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982066486U Granted JPS58170833U (ja) 1982-05-07 1982-05-07 半導体集積回路

Country Status (1)

Country Link
JP (1) JPS58170833U (enExample)

Also Published As

Publication number Publication date
JPS6348122Y2 (enExample) 1988-12-12

Similar Documents

Publication Publication Date Title
JPH04307943A (ja) 半導体装置
JPS58170833U (ja) 半導体集積回路
JPS6039254U (ja) 半導体集積回路装置
JPH0770666B2 (ja) 集積回路装置実装パツケ−ジ
JPS58109254U (ja) フエ−スダウン接続形チツプ用チツプキヤリヤ−
JPS6022327A (ja) 半導体装置
JPS606253U (ja) ブリツジ型半導体装置
JPS609226U (ja) 半導体の実装用パツケ−ジ
JPS58131638U (ja) 混成集積回路装置
JPS60147126A (ja) 半導体装置
JPS5881940U (ja) 半導体素子の取付構造
JPS63310155A (ja) 半導体集積回路装置
JPS59165440A (ja) 集積回路パツケ−ジ
JPS6081664U (ja) 集積回路パツケ−ジ
JPS5842940U (ja) 混成集積回路装置
JPS6142849U (ja) 半導体装置
JPH0350842A (ja) 半導体装置
JPS6033457U (ja) 半導体装置
JPS6088574U (ja) チツプキヤリア型パツケ−ジ接続構造
JPS5989542U (ja) モノリシツク集積回路容器
JPS6115753U (ja) 半導体装置
JPS60133644U (ja) 集積回路用リ−ドフレ−ム
JPS59131159U (ja) 半導体装置
JPS6030539U (ja) 半導体装置
JPS60149166U (ja) 混成集積回路装置