JPS6347794B2 - - Google Patents
Info
- Publication number
- JPS6347794B2 JPS6347794B2 JP56084567A JP8456781A JPS6347794B2 JP S6347794 B2 JPS6347794 B2 JP S6347794B2 JP 56084567 A JP56084567 A JP 56084567A JP 8456781 A JP8456781 A JP 8456781A JP S6347794 B2 JPS6347794 B2 JP S6347794B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- nozzle
- anode
- plating liquid
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 177
- 239000007788 liquid Substances 0.000 claims description 76
- 239000010949 copper Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000005192 partition Methods 0.000 description 4
- 239000010802 sludge Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 238000013019 agitation Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56084567A JPS57200598A (en) | 1981-06-02 | 1981-06-02 | Plating apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56084567A JPS57200598A (en) | 1981-06-02 | 1981-06-02 | Plating apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57200598A JPS57200598A (en) | 1982-12-08 |
JPS6347794B2 true JPS6347794B2 (zh) | 1988-09-26 |
Family
ID=13834234
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56084567A Granted JPS57200598A (en) | 1981-06-02 | 1981-06-02 | Plating apparatus |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57200598A (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60132465U (ja) * | 1984-02-14 | 1985-09-04 | 上村工業株式会社 | 板状ワ−クの処理装置 |
JPH0762271B2 (ja) * | 1985-08-09 | 1995-07-05 | 日本電装株式会社 | 部分めつき装置 |
JPH01290792A (ja) * | 1988-05-17 | 1989-11-22 | Katayama Tokushu Kogyo Kk | 金属多孔体及びその製造方法並びに製造装置 |
JPH0393255A (ja) * | 1989-09-05 | 1991-04-18 | Hitachi Cable Ltd | リードフレームの両面部分めっき方法および装置 |
JP2003321796A (ja) * | 2002-04-30 | 2003-11-14 | Nitto Denko Corp | めっき装置およびそれを用いた配線基板の製造方法 |
-
1981
- 1981-06-02 JP JP56084567A patent/JPS57200598A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS57200598A (en) | 1982-12-08 |
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