JPS6347255B2 - - Google Patents
Info
- Publication number
- JPS6347255B2 JPS6347255B2 JP56212106A JP21210681A JPS6347255B2 JP S6347255 B2 JPS6347255 B2 JP S6347255B2 JP 56212106 A JP56212106 A JP 56212106A JP 21210681 A JP21210681 A JP 21210681A JP S6347255 B2 JPS6347255 B2 JP S6347255B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- silicon
- polycrystalline silicon
- single crystal
- silicon film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H01L21/02675—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
- H01L21/02683—Continuous wave laser beam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02381—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02488—Insulating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02587—Structure
- H01L21/0259—Microstructure
- H01L21/02598—Microstructure monocrystalline
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H01L21/02689—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using particle beams
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H01L21/02691—Scanning of a beam
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Materials Engineering (AREA)
- Recrystallisation Techniques (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56212106A JPS58116721A (ja) | 1981-12-30 | 1981-12-30 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56212106A JPS58116721A (ja) | 1981-12-30 | 1981-12-30 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58116721A JPS58116721A (ja) | 1983-07-12 |
JPS6347255B2 true JPS6347255B2 (enrdf_load_stackoverflow) | 1988-09-21 |
Family
ID=16616974
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56212106A Granted JPS58116721A (ja) | 1981-12-30 | 1981-12-30 | 半導体装置の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58116721A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0291556A (ja) * | 1988-09-29 | 1990-03-30 | Fujikura Ltd | 酸素濃度分析計 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0773095B2 (ja) * | 1985-08-20 | 1995-08-02 | 沖電気工業株式会社 | 半導体装置の製造方法 |
-
1981
- 1981-12-30 JP JP56212106A patent/JPS58116721A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0291556A (ja) * | 1988-09-29 | 1990-03-30 | Fujikura Ltd | 酸素濃度分析計 |
Also Published As
Publication number | Publication date |
---|---|
JPS58116721A (ja) | 1983-07-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4448632A (en) | Method of fabricating semiconductor devices | |
JPH0582442A (ja) | 多結晶半導体薄膜の製造方法 | |
JPS6347255B2 (enrdf_load_stackoverflow) | ||
JPS6322056B2 (enrdf_load_stackoverflow) | ||
Lasky | Effects of various encapsulating films on laser recrystallization of silicon on SiO2 | |
JPS61154121A (ja) | 半導体装置の製造方法 | |
JPS6159820A (ja) | 半導体装置の製造方法 | |
JP3104080B2 (ja) | 半導体基体の処理方法 | |
JPS59111999A (ja) | 単結晶絶縁膜の熱処理方法 | |
JPS5983993A (ja) | 単結晶半導体層の成長方法 | |
JPS6185815A (ja) | 多結晶シリコン膜の形成方法 | |
JPS58175844A (ja) | 半導体装置の製造方法 | |
JPS5853824A (ja) | 半導体装置の製造方法 | |
JPH0221137B2 (enrdf_load_stackoverflow) | ||
JPH0851218A (ja) | 薄膜トランジスタの形成方法 | |
JP2745055B2 (ja) | 単結晶半導体薄膜の製造方法 | |
TW379383B (en) | Method of forming large or selective area of silicon on insulation layer | |
JPH0799742B2 (ja) | 半導体装置の製造方法 | |
JP3144707B2 (ja) | 結晶基材の製造方法 | |
JP2807296B2 (ja) | 半導体単結晶層の製造方法 | |
JPS59158515A (ja) | 半導体装置の製造方法 | |
JPS6351370B2 (enrdf_load_stackoverflow) | ||
JPS5837919A (ja) | 半導体装置の製造方法 | |
JPS5831515A (ja) | 半導体薄膜の製造方法 | |
JPH0722120B2 (ja) | 半導体装置の製造方法 |