JPS634706B2 - - Google Patents

Info

Publication number
JPS634706B2
JPS634706B2 JP55167489A JP16748980A JPS634706B2 JP S634706 B2 JPS634706 B2 JP S634706B2 JP 55167489 A JP55167489 A JP 55167489A JP 16748980 A JP16748980 A JP 16748980A JP S634706 B2 JPS634706 B2 JP S634706B2
Authority
JP
Japan
Prior art keywords
package
melting point
low melting
brazing material
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55167489A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5791541A (en
Inventor
Noriaki Shiba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP55167489A priority Critical patent/JPS5791541A/ja
Publication of JPS5791541A publication Critical patent/JPS5791541A/ja
Publication of JPS634706B2 publication Critical patent/JPS634706B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161Cap
    • H01L2924/1615Shape
    • H01L2924/16195Flat cap [not enclosing an internal cavity]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP55167489A 1980-11-28 1980-11-28 Manufacture of semiconductor device Granted JPS5791541A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55167489A JPS5791541A (en) 1980-11-28 1980-11-28 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55167489A JPS5791541A (en) 1980-11-28 1980-11-28 Manufacture of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5791541A JPS5791541A (en) 1982-06-07
JPS634706B2 true JPS634706B2 (enExample) 1988-01-30

Family

ID=15850621

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55167489A Granted JPS5791541A (en) 1980-11-28 1980-11-28 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5791541A (enExample)

Also Published As

Publication number Publication date
JPS5791541A (en) 1982-06-07

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