JPS634706B2 - - Google Patents
Info
- Publication number
- JPS634706B2 JPS634706B2 JP55167489A JP16748980A JPS634706B2 JP S634706 B2 JPS634706 B2 JP S634706B2 JP 55167489 A JP55167489 A JP 55167489A JP 16748980 A JP16748980 A JP 16748980A JP S634706 B2 JPS634706 B2 JP S634706B2
- Authority
- JP
- Japan
- Prior art keywords
- package
- melting point
- low melting
- brazing material
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55167489A JPS5791541A (en) | 1980-11-28 | 1980-11-28 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55167489A JPS5791541A (en) | 1980-11-28 | 1980-11-28 | Manufacture of semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5791541A JPS5791541A (en) | 1982-06-07 |
| JPS634706B2 true JPS634706B2 (enExample) | 1988-01-30 |
Family
ID=15850621
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55167489A Granted JPS5791541A (en) | 1980-11-28 | 1980-11-28 | Manufacture of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5791541A (enExample) |
-
1980
- 1980-11-28 JP JP55167489A patent/JPS5791541A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5791541A (en) | 1982-06-07 |
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