JPS6346150B2 - - Google Patents
Info
- Publication number
- JPS6346150B2 JPS6346150B2 JP20590785A JP20590785A JPS6346150B2 JP S6346150 B2 JPS6346150 B2 JP S6346150B2 JP 20590785 A JP20590785 A JP 20590785A JP 20590785 A JP20590785 A JP 20590785A JP S6346150 B2 JPS6346150 B2 JP S6346150B2
- Authority
- JP
- Japan
- Prior art keywords
- etching
- layer metal
- metal
- layer
- etched
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 49
- 229910052751 metal Inorganic materials 0.000 claims description 49
- 238000005530 etching Methods 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 16
- 229910052737 gold Inorganic materials 0.000 description 16
- 239000010931 gold Substances 0.000 description 16
- 229910001120 nichrome Inorganic materials 0.000 description 12
- 239000011521 glass Substances 0.000 description 6
- 238000000151 deposition Methods 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000005406 washing Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 2
- 238000004506 ultrasonic cleaning Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Landscapes
- ing And Chemical Polishing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20590785A JPS6286181A (ja) | 1985-09-18 | 1985-09-18 | 多層膜金属板のエツチング方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20590785A JPS6286181A (ja) | 1985-09-18 | 1985-09-18 | 多層膜金属板のエツチング方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6286181A JPS6286181A (ja) | 1987-04-20 |
| JPS6346150B2 true JPS6346150B2 (enExample) | 1988-09-13 |
Family
ID=16514727
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20590785A Granted JPS6286181A (ja) | 1985-09-18 | 1985-09-18 | 多層膜金属板のエツチング方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6286181A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2904367B2 (ja) * | 1991-06-17 | 1999-06-14 | 矢崎総業株式会社 | 雌端子 |
-
1985
- 1985-09-18 JP JP20590785A patent/JPS6286181A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6286181A (ja) | 1987-04-20 |
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