JPS6286181A - 多層膜金属板のエツチング方法 - Google Patents
多層膜金属板のエツチング方法Info
- Publication number
- JPS6286181A JPS6286181A JP20590785A JP20590785A JPS6286181A JP S6286181 A JPS6286181 A JP S6286181A JP 20590785 A JP20590785 A JP 20590785A JP 20590785 A JP20590785 A JP 20590785A JP S6286181 A JPS6286181 A JP S6286181A
- Authority
- JP
- Japan
- Prior art keywords
- layer metal
- etching
- metal
- metallic plate
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005530 etching Methods 0.000 title claims abstract description 42
- 238000000034 method Methods 0.000 title claims description 10
- 239000002184 metal Substances 0.000 claims abstract description 61
- 229910052751 metal Inorganic materials 0.000 claims abstract description 61
- 239000000758 substrate Substances 0.000 claims abstract description 8
- 238000004506 ultrasonic cleaning Methods 0.000 claims abstract description 5
- 238000001035 drying Methods 0.000 abstract description 5
- 238000005406 washing Methods 0.000 abstract description 4
- 238000004140 cleaning Methods 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 238000007747 plating Methods 0.000 abstract 1
- 238000007740 vapor deposition Methods 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 17
- 229910052737 gold Inorganic materials 0.000 description 17
- 239000010931 gold Substances 0.000 description 17
- 229910001120 nichrome Inorganic materials 0.000 description 13
- 239000011521 glass Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Landscapes
- ing And Chemical Polishing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20590785A JPS6286181A (ja) | 1985-09-18 | 1985-09-18 | 多層膜金属板のエツチング方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20590785A JPS6286181A (ja) | 1985-09-18 | 1985-09-18 | 多層膜金属板のエツチング方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6286181A true JPS6286181A (ja) | 1987-04-20 |
| JPS6346150B2 JPS6346150B2 (enExample) | 1988-09-13 |
Family
ID=16514727
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20590785A Granted JPS6286181A (ja) | 1985-09-18 | 1985-09-18 | 多層膜金属板のエツチング方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6286181A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04368781A (ja) * | 1991-06-17 | 1992-12-21 | Yazaki Corp | 雌端子 |
-
1985
- 1985-09-18 JP JP20590785A patent/JPS6286181A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04368781A (ja) * | 1991-06-17 | 1992-12-21 | Yazaki Corp | 雌端子 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6346150B2 (enExample) | 1988-09-13 |
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