JPS6345812Y2 - - Google Patents

Description

[Detailed Description of the Invention] This invention relates to a composite surge absorber.

BACKGROUND ART Surge absorbers made of a voltage nonlinear resistor or a series circuit of a capacitor and a resistor have been used to prevent surges in electronic devices and circuits or to eliminate sparks at switch contacts. Since these surge absorbers can increase the surge absorption effect by using them in parallel rather than by using them alone, in some cases, they have been used in parallel. but,
Merely connecting individual independent surge absorbers in parallel causes the following drawbacks, and sometimes the surge absorbing effect is not sufficiently exerted, and sometimes it cannot be used practically.

(1) Since individual surge absorbers are connected in parallel through terminals (mainly lead wires), the impedance due to the inductance of the lead wires increases, resulting in sharp wave response, which is an important performance of surge absorbers. properties are impaired, and sufficient surge absorption effect is not achieved.

(2) For use by connecting two parts together, for example between the contacts of a relay,
They may be bulky and cannot be used in electronic circuits where high density integration is a common trend.

(3) It is extremely complicated to calculate the surge energy sharing between the CR surge absorber and the voltage nonlinear resistor surge absorber, and to make the corresponding selections every time they are used.

(4) Since each surge absorber is an independent surge absorber, each has its own terminal and protective coating, making it expensive.

Therefore, an object of this invention is to provide a composite surge absorber that has good surge absorption characteristics, can be miniaturized, and is simple and inexpensive.

In the composite surge absorber of this invention, high-temperature sintered capacitors, resistors, and voltage nonlinear resistors are used, and chip-type or print-on type types have also been commercialized. , we focused on the fact that electrode patterns can be designed relatively freely and that insulating films for individual components can be easily formed using low-melting glass (powder printing type). One type is used as a substrate, the electrode structure is divided on it, a pattern is formed so that a voltage non-linear resistor, a capacitor, and a ladder are connected in series in a closed loop, and three types are integrated by chip or printing baking. The components were assembled (integrated), and the terminals were attached and protective coating was applied to integrate them.

An embodiment of this invention is shown in FIGS. 1 and 2. That is, as shown in FIG. 1, in this surge absorber, two sets of opposing electrodes 2, 4 and electrodes 3, 5 are fabricated on both sides of a sintered resistor substrate 1.
Insulating layers 6 and 7 are formed between electrodes 3 and between electrodes 4 and 5.
With this structure, between electrodes 2 and 5 and between electrodes 3 and 5,
Resistance can be obtained between 4 and 4. Next, a chip type voltage nonlinear resistor 8 is connected between electrode 2 and electrode 3, and electrode 4
By soldering a chip capacitor 9 between the electrode 5 and the electrode 5, a composite surge absorber can be obtained. Of these, electrodes 2 and 3 serve as external connection terminals.

FIG. 2A is a circuit diagram conforming to the structure of FIGS. 1A, B, and C. Among these, the electrode 2 shown in FIG.
3. If the distance between electrodes 2, 5, electrodes 4, 5, and electrodes 3, 4 is made larger than the distance between electrodes 2, 3 and electrodes 4, 5, the resistance 1
The resistance values of 0' and 10'' are negligibly large compared to that of the resistor 10, and the equivalent circuit of the structure shown in FIG. 1 becomes substantially as shown in FIG. 2B.

After the terminals are connected, this composite surge absorber is coated with a protective coating on the entire surface except for the terminals.

As a result of this configuration, the following effects were produced.

() The connection of the sintered resistor substrate 1, the chip type voltage nonlinear resistor 8, and the chip type capacitor 9 is as follows.
Since the pattern of electrodes 2 to 5 is used, the surge impedance against steep wave surges can be reduced compared to connecting with lead wires, and the surge absorption effect can be significantly improved.

() In terms of shape, it can be smaller than a similar configuration made by connecting individual parts, and can be fully mounted in highly integrated electronic circuits.

() The constants (characteristic values, rated power, withstand power, etc.) of the sintered resistor substrate 1, chip type voltage nonlinear resistor 8, and capacitor 9 can be set to optimal values in advance, making it possible to use individual components. There is no need to design each individual component as you normally would.

() Terminals and protective coatings can be used in common for the three types of structures, and the connections between the three types of structures can be made using a pattern of electrodes 2 to 5, reducing man-hours. It can be manufactured more cheaply than those connected individually.

() Since the sintered resistor substrate 1 is used, the size of the resistor can be made larger than other parts, so a large energy surge can be absorbed by this resistor.

As described above, the composite surge absorber of this invention has good surge absorption characteristics, can be miniaturized, and is simple and inexpensive.

[Brief explanation of the drawing]

Figures 1A, B, and C are respectively a front view, a back view, and a side view of the embodiment of this invention, and Figure 2A is the first embodiment of the invention.
A circuit diagram according to the structure shown in the figure, Figure 2B is the same as the circuit diagram shown in Figure 1.
FIG. 2 is an equivalent circuit diagram of FIG. 1... Sintered resistor substrate, 2-5... Electrode, 6,
7... Insulating layer, 8... Chip type voltage nonlinear resistance,
9... Chip type capacitor.

Claims (1)

[Scope of utility model registration request] A resistor substrate, first and second electrodes formed on one main surface of the substrate, and a third electrode formed on the other main surface of the substrate opposite to the first and second electrodes.
a fourth electrode, a first insulating layer formed on the one principal surface between the first and second electrodes;
a second insulating layer formed on the other main surface between the fourth electrodes; a voltage nonlinear resistor connected to the first and second electrodes and disposed on the first insulating layer;
and a capacitor connected to the third and fourth electrodes and disposed on the second insulating layer.