JPS6223224Y2 - - Google Patents

Description

[Detailed Description of the Invention] This invention relates to a composite surge absorber.

BACKGROUND ART Surge absorbers made of a voltage nonlinear resistor or a series circuit of a capacitor and a resistor have been used to prevent surges in electronic devices and circuits or to eliminate sparks at switch contacts. Since these surge absorbers can increase the surge absorption effect by using them in parallel rather than by using them alone, in some cases, they have been used in parallel. but,
Merely connecting individual independent surge absorbers in parallel causes the following drawbacks, and sometimes the surge absorbing effect is not sufficiently exerted, and sometimes it cannot be used practically.

(1) Since individual surge absorbers are connected in parallel through terminals (mainly lead wires), the impedance due to the inductance of the lead wires increases, and steep waves are an important characteristic of surge absorbers. Responsiveness is impaired,
Does not exhibit sufficient surge absorption effect.

(2) For use by connecting two parts together, for example between the contacts of a relay,
They may be bulky and cannot be used in electronic circuits where high density integration is a common trend.

(3) Calculation of the surge energy sharing between the CR surge absorber and the voltage nonlinear resistor surge absorber and the associated selection must be performed every time they are used, which is extremely complicated.

(4) Since each is an independent surge absorber, each has its own terminal and protective coating, making it expensive.

Therefore, an object of this invention is to provide a composite surge absorber that has good surge absorption characteristics, can be miniaturized, and is simple and inexpensive.

In the composite surge absorber of this invention, high-temperature sintered capacitors, resistors, and voltage nonlinear resistors are used, and chip-type or print-on type types have also been commercialized. , we focused on the fact that electrode patterns can be designed relatively freely and that insulating films for individual components can be easily formed using low-melting glass (powder printing type). One type is used as a substrate, the electrode structure is divided on it, a pattern is formed so that a voltage non-linear resistor, a capacitor, and a resistor are connected in series in a closed loop, and three types are integrated by chip or printing baking. It is made by configuring (integrating) parts, attaching terminals, and applying protective coating.

An embodiment of this invention is shown in FIGS. 1 and 2. In other words, this composite surge absorber
As shown in the figure, electrodes 5 and 6 are printed and baked on one side of the voltage nonlinear resistance substrate 1, and an electrode 7 (which becomes an intermediate electrode between the electrodes 5 and 6) is printed and baked on the other side.
An insulating layer 2 made of low melting point glass or the like is formed between the holes 6 by a glass powder melting baking method or the like. At approximately the center of this insulating layer 2, an electrode 8 is further formed of a metal having a low baking temperature. A resistor is printed between electrodes 5 and 8, and chip capacitors are soldered between electrodes 6 and 8 to form 3 and 4, respectively.

With such a configuration, a voltage non-linear resistance is formed between electrodes 5 and 7, and electrode 7 is further connected to electrode 6.
Similarly, a voltage non-linear resistance is formed between the two voltage non-linear resistances, resulting in a structure in which two voltage non-linear resistances are connected in series. Further, a resistor 3 is provided between the electrodes 5 and 8, and a chip capacitor 4 is provided between the electrodes 8 and 6, and these are connected to the voltage nonlinear resistance substrate 1 by the insulating layer 2. is insulated, so
The structure is such that a series connection portion of a chip capacitor 4 and a resistor 3 is connected in parallel with a voltage non-linear resistor. Of these, electrodes 5 and 6 serve as external connection terminals.

FIG. 2A is a circuit diagram conforming to the structure of FIGS. 1A, B, and C. In Figure 2 A, 1' is the electrode 5, 6
Although the voltage nonlinear resistance formed by the surface layer of the substrate 1 is the voltage nonlinear resistance between the electrodes 5 and 7, the distance between the electrodes 5 and 6 is shown in the figure rather than the sum of the distances between the electrodes 5 and 7 and between the electrodes 6 and 7. If you increase the voltage so that It will be possible. As a result, the equivalent circuit of the structure shown in FIG. 1 becomes substantially as shown in FIG. 2B.

After the terminals are connected, this composite surge absorber is coated with a protective coating on the entire surface except for the terminals.

As a result of this configuration, the following effects were produced.

() The voltage nonlinear resistance board 1, the resistor 3, and the chip capacitor 4 are connected through the electrodes 5, 6,
Since the 7 and 8 patterns are used, the surge impedance against steep wave surges can be reduced compared to connecting with lead wires, and the surge absorption effect can be significantly improved.

() In terms of shape, it can be smaller than a similar configuration made by connecting individual parts, and can be fully mounted in highly integrated electronic circuits.

() The constants (characteristic values, rated power, withstand voltage, etc.) of the voltage nonlinear resistance board 1, the resistor 3, and the capacitor 4 can be set to optimal values in advance, and they can be adjusted individually as when using individual components. There is no need to design the parts.

() Terminals and protective coatings can be used in common for the three types of structures, and the three types of structures can be connected using the pattern of electrodes 5, 6, 7, and 8, reducing the number of man-hours. It can be manufactured more cheaply than those in which seed structures are individually connected.

As described above, the composite surge absorber of this invention has good surge absorption characteristics, can be miniaturized, and is simple and inexpensive.

[Brief explanation of the drawing]

Figures 1A, B, and C are respectively a front view, a back view, and a side view of the first embodiment of this invention; Figure 2A
1 is a circuit diagram corresponding to the structure shown in FIG. 1, and FIG. 2B is an equivalent circuit diagram of FIG. 1. 1... Voltage nonlinear resistor substrate, 2... Insulating layer,
3...Resistor, 4...Chip type capacitor, 5-8
……electrode.

Claims (1)

[Scope of utility model registration request] a voltage non-linear resistance substrate, a first electrode formed on one main surface of the substrate, and second and third electrodes formed on the other main surface of the substrate opposite to the first electrode.
an insulating layer formed on the other main surface between the second and third electrodes, a fourth electrode formed on the insulating layer, and an electrode between the second electrode and the fourth electrode. A composite surge absorber comprising: a resistor connected between electrodes and disposed on the insulating layer; and a capacitor connected to the third electrode and the fourth electrode and disposed on the insulating layer.