JPS6343448U - - Google Patents
Info
- Publication number
- JPS6343448U JPS6343448U JP13574586U JP13574586U JPS6343448U JP S6343448 U JPS6343448 U JP S6343448U JP 13574586 U JP13574586 U JP 13574586U JP 13574586 U JP13574586 U JP 13574586U JP S6343448 U JPS6343448 U JP S6343448U
- Authority
- JP
- Japan
- Prior art keywords
- light
- integrated circuit
- resin
- transmissive resin
- circuit element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 239000000919 ceramic Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図ａ〜ｄは本考案の一実施例及びその製造
方法を説明するために工程順に示した断面図であ
り、第１図ｄが本実施例の断面図、第２図は従来
の集積回路装置の一例の断面図である。
１……リードフレーム、２……集積回路素子、
３……金属細線、４……透明樹脂（光透過性樹脂
）、５……樹脂（光非透過性樹脂）、６……セラ
ミツクキヤツプ、７……低融点ガラス、８……セ
ラミツクケース、９……高融点ガラス。
1A to 1D are cross-sectional views shown in the order of steps to explain an embodiment of the present invention and its manufacturing method, FIG. 1D is a sectional view of the present embodiment, and FIG. 2 is a conventional integrated circuit. FIG. 2 is a cross-sectional view of an example of a circuit device. 1...Lead frame, 2...Integrated circuit element,
3... Metal thin wire, 4... Transparent resin (light-transmitting resin), 5... Resin (light-opaque resin), 6... Ceramic cap, 7... Low melting point glass, 8... Ceramic case, 9 ...High melting point glass.
Claims (1)
透過性樹脂と、該光透過性樹脂の少なくとも一部
が露出するように被覆された光非透過性樹脂とを
有し、外部から内部の集積回路素子の光学的操作
が可能であることを特徴とする集積回路装置。 It has an integrated circuit element, a light-transmissive resin that seals the integrated circuit element, and a light-impermeable resin that covers the light-transmissive resin so that at least a portion of the light-transmissive resin is exposed. An integrated circuit device characterized in that integrated circuit elements can be optically manipulated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13574586U JPS6343448U (en) | 1986-09-03 | 1986-09-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13574586U JPS6343448U (en) | 1986-09-03 | 1986-09-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6343448U true JPS6343448U (en) | 1988-03-23 |
Family
ID=31038227
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13574586U Pending JPS6343448U (en) | 1986-09-03 | 1986-09-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6343448U (en) |
-
1986
- 1986-09-03 JP JP13574586U patent/JPS6343448U/ja active Pending
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