JPS6341918U - - Google Patents
Info
- Publication number
- JPS6341918U JPS6341918U JP13716186U JP13716186U JPS6341918U JP S6341918 U JPS6341918 U JP S6341918U JP 13716186 U JP13716186 U JP 13716186U JP 13716186 U JP13716186 U JP 13716186U JP S6341918 U JPS6341918 U JP S6341918U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- line
- semiconductor device
- dielectric substrate
- microstrip line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
Landscapes
- Waveguides (AREA)
Description
第１図はこの考案の一実施例による周波数変換
器を形成するマイクロ波導体装置の構成図、第２
図は従来のマイクロ波半導体装置の構成図である
。
図において、１はストリツプ線路、３はストリ
ツプ線路―コプレナ線路変換部、４はコプレナ線
路、５はミクサダイオード、８はストリツプ線路
―スロツト線路変換部、９は信号減衰用抵抗、１
０は基板誘電体層、１２はスロツト線路、１５は
スルーホールである。なお、図中、同一符号は同
一、又は相当部分を示す。
Figure 1 is a block diagram of a microwave conductor device forming a frequency converter according to an embodiment of this invention;
The figure is a configuration diagram of a conventional microwave semiconductor device. In the figure, 1 is a strip line, 3 is a strip line-coplanar line converter, 4 is a coplanar line, 5 is a mixer diode, 8 is a strip line-slot line converter, 9 is a signal attenuation resistor, 1
0 is a substrate dielectric layer, 12 is a slot line, and 15 is a through hole. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
マイクロストリツプ線路、他方の面にスロツト線
路又はコプレナ線路が形成されたマイクロ半導体
装置において、上記誘電体基板にスルホールを設
け、このスルホールを介して表裏を結合させるこ
とにより、上記マイクロストリツプ線路の形成面
側に回路素子（部品）を実装したことを特徴とす
るマイクロ波半導体装置。 In a micro semiconductor device in which a microstrip line is formed on one side of a dielectric substrate for a microwave integrated circuit, and a slot line or a coplanar line is formed on the other side, a through hole is provided in the dielectric substrate, and a through hole is formed through the through hole. A microwave semiconductor device characterized in that a circuit element (component) is mounted on the side where the microstrip line is formed by bonding the front and back sides together.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13716186U JPS6341918U (en) | 1986-09-05 | 1986-09-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13716186U JPS6341918U (en) | 1986-09-05 | 1986-09-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6341918U true JPS6341918U (en) | 1988-03-19 |
Family
ID=31040955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13716186U Pending JPS6341918U (en) | 1986-09-05 | 1986-09-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6341918U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57183101A (en) * | 1981-05-07 | 1982-11-11 | Nec Corp | Microwave circuit |
-
1986
- 1986-09-05 JP JP13716186U patent/JPS6341918U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57183101A (en) * | 1981-05-07 | 1982-11-11 | Nec Corp | Microwave circuit |
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