JPH0361703U - - Google Patents
Info
- Publication number
- JPH0361703U JPH0361703U JP12213889U JP12213889U JPH0361703U JP H0361703 U JPH0361703 U JP H0361703U JP 12213889 U JP12213889 U JP 12213889U JP 12213889 U JP12213889 U JP 12213889U JP H0361703 U JPH0361703 U JP H0361703U
- Authority
- JP
- Japan
- Prior art keywords
- chassis
- center conductor
- microstrip line
- metal envelope
- gold ribbon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
Description
第１図はこの考案の一実施例によるマイクロ波
集積回路装置を示す断面側面図、第２図は同装置
の斜視図、第３図は同装置に用いられる金属外囲
器を示す斜視図、第４図は同装置に用いられる誘
電体基板を示す斜視図、第５図は従来のマイクロ
波集積回路装置を示す断面側面図、第６図は、同
装置の要部の斜視図である。
１は高周波同軸コネクタ、２は中心導体、３は
誘電体基板、３ａはマイクロストリツプ線路、４
は金リボン、８は金属外囲器、１０は弾力性のあ
る樹脂。なお、図中、同一符号は同一、又は相当
部分を示す。
FIG. 1 is a cross-sectional side view showing a microwave integrated circuit device according to an embodiment of the invention, FIG. 2 is a perspective view of the device, and FIG. 3 is a perspective view showing a metal envelope used in the device. FIG. 4 is a perspective view showing a dielectric substrate used in the device, FIG. 5 is a sectional side view showing a conventional microwave integrated circuit device, and FIG. 6 is a perspective view of the main parts of the device. 1 is a high frequency coaxial connector, 2 is a center conductor, 3 is a dielectric substrate, 3a is a microstrip line, 4
1 is a gold ribbon, 8 is a metal envelope, and 10 is an elastic resin. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
を有する高周波同軸コネクタと、上記シヤーシに
設けられマイクロストリツプ線路を有する誘電体
基板と、上記中心導体と上記マイクロストリツプ
線路とを接続する金リボンと、上記中心導体と上
記金リボンとの接続部の周囲を覆う金属外囲器と
、上記金属外囲器の内部に充填された弾力性を有
する樹脂とを備えたマイクロ波集積回路装置。 a chassis, a high frequency coaxial connector provided on the chassis and having a center conductor, a dielectric substrate provided on the chassis and having a microstrip line, and a gold ribbon connecting the center conductor and the microstrip line. A microwave integrated circuit device comprising: a metal envelope surrounding a connecting portion between the center conductor and the gold ribbon; and an elastic resin filled in the metal envelope.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12213889U JPH0361703U (en) | 1989-10-18 | 1989-10-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12213889U JPH0361703U (en) | 1989-10-18 | 1989-10-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0361703U true JPH0361703U (en) | 1991-06-17 |
Family
ID=31670150
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12213889U Pending JPH0361703U (en) | 1989-10-18 | 1989-10-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0361703U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20180001526U (en) * | 2016-11-14 | 2018-05-24 | 친산 시에 | An alerting device |
-
1989
- 1989-10-18 JP JP12213889U patent/JPH0361703U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20180001526U (en) * | 2016-11-14 | 2018-05-24 | 친산 시에 | An alerting device |
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