JPS61189606U - - Google Patents
Info
- Publication number
- JPS61189606U JPS61189606U JP7172785U JP7172785U JPS61189606U JP S61189606 U JPS61189606 U JP S61189606U JP 7172785 U JP7172785 U JP 7172785U JP 7172785 U JP7172785 U JP 7172785U JP S61189606 U JPS61189606 U JP S61189606U
- Authority
- JP
- Japan
- Prior art keywords
- dielectric
- board
- ground conductor
- substrate
- insert
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims 1
Landscapes
- Waveguides (AREA)
Description
第１図は本考案一実施例の断面図、第２図は同
上の他の実施例の断面図、第３図は従来例の断面
図、第４図は他の従来例の断面図である。
１は接地導体基板、２は誘電体基板、３はマイ
クロストリツプライン、４はマイクロ波素子、５
は信号線、６は貫通孔、７は誘電体棒、８は接地
金属筒である。
Fig. 1 is a sectional view of one embodiment of the present invention, Fig. 2 is a sectional view of another embodiment of the same, Fig. 3 is a sectional view of a conventional example, and Fig. 4 is a sectional view of another conventional example. . 1 is a ground conductor substrate, 2 is a dielectric substrate, 3 is a microstrip line, 4 is a microwave element, 5
1 is a signal line, 6 is a through hole, 7 is a dielectric rod, and 8 is a ground metal tube.
Claims (1)
とともに、上記誘電体基板の表面上にマイクロス
トリツプラインを形成してマイクロ波素子を構成
し、接地導体基板の裏表面に配置された高周波回
路からの信号線を接地導体基板および誘電体基板
を貫通してマイクロストリツプラインに接続して
成るマイクロ波回路において、接地導体基板およ
び誘電体基板に貫通孔を穿設し、上記貫通孔に中
央に信号線が貫通された誘電体棒を挿入するとと
もに、誘電体棒の外周面の少なくとも誘電体基板
に対応する部分の要所に接地導体基板に接続され
た接地金属筒を外挿したことを特徴とするマイク
ロ波回路。 A dielectric substrate is bonded onto the surface of the ground conductor substrate, and microstrip lines are formed on the surface of the dielectric substrate to constitute a microwave element, and a high frequency circuit is placed on the back surface of the ground conductor substrate. In a microwave circuit in which a signal line from a ground conductor board and a dielectric board are connected to a microstrip line by passing through a ground conductor board and a dielectric board, a through hole is formed in the ground conductor board and the dielectric board, and a center line is inserted into the through hole. Insert a dielectric rod through which a signal line is passed through the dielectric rod, and insert a ground metal tube connected to a ground conductor board at key points on at least the portion of the outer peripheral surface of the dielectric rod that corresponds to the dielectric board. Characteristic microwave circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7172785U JPS61189606U (en) | 1985-05-15 | 1985-05-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7172785U JPS61189606U (en) | 1985-05-15 | 1985-05-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61189606U true JPS61189606U (en) | 1986-11-26 |
Family
ID=30609479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7172785U Pending JPS61189606U (en) | 1985-05-15 | 1985-05-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61189606U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60101A (en) * | 1983-06-16 | 1985-01-05 | Toshiba Corp | Coaxial/microstrip line converter |
-
1985
- 1985-05-15 JP JP7172785U patent/JPS61189606U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60101A (en) * | 1983-06-16 | 1985-01-05 | Toshiba Corp | Coaxial/microstrip line converter |