JPS6339118B2 - - Google Patents
Info
- Publication number
- JPS6339118B2 JPS6339118B2 JP57156157A JP15615782A JPS6339118B2 JP S6339118 B2 JPS6339118 B2 JP S6339118B2 JP 57156157 A JP57156157 A JP 57156157A JP 15615782 A JP15615782 A JP 15615782A JP S6339118 B2 JPS6339118 B2 JP S6339118B2
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- electronic component
- flat package
- electronic components
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005476 soldering Methods 0.000 claims description 25
- 229910000679 solder Inorganic materials 0.000 claims description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 239000011295 pitch Substances 0.000 description 5
- 229910052742 iron Inorganic materials 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57156157A JPS5946096A (ja) | 1982-09-08 | 1982-09-08 | フラットパッケ−ジ形電子部品のはんだ付け装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57156157A JPS5946096A (ja) | 1982-09-08 | 1982-09-08 | フラットパッケ−ジ形電子部品のはんだ付け装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5946096A JPS5946096A (ja) | 1984-03-15 |
JPS6339118B2 true JPS6339118B2 (sk) | 1988-08-03 |
Family
ID=15621589
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57156157A Granted JPS5946096A (ja) | 1982-09-08 | 1982-09-08 | フラットパッケ−ジ形電子部品のはんだ付け装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5946096A (sk) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0346560Y2 (sk) * | 1984-12-25 | 1991-10-01 | ||
JPS6377194A (ja) * | 1986-09-19 | 1988-04-07 | 富士通株式会社 | リフロ−ボンデイング方法 |
JPH0752800B2 (ja) * | 1988-04-26 | 1995-06-05 | 株式会社カイジョー | アウターリードボンディング装置 |
JPH036900A (ja) * | 1989-06-03 | 1991-01-14 | Tdk Corp | 部品認識方法及び装置 |
-
1982
- 1982-09-08 JP JP57156157A patent/JPS5946096A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5946096A (ja) | 1984-03-15 |
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