JPS6338856B2 - - Google Patents

Info

Publication number

JPS6338856B2

JPS6338856B2 JP56089495A JP8949581A JPS6338856B2 JP S6338856 B2 JPS6338856 B2 JP S6338856B2 JP 56089495 A JP56089495 A JP 56089495A JP 8949581 A JP8949581 A JP 8949581A JP S6338856 B2 JPS6338856 B2 JP S6338856B2

Authority

JP

Japan

Prior art keywords

feedthrough capacitor

laminate

chip

ground conductor

conductor

Prior art date

1981-06-12

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004020 conductor Substances 0.000 claims description 45
• 239000003990 capacitor Substances 0.000 claims description 30
• 239000002131 composite material Substances 0.000 claims description 8
• 229910052751 metal Inorganic materials 0.000 claims description 7
• 239000002184 metal Substances 0.000 claims description 7
• 230000008878 coupling Effects 0.000 claims description 3
• 238000010168 coupling process Methods 0.000 claims description 3
• 238000005859 coupling reaction Methods 0.000 claims description 3
• 238000010030 laminating Methods 0.000 claims 1
• 230000002265 prevention Effects 0.000 claims 1
• 239000000843 powder Substances 0.000 description 4
• 229910000679 solder Inorganic materials 0.000 description 4
• 238000010586 diagram Methods 0.000 description 3
• 229910052802 copper Inorganic materials 0.000 description 2
• 239000010949 copper Substances 0.000 description 2
• 238000003475 lamination Methods 0.000 description 2
• 238000004519 manufacturing process Methods 0.000 description 2
• 238000000034 method Methods 0.000 description 2
• 229910052759 nickel Inorganic materials 0.000 description 2
• 238000007747 plating Methods 0.000 description 2
• 229910052709 silver Inorganic materials 0.000 description 2
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• 229910010413 TiO 2 Inorganic materials 0.000 description 1
• 239000011230 binding agent Substances 0.000 description 1
• 239000011889 copper foil Substances 0.000 description 1
• 238000010304 firing Methods 0.000 description 1
• 150000002739 metals Chemical class 0.000 description 1
• 229910052763 palladium Inorganic materials 0.000 description 1
• 238000005476 soldering Methods 0.000 description 1
• 239000000758 substrate Substances 0.000 description 1
• 229910052718 tin Inorganic materials 0.000 description 1