JPS6337877B2 - - Google Patents
Info
- Publication number
- JPS6337877B2 JPS6337877B2 JP55090609A JP9060980A JPS6337877B2 JP S6337877 B2 JPS6337877 B2 JP S6337877B2 JP 55090609 A JP55090609 A JP 55090609A JP 9060980 A JP9060980 A JP 9060980A JP S6337877 B2 JPS6337877 B2 JP S6337877B2
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- protrusions
- dissipation fins
- heat
- fins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000017525 heat dissipation Effects 0.000 claims description 39
- 230000005855 radiation Effects 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 description 18
- 238000009413 insulation Methods 0.000 description 4
- 239000012212 insulator Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000005219 brazing Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9060980A JPS5716792A (en) | 1980-07-04 | 1980-07-04 | Heat radiator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9060980A JPS5716792A (en) | 1980-07-04 | 1980-07-04 | Heat radiator |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5716792A JPS5716792A (en) | 1982-01-28 |
JPS6337877B2 true JPS6337877B2 (de) | 1988-07-27 |
Family
ID=14003212
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9060980A Granted JPS5716792A (en) | 1980-07-04 | 1980-07-04 | Heat radiator |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5716792A (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4427854C2 (de) * | 1993-08-06 | 2002-01-10 | Mitsubishi Electric Corp | Kühlvorrichtung und Montageverfahren dafür |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50115355A (de) * | 1974-02-25 | 1975-09-09 |
-
1980
- 1980-07-04 JP JP9060980A patent/JPS5716792A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50115355A (de) * | 1974-02-25 | 1975-09-09 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4427854C2 (de) * | 1993-08-06 | 2002-01-10 | Mitsubishi Electric Corp | Kühlvorrichtung und Montageverfahren dafür |
Also Published As
Publication number | Publication date |
---|---|
JPS5716792A (en) | 1982-01-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0233916B1 (de) | Aus aufeinandergestapelten kühlrippen bestehender kühlkörper | |
US6958915B2 (en) | Heat dissipating device for electronic component | |
US4753290A (en) | Reduced-stress heat sink device | |
JP3406753B2 (ja) | 半導体装置および半導体モジュール | |
US7684197B2 (en) | Memory module assembly having heat sinks with improved structure | |
JP4432892B2 (ja) | 半導体冷却構造 | |
JPH0157502B2 (de) | ||
KR20120025432A (ko) | 반도체 장치 | |
JPS6337877B2 (de) | ||
JP5793295B2 (ja) | 半導体装置 | |
EP2509123A2 (de) | Thermoelektrisches Umwandlungsmodul | |
JPH047860A (ja) | 半導体スタック | |
JPH04256397A (ja) | ヒートパイプ式半導体スタック | |
JP2001024125A (ja) | 平形半導体素子 | |
JP2522403B2 (ja) | サ―モモジュ―ル | |
EP0441572A2 (de) | Leistungshalbleiter mit wärmeableitenden Eigenschaften | |
JP5180614B2 (ja) | 熱電変換装置 | |
JP2004153267A (ja) | 機械的に充分可撓性のあるサーマルインターフェース・パッド | |
JP2924788B2 (ja) | ヒートシンク構造 | |
US9997431B2 (en) | Electronic device provided with a thermal dissipation member | |
JPH08172150A (ja) | 放熱器 | |
JPS6233332Y2 (de) | ||
JP2002016218A (ja) | 多数の回路モジュールの配置 | |
JPS6246318Y2 (de) | ||
JP2605434Y2 (ja) | 複合半導体装置 |