JPS6337877B2 - - Google Patents

Description

[Detailed description of the invention] The present invention relates to improvements in heat sinks.

A heat radiator is generally formed by bonding and fixing a plurality of heat radiating fins to the outer wall of a main body at predetermined intervals. By the way, in order to maintain the distance between the plurality of heat dissipation fins, each fin is provided with a protrusion, but since the protrusions face in the same direction, the protrusion faces outward at the end of the heat dissipation fin. As a result, the protrusions often become a hindrance, resulting in restrictions on use. This point will be specifically explained using a semiconductor stack equipped with a heat sink. That is, heat sinks are placed above and below the semiconductor element,
In a semiconductor stack that is energized by inserting a main circuit connector into the top surface of the top heatsink and the bottom surface of the bottom heatsink, the opposite end heatsink fins of each heatsink placed with the semiconductor element sandwiched therein are Since the protrusions are placed facing each other facing outward, the insulation gap between these protrusions becomes narrow, which poses a problem. Also,
When the protrusion of the endmost heat dissipation fin faces toward the main circuit connector, the insulation gap becomes narrower and becomes clogged with dust, causing problems with the creepage distance of the connector insulation. Therefore, there was a drawback that the semiconductor stack had to be large in order to secure the above-mentioned space.

An object of the present invention is to provide a heatsink that can miniaturize devices such as semiconductor stacks using the heatsink.The feature is that the protrusions of the heatsinks are arranged in the same direction so that adjacent heatsinks do not overlap. sequentially
Rotate 180 degrees and join and fix to the main body while stacking them,
and the plurality of protrusions of the adjacent heat dissipation fins are
When shifted by 180 degrees, the heat dissipation fins are provided at a position that is more than the maximum width of the protrusion, and the heat dissipation fins at the ends of the heat dissipation fins are stacked upside down so that the protrusion faces inward, and thereby, Since the protrusion of the heat dissipation fin at the end of the heat dissipator does not face outward, the insulation is not obstructed, and devices such as semiconductor stacks using the heat dissipator can be downsized.

Hereinafter, one embodiment of the present invention will be described in detail with reference to the drawings. Figure 1 shows the overall structure of a semiconductor stack, where 1 is the main body, 2 is a heat sink, 3 is a heat sink, 4 is a flat semiconductor element, 5 is a main circuit connector, 6 is a protrusion, and 7 and 8 are pressure plates. , 9 is a tightening bolt, and 10 is an insulator. This semiconductor stack includes a flat semiconductor element 4, a radiator having a plurality of heat radiating fins 3 attached to a main body 1, and a main circuit connector 5, which are connected to an insulator 10 by pressure plates 7, 8 and tightening bolts 9. It is pressurized with a predetermined force through the duct, and is electrically and thermally connected. Next, the second
The specific structure of the heat radiator 2 will be explained with reference to FIG. 3, FIG. 4, and FIG. First, as shown in FIG. 2, projections 6 are formed on the heat radiation fin 3 using a punch or the like. Here, as a representation of the protrusion 6 shown in FIG. 2, the mark ◯ indicates a concave shape, and the mark ● indicates a convex shape. All of the heat dissipation fins 3 are manufactured in the state shown in FIG. The protrusions 6 of the heat dissipation fins are manufactured so that they are spaced apart by more than the maximum width of the protrusions.
The state B in FIG. 2 is the state A turned over in the horizontal direction, and the state C in FIG. 2 is the state A turned over in the vertical direction. Incidentally, the relationship between B and C indicates that the positions are different by 180° on the same plane. Because the arrangement of the multiple protrusions is asymmetrical, the positions of these protrusions are such that when state B is superimposed on state C, the convexity of C does not match the concavity of B, and when state A is superimposed on B, the position of these protrusions is The convexity of A and the convexity of A do not match.

Therefore, when the heat dissipation fins 3 are bonded and fixed to the main body 1, the heat dissipation fins 3 are arranged in the order of A, B, H, B, H, . . . B, C from the left side as shown in FIG. In other words, from the right end of the main body 1 to the heat dissipation fin 3
Alternately install the heat dissipation fins 3 one by one in the state of C, B, H, B...C, B, and then install the last one in the state of A, and solder these heat dissipation fins 3 to the outer peripheral surface of the main body 1. Join and fix with a bolt etc.

As described above, in this embodiment, one type of heat dissipation fin shown in A is used, and the stacking of the protrusions is devised to keep the interval between the heat dissipation fins constant, and the protrusion 6 of the endmost fin is moved inward. It has no protrusions on its outer surface. There are no protrusions of the heat dissipation fins in the gaps _G1 and _G2 mentioned above, and even if the heat dissipation fins are turned over, the opposing protrusions do not overlap, so the overlapping dimensions of the entire heat dissipation fins do not increase. , G ₁ and G ₂ can be made smaller than in the past, and the semiconductor stack can be made smaller and lighter. Additionally, in the past, the protrusions of the heat dissipation fins were used either upward or downward depending on the structure of the semiconductor stack. (The radiator was used either upwards or downwards so that the protrusions would be in positions where they would not occur.)
However, according to this embodiment, since there is no protrusion, it can be used in any direction, up or down, and assembly efficiency is improved.

Another embodiment of the present invention will be described with reference to FIGS. 5 to 7. Conventionally, connection terminals of semiconductor elements are attached to predetermined locations on a group of heat dissipation fins stacked together. Therefore, since the heat dissipation fin to which this terminal is attached has a different shape from other fins, it is not possible to manufacture a plurality of heat dissipation fins using the same cutting die. Further, it has the disadvantage that the number of man-hours required to manufacture the heat radiator, such as brazing the terminals and the heat radiating fins, increases and the cost becomes high. This embodiment was developed to solve this problem, and will be explained below with reference to FIGS. 5 to 7. The shape and arrangement of the projections 6A of each heat radiation fin 3A are the same as in FIGS. 2 to 4. 5, 6, and 7, the shape of the outer periphery of the heat dissipation fin 3A is first cut out as shown in A of FIG.
The other pair of diagonal corners B are wiring holes for connection terminals of the semiconductor element. That is, the notch C and the wiring hole B are provided at symmetrical positions. The heat dissipation fin shown in Figure 5 (B) is obtained by turning the state shown in (A) over in the left and right direction.
The state C in FIG. 5 shows the state A reversed in the vertical direction. Furthermore, the relationship between Ro and Ha is on the same plane.
Shows different 180° positions.

Each of these heat dissipation fins is attached to the main body 1A as shown in FIG. 7, and as in FIG.
Arrange in the order of B, H, B, H, .... In other words, the heat dissipation fins 3A are installed one by one from the right end of the main body 1A in the state of C, B, H, B, ... C, B, and these heat dissipation fins 3A are brazed to the outer peripheral surface of the main body 1A. Fix the joint with etc. Therefore, the notch C of the heat dissipation fin (B) is arranged in the wiring hole B of the heat dissipation fin to form an escape for the wiring bolt. As described above, according to this embodiment, one type of heat dissipation fin shown in A is used, and the position of the protrusion,
By combining the positions of the wiring holes, the positions of the notches, and the way in which the fins are stacked by each protrusion, connection terminals for semiconductor elements can be eliminated, and an inexpensive and highly reliable heatsink can be obtained.

According to the present invention, it is possible to miniaturize devices such as semiconductor stacks using heat sinks.

[Brief explanation of drawings]

FIG. 1 is a side view of a semiconductor stack using a heat sink according to an embodiment of the present invention, FIG.
4 are a plan view and a side view of a state in which a heat dissipation fin is attached to the main body, and FIGS. 5 to 7 show a heat radiator according to another embodiment of the present invention, and FIG. , B, and C are plan views showing the arrangement of the projections of the heat dissipation fins as in FIG. 2, and FIGS. 6 and 7 are plan views and side views of the heat dissipation fins attached to the main body. 1,1A...Main body, 3,3A...Radiating fin,
6,6A...protrusion.

Claims (1)

[Claims] 1 A plurality of heat dissipation fins are provided on the outer periphery of the main body by pressing a plurality of protrusions from opposite sides to protrude from one side, and the protrusions are in the same direction, and adjacent heat dissipation fins are sequentially rotated 180 degrees and stacked one on top of the other. In the heat sink, the plurality of protrusions of the adjacent heat dissipation fins are provided at positions separated by more than the maximum width of the protrusions when shifted by 180 degrees, and the end portions of the heat dissipation fins A heat radiator characterized in that heat radiation fins are stacked upside down so that the projections face inward.