JPS6335082B2 - - Google Patents
Info
- Publication number
- JPS6335082B2 JPS6335082B2 JP56153645A JP15364581A JPS6335082B2 JP S6335082 B2 JPS6335082 B2 JP S6335082B2 JP 56153645 A JP56153645 A JP 56153645A JP 15364581 A JP15364581 A JP 15364581A JP S6335082 B2 JPS6335082 B2 JP S6335082B2
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- metallizing
- alumina
- ceramic
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000919 ceramic Substances 0.000 claims description 32
- 238000010438 heat treatment Methods 0.000 claims description 12
- 229910052759 nickel Inorganic materials 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 229910017309 Mo—Mn Inorganic materials 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 27
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 24
- 239000000463 material Substances 0.000 description 24
- 229910000679 solder Inorganic materials 0.000 description 21
- 229910052751 metal Inorganic materials 0.000 description 19
- 239000002184 metal Substances 0.000 description 19
- 238000000034 method Methods 0.000 description 17
- 229910052697 platinum Inorganic materials 0.000 description 12
- 239000010949 copper Substances 0.000 description 10
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 9
- 239000011521 glass Substances 0.000 description 7
- 229910052719 titanium Inorganic materials 0.000 description 7
- 229910004298 SiO 2 Inorganic materials 0.000 description 6
- 239000007789 gas Substances 0.000 description 6
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 5
- 239000011261 inert gas Substances 0.000 description 5
- 229910052750 molybdenum Inorganic materials 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 229910010413 TiO 2 Inorganic materials 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 229910010293 ceramic material Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 229910052748 manganese Inorganic materials 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 238000005507 spraying Methods 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- 238000004804 winding Methods 0.000 description 4
- 229910004337 Ti-Ni Inorganic materials 0.000 description 3
- 229910011209 Ti—Ni Inorganic materials 0.000 description 3
- 238000005219 brazing Methods 0.000 description 3
- 238000000921 elemental analysis Methods 0.000 description 3
- KHYBPSFKEHXSLX-UHFFFAOYSA-N iminotitanium Chemical compound [Ti]=N KHYBPSFKEHXSLX-UHFFFAOYSA-N 0.000 description 3
- 239000000395 magnesium oxide Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 238000007751 thermal spraying Methods 0.000 description 3
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004880 explosion Methods 0.000 description 2
- -1 holsterite Chemical compound 0.000 description 2
- 238000007733 ion plating Methods 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000009966 trimming Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- 229910003406 FeNiCu Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910000846 In alloy Inorganic materials 0.000 description 1
- 229910009083 Sn—Zn—Sb Inorganic materials 0.000 description 1
- 229910004353 Ti-Cu Inorganic materials 0.000 description 1
- 229910003126 Zr–Ni Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000010285 flame spraying Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 150000002483 hydrogen compounds Chemical class 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007750 plasma spraying Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P5/00—Measuring speed of fluids, e.g. of air stream; Measuring speed of bodies relative to fluids, e.g. of ship, of aircraft
- G01P5/10—Measuring speed of fluids, e.g. of air stream; Measuring speed of bodies relative to fluids, e.g. of ship, of aircraft by measuring thermal variables
- G01P5/12—Measuring speed of fluids, e.g. of air stream; Measuring speed of bodies relative to fluids, e.g. of ship, of aircraft by measuring thermal variables using variation of resistance of a heated conductor
Landscapes
- Engineering & Computer Science (AREA)
- Aviation & Aerospace Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Volume Flow (AREA)
- Thermistors And Varistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56153645A JPS5855762A (ja) | 1981-09-30 | 1981-09-30 | 熱線式流量計用発熱抵抗体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56153645A JPS5855762A (ja) | 1981-09-30 | 1981-09-30 | 熱線式流量計用発熱抵抗体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5855762A JPS5855762A (ja) | 1983-04-02 |
| JPS6335082B2 true JPS6335082B2 (fr) | 1988-07-13 |
Family
ID=15567054
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56153645A Granted JPS5855762A (ja) | 1981-09-30 | 1981-09-30 | 熱線式流量計用発熱抵抗体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5855762A (fr) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3604202C2 (de) * | 1985-02-14 | 1997-01-09 | Nippon Denso Co | Direkt beheizte Strömungsmeßvorrichtung |
| JPS61263402A (ja) * | 1985-05-16 | 1986-11-21 | モリト株式会社 | ゴム靴底の製造方法 |
| US5020214A (en) * | 1987-09-30 | 1991-06-04 | Hitachi, Ltd. | Method of manufacturing a hot wire air flow meter |
| DE3937783A1 (de) * | 1989-11-14 | 1991-05-16 | Deutsche Forsch Luft Raumfahrt | Sensor zur ermittlung der massenstromdichtegemittelten temperatur |
| JPH05207903A (ja) * | 1992-10-21 | 1993-08-20 | Achilles Corp | 射出成形靴底の製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5658207A (en) * | 1979-10-18 | 1981-05-21 | Matsushita Electric Ind Co Ltd | Method of manufacturing electronic part |
| JPS5670604A (en) * | 1979-11-15 | 1981-06-12 | Matsushita Electric Ind Co Ltd | Method of manufacturing resistor |
-
1981
- 1981-09-30 JP JP56153645A patent/JPS5855762A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5658207A (en) * | 1979-10-18 | 1981-05-21 | Matsushita Electric Ind Co Ltd | Method of manufacturing electronic part |
| JPS5670604A (en) * | 1979-11-15 | 1981-06-12 | Matsushita Electric Ind Co Ltd | Method of manufacturing resistor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5855762A (ja) | 1983-04-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5730543A (en) | Electrically conducting connection | |
| JP4033331B2 (ja) | サーミスタおよびその製造方法 | |
| CN103249520B (zh) | 大气接合用钎料、接合体以及集电材料 | |
| JPS606910B2 (ja) | 金属セラミツクス接合体 | |
| IE904277A1 (en) | Pressure Sensor and Method Manufacturing same | |
| KR102202323B1 (ko) | 금속-세라믹 땜납 연결을 생성하는 방법 | |
| CN115036136B (zh) | 陶瓷电子部件 | |
| US4395319A (en) | Lean sensor | |
| JPH05251210A (ja) | 導電性チップ型セラミック素子及びその製造方法 | |
| JPS6335082B2 (fr) | ||
| JPH02208274A (ja) | セラミックス表面の金属化組成物、表面金属化方法及び表面金属化製品 | |
| RU2536840C2 (ru) | Способ сборки реактивной пайкой и вакуумный патрон, собранный этим способом | |
| JP2005331502A (ja) | セラミックヒータ及びこれを内蔵するガスセンサ | |
| JP3064113B2 (ja) | ＺｒＯ２ セラミックスの接合方法 | |
| JP6462408B2 (ja) | センサ基板および検出装置 | |
| JPH07167435A (ja) | セラミック発熱体 | |
| JP2001274037A (ja) | セラミック電子部品 | |
| JPS61117172A (ja) | セラミツクスの接合構造 | |
| JPH06215981A (ja) | セラミック電子部品 | |
| JPH06169023A (ja) | 半導体パッケージ用セラミックリッド | |
| JP2597704B2 (ja) | 金属被覆超電導セラミックス成形体およびそれを使用してなる金属被覆超電導セラミックス・金属接合体 | |
| JPS62112051A (ja) | 酸素センサ | |
| JP3036443B2 (ja) | 炭化水素検出センサの製造方法 | |
| JP2003048785A (ja) | 金属部材とセラミック部材との接合構造および金属部材とセラミック部材との接合方法 | |
| JPS6133465B2 (fr) |