JPS633443A - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPS633443A JPS633443A JP61147502A JP14750286A JPS633443A JP S633443 A JPS633443 A JP S633443A JP 61147502 A JP61147502 A JP 61147502A JP 14750286 A JP14750286 A JP 14750286A JP S633443 A JPS633443 A JP S633443A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- heat sink
- copper base
- ceramic envelope
- container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61147502A JPS633443A (ja) | 1986-06-23 | 1986-06-23 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61147502A JPS633443A (ja) | 1986-06-23 | 1986-06-23 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS633443A true JPS633443A (ja) | 1988-01-08 |
| JPH0573265B2 JPH0573265B2 (enFirst) | 1993-10-14 |
Family
ID=15431817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61147502A Granted JPS633443A (ja) | 1986-06-23 | 1986-06-23 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS633443A (enFirst) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6618251B2 (en) | 2001-10-09 | 2003-09-09 | Fujitsu Limited | Cooling device capable of contacting target with smaller urging force |
| JP2015167171A (ja) * | 2014-03-04 | 2015-09-24 | 三菱電機株式会社 | 半導体装置 |
-
1986
- 1986-06-23 JP JP61147502A patent/JPS633443A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6618251B2 (en) | 2001-10-09 | 2003-09-09 | Fujitsu Limited | Cooling device capable of contacting target with smaller urging force |
| JP2015167171A (ja) * | 2014-03-04 | 2015-09-24 | 三菱電機株式会社 | 半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0573265B2 (enFirst) | 1993-10-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |