JPS633443A - Semiconductor device - Google Patents

Abstract

PURPOSE:To ensure the stable brazing between a container and a heat sink in a short time, by providing supporting parts and a recess part for positioning in the heat sink, keeping the parallel relation between the container and the heat sink, and preventing the deviation of the attaching position. CONSTITUTION:Two supporting parts 103 are provided symmetrically on both sides of protruding part 104a of a copper base 104 in order to keep a container horizontal with respect to a heat sink 102, on the heat sink 102. The parts 103 have the same height. A recess part 105 for positioning, in which the protuding part 104a of the copper base 104 is coupled, is provided in the upper surface of the heat sink 102. Then, the container is not attached in a slanted state. The container is positioned at the specified place with respect to the heat sink 102 all the time. Thus the brazing between the container and the heat sink 102 is stably performed positively in a short time.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor device, and particularly to a high frequency, high power semiconductor device attached to a heat sink.

[Conventional technology]

FIGS. 2(a) and 2(b) are a plan view and a front view showing the structure of a conventionally used semiconductor device of this type. In FIG. 2, a semiconductor element (not shown) is housed inside a ceramic envelope 201, and a copper base 204 is attached to the lower surface of the ceramic envelope 201 to seal the semiconductor element and form a container (case). This copper base is fixed to the heat sink 202 using brazing material 206.

In the conventional semiconductor device described above, the heat dissipation plate 202 is placed on a heating table heated to a temperature higher than the melting temperature of the brazing material 206, and the brazing material 206 is placed on the brazing part.
When 06 is melted, the protrusion 204a of the copper base 204 is placed on it and brazed. This brazing work is done by the worker using tweezers, so
Depending on how you install the case, the case may be twisted as shown in Figure 3, or the case may be brazed in an inclined position as shown in Figure 4.1. Even experienced workers often experience such problems. Furthermore, if a semiconductor device is used with such defects, the heat generated by the semiconductor element may not be efficiently transferred to the heat sink, the grounding inductance may increase, or the circuit board may not be installed in the correct position. The disadvantage is that it cannot be fixed.

[Problem that the invention seeks to solve]

The problem to be solved by the present invention, in other words, the purpose of the present invention is to eliminate the above-mentioned drawbacks of conventional semiconductor devices, and to always mount the case in the correct position and posture during brazing work. To provide a semiconductor device which can efficiently transmit heat generated by a semiconductor element, eliminate an increase in grounding inductance, and can be reliably attached to a circuit board.

[Means for solving problems]

The semiconductor device of the present invention includes a ceramic envelope that houses a semiconductor element therein, and a rectangular protrusion that is attached to the lower surface of the ceramic envelope to form a container together with the ceramic envelope, and that has a rectangular protrusion on the lower surface of the center thereof. and a heat sink having a recess in the center into which the protruding part of the copper base is fitted, and a heat sink having support parts of the same height on both sides of the recess.

[Example] 2 Next, embodiments of the present invention will be described with reference to the drawings.

FIGS. 1(a) and 1(b) are a plan view and a front view showing an embodiment of the present invention.

In FIG. 1, a copper base 104 is attached to the lower surface of a ceramic envelope 101 that houses a semiconductor element therein to form a container (case). copper base 10
There is a rectangular protrusion 104a in the center of the lower surface of 4.
The lower surface of this protrusion 104a is fixed to the heat sink 102 using a brazing material 106. The heat sink 102 is provided with two supporting parts 103 of the same height symmetrically on both sides of the protrusion 104a of the copper base 104 in order to keep the container horizontal with respect to the heat sink 102. Prevents the container from being installed tilted. In order to position the container at a predetermined position with respect to the heat sink 102, a positioning recess 105 into which the protrusion 104a of the copper base 104 is fitted is provided on the top surface of the heat sink 102, so that the container always radiates heat. It is positioned at a predetermined position with respect to the plate 102.

There is no possibility of twisting or other misalignment.

Although the support portion 103 has a rectangular wall shape in FIG. 1, the effect remains unchanged even if the support portion 103 has a cylindrical shape, a prismatic shape, or the like.

〔Effect of the invention〕

As explained in detail above, by using the semiconductor device of the present invention, the support part and the positioning recess provided in the heat sink keep the container and the heat sink parallel to each other, and the mounting position can be prevented from shifting. This has the effect that the container and the heat sink can be brazed stably and reliably in a short time. Therefore, productivity is improved, brazing maintains the adhesive strength of the parts, and heat generated by the semiconductor element can be efficiently transferred to the heat sink. Further, there is an effect that the grounding inductance can be reduced and the semiconductor device can be reliably attached to the circuit board.

[Brief explanation of drawings]

FIGS. 1(a) and (b) are a plan view and a front view showing an embodiment of the present invention, and FIGS. 2(a) and (b) are a plan view and a front view showing an example of a conventional semiconductor device. 3 is a plan view showing the semiconductor device of FIG. 2 in a twisted state, and FIG. 4 is a front view showing the semiconductor device of FIG. 2 in a tilted state. 101/201...Ceramic envelope, 102/20
2... Heat sink, 103... Support part, 104/204
...Copper base, 105...Recessed part for positioning, 106
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Claims (1)

[Claims] a ceramic envelope that houses a semiconductor element therein; a copper base that is attached to the lower surface of the ceramic envelope to form a container with the ceramic envelope and has a rectangular protrusion on the lower central surface thereof; A semiconductor device comprising: a heat dissipation plate having a recessed portion in the center into which the protruding portion of the copper base is fitted, and support portions having the same height on both sides of the recessed portion.