CN212398549U - High-temperature-resistant jig for preventing substrate from deforming - Google Patents
High-temperature-resistant jig for preventing substrate from deforming Download PDFInfo
- Publication number
- CN212398549U CN212398549U CN202020494062.3U CN202020494062U CN212398549U CN 212398549 U CN212398549 U CN 212398549U CN 202020494062 U CN202020494062 U CN 202020494062U CN 212398549 U CN212398549 U CN 212398549U
- Authority
- CN
- China
- Prior art keywords
- bracket
- cover plate
- substrate
- deformation
- temperature resistant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
One of the objectives of the present invention is to provide a high temperature resistant fixture for preventing the substrate from deforming, which ensures that the substrate does not deform when the semiconductor is packaged; the utility model provides a prevent high temperature resistant tool of base plate deformation, include: the bracket comprises a bracket 1, wherein the bracket 1 comprises at least two edge clamping grooves 11 and a cover plate 2, and at least two side edges of the cover plate 1 are respectively in one-to-one correspondence with the edge clamping grooves 11 of the bracket 1; the bracket 1 is matched with the cover plate 2 to fix the base plate inside; the utility model has the advantages that the probability of deformation of the substrate due to high temperature in the semiconductor packaging process is reduced, and the occurrence of short circuit in the welding process due to substrate deformation is reduced; meanwhile, the design of the hollow part can save the production cost.
Description
Technical Field
The utility model relates to a semiconductor packaging technology technical field especially relates to a prevent high temperature resistant tool of base plate deformation.
Background
With the transformation and upgrade of the semiconductor packaging process, especially the newly developed flip-chip bonding process, the direct chip is automatically connected with the substrate, so that the cost and the operation time of gold wire connection can be greatly reduced. During high-temperature operation, the substrate is subjected to high temperature, so that the risk of bending exists, the uncontrollable factor is high, and the problem of short circuit in the welding process cannot be controlled.
Therefore, the problem of reducing the probability of substrate deformation is to be solved.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a prevent high temperature resistant tool that base plate warp, when carrying out semiconductor package, guarantee that the base plate does not warp.
An object of the utility model is to provide a prevent high temperature resistant tool of base plate deformation, guarantee that the base plate can also practice thrift the manufacturing cost of this tool when carrying out semiconductor package indeformable.
According to the above object, the utility model provides a prevent high temperature resistant tool of base plate deformation, include: the bracket comprises a bracket 1, wherein the bracket 1 comprises at least two edge clamping grooves 11 and a cover plate 2, and at least two side edges of the cover plate 1 are respectively in one-to-one correspondence with the edge clamping grooves 11 of the bracket 1; the bracket 1 is matched with the cover plate 2 to fix the base plate inside.
Preferably, two edge slots 11 are provided, and are respectively provided at two parallel side edges of the bracket 1.
Preferably, the cover plate 2 is a rectangular cover plate.
Another embodiment of the utility model provides a prevent high temperature resistant tool that base plate warp, use like foretell high temperature resistant tool that prevents base plate warp, include: the bracket comprises a bracket 1, wherein the bracket 1 comprises at least two edge clamping grooves 11 and a cover plate 2, and at least two side edges of the cover plate 1 are respectively in one-to-one correspondence with the edge clamping grooves 11 of the bracket 1; the bracket 1 is matched with the cover plate 2 to fix the base plate inside.
Preferably, three edge slots 11 are provided, and are respectively provided at three side edges of the bracket 1.
Preferably, the cover plate 2 is further provided with a cover plate cover rim 21; the cover plate cover edge 21 corresponds to the side of the bracket 1 not provided with the edge slot 11.
Another embodiment of the utility model provides a prevent high temperature resistant tool that base plate warp, use like foretell high temperature resistant tool that prevents base plate warp, include: the bracket comprises a bracket 1, wherein the bracket 1 comprises at least two edge clamping grooves 11 and a cover plate 2, and at least two side edges of the cover plate 1 are respectively in one-to-one correspondence with the edge clamping grooves 11 of the bracket 1; the bracket 1 is matched with the cover plate 2 to fix the base plate inside.
Preferably, the bottom of the bracket 1 is further provided with a hollowed-out part I12.
Preferably, the cover plate 2 is further provided with a second hollow-out portion 22.
The utility model has the advantages that the probability of deformation of the substrate due to high temperature in the semiconductor packaging process is reduced, and the occurrence of short circuit in the welding process due to substrate deformation is reduced; meanwhile, the design of the hollow part can save the production cost.
Drawings
In FIG. 1, 1-A is a schematic diagram of a bracket structure in a first embodiment, and 1-B is a schematic diagram of a cover structure in a first embodiment;
FIG. 2 is a schematic view of a bracket structure in the second embodiment 2-A and a schematic view of a cover plate structure in the second embodiment 2-B;
in FIG. 3, 3-A is a structural diagram of a bracket in the third embodiment, and 3-B is a structural diagram of a cover plate in the third embodiment;
in the figure, the position of the upper end of the main shaft,
1. a bracket 11, an edge clamping groove 12 and a hollow part I; 2. a cover plate 21, a cover plate edge 22 and a hollow part II.
Detailed Description
The present invention will now be described in detail with reference to the drawings, which are provided for illustrative and explanatory purposes only and should not be construed as limiting the scope of the present invention in any way.
The utility model provides a prevent high temperature resistant tool of base plate deformation, include: the bracket comprises a bracket 1, wherein the bracket 1 comprises at least two edge clamping grooves 11 and a cover plate 2, and at least two side edges of the cover plate 1 are respectively in one-to-one correspondence with the edge clamping grooves 11 of the bracket 1; the bracket 1 is matched with the cover plate 2 to fix the base plate inside.
Referring to fig. 1, 1-a and 1-B, for one embodiment of the present invention,
in this embodiment, preferably, two edge slots 11 are provided, and are respectively disposed on two parallel side edges of the bracket 1.
In this embodiment, the cover plate 2 is preferably a rectangular cover plate.
Referring to fig. 2, 2-a and 2-B, for another embodiment of the present invention,
in this embodiment, preferably, three edge slots 11 are provided, and are respectively provided at three side edges of the bracket 1.
Preferably, in this embodiment, the cover plate 2 is further provided with a cover plate cover edge 21; the cover plate cover edge 21 corresponds to the side of the bracket 1 not provided with the edge slot 11.
Referring to fig. 3, 3-a and 3-B, for another third embodiment of the present invention,
in the embodiment, preferably, the bottom of the bracket 1 is further provided with a hollowed-out part one 12.
In this embodiment, preferably, the cover plate 2 is further provided with a second hollow portion 22.
In practical applications, the first hollow-out portions 12 and the second hollow-out portions 22 in the third embodiment may also be arranged in a grid shape, which is not shown in the drawings. When saving tool manufacturing cost, compare in the third embodiment the design of monoblock fretwork portion, the intensity of fixed base plate is higher.
In all the above embodiments, the bracket 1 and the cover plate 2 are made of high temperature resistant materials, and the heating range is 120 ℃ to 260 ℃. The material can be copper, aluminum or iron.
It should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
The above-mentioned embodiments of the present invention do not limit the scope of the present invention. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (7)
1. The utility model provides a prevent high temperature resistant tool of base plate deformation which characterized in that includes:
a bracket (1), the bracket (1) comprises at least two edge clamping grooves (11),
the cover plate (2) is provided with at least two side edges which are respectively corresponding to the edge clamping grooves (11) of the bracket (1);
the bracket (1) is matched with the cover plate (2) to fix the base plate inside.
2. The high-temperature resistant jig for preventing the deformation of the substrate as claimed in claim 1, wherein two edge slots (11) are provided, and are respectively provided at two parallel side edges of the bracket (1).
3. The high temperature resistant fixture for preventing the substrate from deforming as claimed in claim 2, wherein the cover plate (2) is a rectangular cover plate.
4. The high-temperature resistant jig for preventing the deformation of the substrate as claimed in claim 1 is characterized in that the edge clamping grooves (11) are provided in three numbers, which are respectively arranged on three side edges of the bracket (1).
5. The high-temperature resistant jig for preventing the deformation of the substrate as claimed in claim 4, wherein the cover plate (2) is further provided with a cover plate cover edge (21); the cover plate cover edge (21) corresponds to one side of the bracket (1) which is not provided with the edge clamping groove (11).
6. The high-temperature-resistant jig for preventing the deformation of the substrate as claimed in claim 1 is characterized in that a hollowed part I (12) is further arranged at the bottom of the bracket (1).
7. The high-temperature-resistant jig for preventing the deformation of the substrate as claimed in claim 1, wherein the cover plate (2) is further provided with a second hollow part (22).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202020494062.3U CN212398549U (en) | 2020-04-07 | 2020-04-07 | High-temperature-resistant jig for preventing substrate from deforming |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202020494062.3U CN212398549U (en) | 2020-04-07 | 2020-04-07 | High-temperature-resistant jig for preventing substrate from deforming |
Publications (1)
Publication Number | Publication Date |
---|---|
CN212398549U true CN212398549U (en) | 2021-01-26 |
Family
ID=74369278
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202020494062.3U Active CN212398549U (en) | 2020-04-07 | 2020-04-07 | High-temperature-resistant jig for preventing substrate from deforming |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN212398549U (en) |
-
2020
- 2020-04-07 CN CN202020494062.3U patent/CN212398549U/en active Active
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4289922A (en) | Integrated circuit package and lead frame | |
US3922712A (en) | Plastic power semiconductor flip chip package | |
CN212398549U (en) | High-temperature-resistant jig for preventing substrate from deforming | |
US6483128B2 (en) | Connecting device for power semiconductor modules with compensation for mechanical stresses | |
CN213003432U (en) | Welding tool for IGBT module | |
US20210288021A1 (en) | Thermal compression bonder nozzle with vacuum relief features | |
CN108231698A (en) | Ceramic pad array shell | |
CN208028026U (en) | A kind of photodiode packaging system | |
CN110289245A (en) | A kind of three-dimension packaging structure of hydrid integrated circuit and preparation method thereof | |
CN211759085U (en) | Welding tool for internal electrode of power semiconductor module | |
US6163068A (en) | Multi-chip semiconductor encapsulation method and its finished product | |
US11791232B2 (en) | Packaging structure and packaging method of digital circuit | |
KR20070053660A (en) | Single row bond pad arrangement of an integrated circuit chip | |
CN111137850B (en) | Method for realizing low-stress sensitive structure surface mounting technology | |
CN211828686U (en) | Base plate for solving identification problem of flip-chip welding engineering chip | |
CN207529854U (en) | Self-luminous key switch | |
TW313668B (en) | ||
CN104465594A (en) | Rectification component with embedded cooling fins and manufacturing method thereof | |
CN219068494U (en) | SMD structure convenient to encapsulation | |
CN206419687U (en) | A kind of Novel LED light | |
CN214429775U (en) | Single-tube IGBT assembly structure of frequency converter | |
CN209374447U (en) | IGBT half-bridge module | |
CN102518967A (en) | High-power LED assembly high in heat dissipation | |
CN216624250U (en) | Detachable photoelectron chip epoxy resin packaging structure | |
CN113690228B (en) | Integrated LED light-emitting device and preparation method thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant |