CN216624250U

CN216624250U - Detachable photoelectron chip epoxy resin packaging structure

Info

Publication number: CN216624250U
Application number: CN202123354346.6U
Authority: CN
Inventors: 方耀权
Original assignee: Zhongke Qingkun Dongguan Technology Co ltd
Current assignee: Zhongke Qingkun Dongguan Technology Co ltd
Priority date: 2021-12-28
Filing date: 2021-12-28
Publication date: 2022-05-27
Anticipated expiration: 2031-12-28

Abstract

The utility model discloses a detachable photoelectron chip epoxy resin packaging structure which comprises a bottom plate, wherein an epoxy resin packaging cover is installed in the center of the top of the bottom plate, an internal thread groove is formed in the center of the bottom plate, an external thread seat is screwed and fixed in the internal thread groove, a mounting seat is installed at the bottom of the external thread seat, a chip groove is formed in the center of the top of the external thread seat, a photoelectron chip is arranged in the chip groove, a plurality of metal contacts electrically connected with pins are arranged on the periphery of the photoelectron chip in the chip groove, and the pins of the photoelectron chip are welded on the metal contacts. The optoelectronic chip fixing device is novel in structure and ingenious in conception, the mounting base is rotated to enable the external thread base to be screwed out of the inner part of the internal thread groove, the optoelectronic chip can be maintained and replaced, the whole optoelectronic chip fixing device is of a detachable structure, accessories can be replaced, and the use cost is reduced.

Description

Detachable photoelectron chip epoxy resin packaging structure

Technical Field

The utility model relates to the technical field of optoelectronic chip packaging, in particular to a detachable optoelectronic chip epoxy resin packaging structure.

Background

Compared with a microelectronic chip, the optoelectronic chip has obvious advantages in the aspects of computing power, energy consumption, cost and size, can be used for optical communication equipment, data communication equipment, wireless communication equipment, data centers, super computing, internet of things sensing, artificial intelligence and the like, and can be applied to consumption fields of smart phones, flat plates, wearing and the like in the future.

The optoelectronic chip packaging structures in the prior art are all integrated with the optoelectronic chip, and cannot be disassembled, and the epoxy resin packaging layer needs to be damaged when the optoelectronic chip is repaired and replaced. Therefore, it is necessary to design a detachable epoxy encapsulation structure for optoelectronic chip.

SUMMERY OF THE UTILITY MODEL

Aiming at the situation, in order to overcome the defects of the prior art, the utility model provides a detachable optoelectronic chip epoxy resin packaging structure which is novel in structure and ingenious in conception, the mounting base is rotated to enable the external thread base to be screwed out of the internal thread groove, so that the optoelectronic chip can be maintained and replaced, the whole structure is detachable, accessories can be replaced, and the use cost is reduced.

In order to achieve the purpose, the utility model provides the following technical scheme: a detachable photoelectron chip epoxy resin packaging structure comprises a bottom plate, wherein an epoxy resin packaging cover is installed in the center of the top of the bottom plate, an internal thread groove is formed in the center of the bottom plate, and an external thread seat is screwed and fixed in the internal thread groove;

the bottom of the external thread seat is provided with a mounting seat positioned at the bottom of the bottom plate, and the four corners of the bottom of the mounting seat are provided with pins; the optoelectronic chip comprises an external thread seat and is characterized in that a chip groove is formed in the center of the top of the external thread seat, an optoelectronic chip is arranged in the chip groove, a plurality of metal contacts electrically connected with the pins are arranged on the periphery of the optoelectronic chip in the chip groove, and the pins of the optoelectronic chip are welded on the metal contacts.

Optionally, a heat sink is mounted in the center of the bottom of the mounting base, a plurality of heat sink grooves are formed in the bottom of the heat sink at equal intervals, and a heat conducting column is connected between the heat sink and the optoelectronic chip;

the heat conduction column penetrates through the mounting seat and the outer thread seat, the top end of the heat conduction column extends into the chip groove and is in contact with the bottom of the optoelectronic chip, and the bottom end of the heat conduction column is in contact with the top of the radiating fin.

Optionally, a heat conduction silica gel layer is filled between the bottom of the optoelectronic chip and the bottom of the chip groove.

Optionally, a sealing ring is sleeved on the external thread seat and attached to a groove opening below the internal thread groove.

Optionally, through positioning holes are formed in the bottom plate around the epoxy resin encapsulation cover.

The utility model has the beneficial effects that:

the installation seat is rotated to enable the external thread seat to be screwed out of the internal thread groove, so that the maintenance and replacement of the photoelectronic chip can be carried out, the whole photoelectronic chip is of a detachable structure, the replacement of accessories can be carried out, and the use cost is reduced;

the heat that produces in the photoelectron chip course of operation is transmitted to the fin through the heat conduction post and is gived off to the external environment in, promotes photoelectron chip's heat dispersion greatly, promotes photoelectron chip's life.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.

FIG. 1 is a schematic view of the overall front plan structure of the present invention;

FIG. 2 is a schematic view of the overall cross-sectional plan structure of the present invention;

FIG. 3 is an enlarged plan view of the area A of the present invention;

reference numbers in the figures: 1. a base plate; 2. an epoxy resin encapsulation cover; 3. a mounting seat; 4. a heat sink; 5. a heat sink; 6. a pin; 7. an internal thread groove; 8. an external thread seat; 9. a chip slot; 10. a metal contact; 11. an optoelectronic chip; 12. a seal ring; 13. a heat-conducting column; 14. a heat conductive silica gel layer; 15. positioning holes; 16. and (7) a pin.

Detailed Description

In order to make the objects, features and advantages of the present invention more apparent and understandable, the embodiments of the present invention will be described in detail and completely with reference to the accompanying drawings, and it is to be understood that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The technical scheme of the utility model is further explained by the specific implementation mode in combination with the attached drawings.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.

The technical scheme of the utility model is clearly and completely described in the following with reference to the accompanying drawings.

The optoelectronic chip packaging structures in the prior art are all integrated with the optoelectronic chip, and cannot be disassembled, and the epoxy resin packaging layer needs to be damaged when the optoelectronic chip is repaired and replaced.

Example one

As shown in fig. 1, fig. 2 and fig. 3, the present invention provides the following technical solutions: a detachable photoelectron chip epoxy resin packaging structure is characterized in that an epoxy resin packaging cover 2 is installed in the center of the top of a bottom plate 1, an internal thread groove 7 is formed in the center of the bottom plate 1, and an external thread seat 8 is fixedly screwed in the internal thread groove 7;

the bottom of the external thread seat 8 is provided with an installation seat 3 positioned at the bottom of the bottom plate 1, and four corner positions at the bottom of the installation seat 3 are provided with pins 6; a chip groove 9 is formed in the center of the top of the external thread seat 8, a photoelectronic chip 11 is arranged in the chip groove 9, a plurality of metal contacts 10 electrically connected with the pins 6 are arranged on the periphery of the photoelectronic chip 11 in the chip groove 9, and pins 16 of the photoelectronic chip 11 are welded on the metal contacts 10.

Through rotating mount pad 3, make external screw thread seat 8 screw out from the inside of internal thread groove 7, can carry out the maintenance of optoelectronic chip 11 and change, wholly be detachable structure, can carry out the accessory and change, reduce use cost.

Preferably, the external thread seat 8 is sleeved with a sealing ring 12, and the sealing ring 12 is attached to the lower groove opening of the internal thread groove 7, so that the sealing performance is improved.

Preferably, the bottom plate 1 is provided with through positioning holes 15 around the epoxy resin encapsulation cover 2 for reinforcement.

Example two

Referring to fig. 1 and 2, as another preferred embodiment, the difference between the first embodiment and the second embodiment is that a heat sink 4 is installed in the center of the bottom of the mounting base 3, a plurality of heat dissipation grooves 5 are equidistantly formed in the bottom of the heat sink 4, and a heat conduction column 13 is connected between the heat sink 4 and the optoelectronic chip 11;

heat conduction post 13 wears to establish in the inside of mount pad 3 and external screw thread seat 8, heat conduction post 13's top stretch into chip groove 9 and with optoelectronic chip 11's bottom contact, heat conduction post 13's bottom and the top contact of fin 4, the heat that produces in the optoelectronic chip 11 course of operation transmits to fin 4 through heat conduction post 13 and gives off external environment, promotes optoelectronic chip 11's heat dispersion greatly, promotes optoelectronic chip 11's life.

Preferably, a heat-conducting silica gel layer 14 is filled between the bottom of the optoelectronic chip 11 and the bottom of the chip slot 9, so that the heat-conducting effect is good.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims

1. A detachable photoelectron chip epoxy resin packaging structure comprises a base plate (1), and is characterized in that: an epoxy resin packaging cover (2) is installed in the center of the top of the bottom plate (1), an inner thread groove (7) is formed in the center of the bottom plate (1), and an outer thread seat (8) is fixedly screwed in the inner thread groove (7);

the bottom of the external thread seat (8) is provided with an installation seat (3) positioned at the bottom of the bottom plate (1), and four corner positions of the bottom of the installation seat (3) are provided with pins (6); a chip groove (9) is formed in the center of the top of the external thread seat (8), a photoelectronic chip (11) is arranged inside the chip groove (9), a plurality of metal contacts (10) electrically connected with the pins (6) are arranged on the periphery of the photoelectronic chip (11) in the chip groove (9), and pins (16) of the photoelectronic chip (11) are welded on the metal contacts (10).

2. The detachable optoelectronic chip epoxy package structure of claim 1, wherein: a heat radiating fin (4) is arranged in the center of the bottom of the mounting seat (3), a plurality of heat radiating grooves (5) are formed in the bottom of the heat radiating fin (4) at equal intervals, and a heat conducting column (13) is connected between the heat radiating fin (4) and the photoelectron chip (11);

the heat conduction column (13) penetrates through the mounting base (3) and the outer thread base (8), the top end of the heat conduction column (13) extends into the chip groove (9) and is in contact with the bottom of the photoelectronic chip (11), and the bottom end of the heat conduction column (13) is in contact with the top of the radiating fin (4).

3. A detachable optoelectronic chip epoxy resin package structure as claimed in claim 2, wherein: and a heat-conducting silica gel layer (14) is filled between the bottom of the photoelectronic chip (11) and the bottom of the chip groove (9).

4. The detachable optoelectronic chip epoxy package structure of claim 1, wherein: and the external thread seat (8) is sleeved with a sealing ring (12), and the sealing ring (12) is attached to the lower groove opening of the internal thread groove (7).

5. The detachable optoelectronic chip epoxy package structure of claim 1, wherein: and through positioning holes (15) are formed in the periphery of the epoxy resin packaging cover (2) on the bottom plate (1).