JPH0573265B2 - - Google Patents

Info

Publication number
JPH0573265B2
JPH0573265B2 JP61147502A JP14750286A JPH0573265B2 JP H0573265 B2 JPH0573265 B2 JP H0573265B2 JP 61147502 A JP61147502 A JP 61147502A JP 14750286 A JP14750286 A JP 14750286A JP H0573265 B2 JPH0573265 B2 JP H0573265B2
Authority
JP
Japan
Prior art keywords
semiconductor device
heat sink
ceramic envelope
container
copper base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61147502A
Other languages
English (en)
Japanese (ja)
Other versions
JPS633443A (ja
Inventor
Katsunori Myagaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP61147502A priority Critical patent/JPS633443A/ja
Publication of JPS633443A publication Critical patent/JPS633443A/ja
Publication of JPH0573265B2 publication Critical patent/JPH0573265B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP61147502A 1986-06-23 1986-06-23 半導体装置 Granted JPS633443A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61147502A JPS633443A (ja) 1986-06-23 1986-06-23 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61147502A JPS633443A (ja) 1986-06-23 1986-06-23 半導体装置

Publications (2)

Publication Number Publication Date
JPS633443A JPS633443A (ja) 1988-01-08
JPH0573265B2 true JPH0573265B2 (enFirst) 1993-10-14

Family

ID=15431817

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61147502A Granted JPS633443A (ja) 1986-06-23 1986-06-23 半導体装置

Country Status (1)

Country Link
JP (1) JPS633443A (enFirst)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3946975B2 (ja) 2001-10-09 2007-07-18 富士通株式会社 冷却装置
JP2015167171A (ja) * 2014-03-04 2015-09-24 三菱電機株式会社 半導体装置

Also Published As

Publication number Publication date
JPS633443A (ja) 1988-01-08

Similar Documents

Publication Publication Date Title
JPH0573265B2 (enFirst)
US5828000A (en) Semiconductor device with heat radiating plate and positioning dummy lead and lead frame therefor
JPH06104295A (ja) ハイブリッドｉｃのはんだ付け方法
JPS59118269A (ja) ピンろう接方法
JPS6213057A (ja) 半導体装置
JP2529171B2 (ja) 半導体チップの保持と該半導体チップのリ―ドフレ―ムのリ―ドへのボンディングをするための汎用リ―ドフレ―ムキャリアとインサ―ト
JPH0226058A (ja) 混成集積回路用ヒートシンク
JPH11195747A (ja) 電子回路モジュール
JP2523512Y2 (ja) フラットパッケ−ジ型ｉｃ
JPS6350853Y2 (enFirst)
JPH0621262U (ja) パワートランジスタモジュールケース
JPH083018Y2 (ja) 半導体パッケージ用連結型リードフレーム
JP2910324B2 (ja) プリント基板の製造方法
JPH0742964U (ja) 半導体素子収納用パッケージ
JPH056665Y2 (enFirst)
JPH0356078Y2 (enFirst)
JPS6032772Y2 (ja) 半導体装置用ステム
JPS6074653A (ja) 半導体装置用容器の封止治具
JPH01208851A (ja) 電子部品の実装構造
JPH0265199A (ja) フェライトビーズコア付き放熱スペーサー
JPH01313993A (ja) 発熱電子部品を備えた電子部品ユニットの製造方法及び該方法に用いる複合基板
JPH0347585B2 (enFirst)
JPH03288451A (ja) 半導体素子用チップキャリア及び実装方法
JPS63138674A (ja) 混成集積回路の端子構造
JPH0577990U (ja) 発熱性混成集積回路装置

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term