JPS6334281Y2 - - Google Patents
Info
- Publication number
- JPS6334281Y2 JPS6334281Y2 JP1981001247U JP124781U JPS6334281Y2 JP S6334281 Y2 JPS6334281 Y2 JP S6334281Y2 JP 1981001247 U JP1981001247 U JP 1981001247U JP 124781 U JP124781 U JP 124781U JP S6334281 Y2 JPS6334281 Y2 JP S6334281Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- wiring board
- bonding
- conductor
- flexible wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 21
- 229920005989 resin Polymers 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 14
- 239000004020 conductor Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 239000011888 foil Substances 0.000 claims description 4
- 230000003014 reinforcing effect Effects 0.000 claims description 3
- 239000004840 adhesive resin Substances 0.000 claims description 2
- 229920006223 adhesive resin Polymers 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910000510 noble metal Inorganic materials 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981001247U JPS6334281Y2 (US06168776-20010102-C00028.png) | 1981-01-07 | 1981-01-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981001247U JPS6334281Y2 (US06168776-20010102-C00028.png) | 1981-01-07 | 1981-01-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57115253U JPS57115253U (US06168776-20010102-C00028.png) | 1982-07-16 |
| JPS6334281Y2 true JPS6334281Y2 (US06168776-20010102-C00028.png) | 1988-09-12 |
Family
ID=29799735
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981001247U Expired JPS6334281Y2 (US06168776-20010102-C00028.png) | 1981-01-07 | 1981-01-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6334281Y2 (US06168776-20010102-C00028.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5106528B2 (ja) * | 2007-05-29 | 2012-12-26 | 京セラ株式会社 | 電子部品収納用パッケージ、及び電子装置 |
-
1981
- 1981-01-07 JP JP1981001247U patent/JPS6334281Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57115253U (US06168776-20010102-C00028.png) | 1982-07-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0448767A (ja) | 樹脂封止型半導体装置 | |
| JP2000003988A (ja) | リードフレームおよび半導体装置 | |
| US20010002320A1 (en) | Extended lead package | |
| JP2501953B2 (ja) | 半導体装置 | |
| JPS6334281Y2 (US06168776-20010102-C00028.png) | ||
| US6181003B1 (en) | Semiconductor device packaged in plastic package | |
| JP2000286372A (ja) | 半導体装置の製造方法 | |
| JPS6320135Y2 (US06168776-20010102-C00028.png) | ||
| JPS63284831A (ja) | 混成集積回路の製造方法 | |
| JP2975782B2 (ja) | 混成集積回路装置およびこれに用いるケース材 | |
| JP2743157B2 (ja) | 樹脂封止型半導体装置 | |
| JP2830221B2 (ja) | ハイブリッド集積回路のマウント構造 | |
| JP2595803B2 (ja) | 混成集積回路装置 | |
| JP2662991B2 (ja) | 混成集積回路パッケージ | |
| JPS62226636A (ja) | プラスチツクチツプキヤリア | |
| JPH079378Y2 (ja) | 半導体装置 | |
| JP2752286B2 (ja) | 混成集積回路装置 | |
| JP2972679B2 (ja) | リードフレーム並びに樹脂封止型半導体装置及びその製造方法 | |
| JPH0143872Y2 (US06168776-20010102-C00028.png) | ||
| JP2784209B2 (ja) | 半導体装置 | |
| JP2743156B2 (ja) | 樹脂封止型半導体装置 | |
| JPS6334284Y2 (US06168776-20010102-C00028.png) | ||
| JP2883065B2 (ja) | 半導体装置 | |
| JPH0741167Y2 (ja) | 絶縁物封止型回路装置 | |
| JP2513416B2 (ja) | 半導体装置 |
