JPS6333510B2 - - Google Patents

Info

Publication number
JPS6333510B2
JPS6333510B2 JP5532480A JP5532480A JPS6333510B2 JP S6333510 B2 JPS6333510 B2 JP S6333510B2 JP 5532480 A JP5532480 A JP 5532480A JP 5532480 A JP5532480 A JP 5532480A JP S6333510 B2 JPS6333510 B2 JP S6333510B2
Authority
JP
Japan
Prior art keywords
formula
melt
resin
polyamide
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP5532480A
Other languages
English (en)
Japanese (ja)
Other versions
JPS56151756A (en
Inventor
Yasushi Kubo
Toshihiko Aya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP5532480A priority Critical patent/JPS56151756A/ja
Publication of JPS56151756A publication Critical patent/JPS56151756A/ja
Publication of JPS6333510B2 publication Critical patent/JPS6333510B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
JP5532480A 1980-04-28 1980-04-28 Polyamide-imide resin composition Granted JPS56151756A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5532480A JPS56151756A (en) 1980-04-28 1980-04-28 Polyamide-imide resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5532480A JPS56151756A (en) 1980-04-28 1980-04-28 Polyamide-imide resin composition

Publications (2)

Publication Number Publication Date
JPS56151756A JPS56151756A (en) 1981-11-24
JPS6333510B2 true JPS6333510B2 (zh) 1988-07-05

Family

ID=12995356

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5532480A Granted JPS56151756A (en) 1980-04-28 1980-04-28 Polyamide-imide resin composition

Country Status (1)

Country Link
JP (1) JPS56151756A (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59135253A (ja) * 1983-01-24 1984-08-03 Toray Ind Inc ポリアミドイミドシ−ト状物

Also Published As

Publication number Publication date
JPS56151756A (en) 1981-11-24

Similar Documents

Publication Publication Date Title
WO1980000349A1 (en) Heat-resistant molding resin composition
JPS6322224B2 (zh)
CN111423723A (zh) 用于5g的增强聚苯硫醚组合物及其制备方法
CN102936372A (zh) 聚丙烯复合材料、其制备方法和应用
JPS59187054A (ja) 耐熱性熱可塑性樹脂組成物
JPS6351182B2 (zh)
JPS5898362A (ja) 成形用樹脂組成物
JPS6333510B2 (zh)
CN116120747A (zh) 一种塑料腔体滤波器用导热超低线性膨胀系数pps复合材料及其制备方法
JPS6333507B2 (zh)
JPS6333508B2 (zh)
JPS62273255A (ja) 耐溶剤性の改良された熱可塑性樹脂組成物
JPH0713185B2 (ja) 成形用樹脂組成物
JPS59126464A (ja) ポリアミドイミド樹脂系組成物
JPS6333509B2 (zh)
CN111334042A (zh) 低介电常数聚苯硫醚组合物及其制备方法
JPH0723449B2 (ja) 成形用樹脂組成物
JPS6361346B2 (zh)
JPS6153358A (ja) 耐熱性樹脂組成物
JPS60231758A (ja) 熱可塑性芳香族ポリアミド樹脂組成物
JPS60231759A (ja) ポリアミドイミド樹脂組成物
JPS60240760A (ja) 耐熱性熱可塑性樹脂組成物
JPS60240759A (ja) ポリアミドイミド樹脂系組成物
JPS59197460A (ja) ポリアミドイミド系樹脂組成物
CN101768448A (zh) 一种含炭黑的液晶高分子复合物及其制备方法