JPS6333319B2 - - Google Patents
Info
- Publication number
- JPS6333319B2 JPS6333319B2 JP54140858A JP14085879A JPS6333319B2 JP S6333319 B2 JPS6333319 B2 JP S6333319B2 JP 54140858 A JP54140858 A JP 54140858A JP 14085879 A JP14085879 A JP 14085879A JP S6333319 B2 JPS6333319 B2 JP S6333319B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- leadless
- component
- circuit board
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 45
- 238000000034 method Methods 0.000 claims description 22
- 238000002844 melting Methods 0.000 claims description 14
- 230000008018 melting Effects 0.000 claims description 14
- 238000005476 soldering Methods 0.000 claims description 14
- 238000000605 extraction Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 238000007650 screen-printing Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 229910020816 Sn Pb Inorganic materials 0.000 description 2
- 229910020922 Sn-Pb Inorganic materials 0.000 description 2
- 229910008783 Sn—Pb Inorganic materials 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- -1 resistors Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14085879A JPS5664495A (en) | 1979-10-31 | 1979-10-31 | Method of soldering electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14085879A JPS5664495A (en) | 1979-10-31 | 1979-10-31 | Method of soldering electronic part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5664495A JPS5664495A (en) | 1981-06-01 |
| JPS6333319B2 true JPS6333319B2 (ko) | 1988-07-05 |
Family
ID=15278369
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14085879A Granted JPS5664495A (en) | 1979-10-31 | 1979-10-31 | Method of soldering electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5664495A (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014017142A (ja) * | 2012-07-10 | 2014-01-30 | Toshiba Toko Meter Systems Co Ltd | ばね端子 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4954950B2 (ja) * | 2008-07-09 | 2012-06-20 | 東洋機械金属株式会社 | 半田による電子部品のリペア工法 |
| JP6481458B2 (ja) * | 2015-03-27 | 2019-03-13 | 日亜化学工業株式会社 | 発光装置の製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5476975A (en) * | 1977-11-30 | 1979-06-20 | Sanyo Electric Co | Soldering method |
-
1979
- 1979-10-31 JP JP14085879A patent/JPS5664495A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5476975A (en) * | 1977-11-30 | 1979-06-20 | Sanyo Electric Co | Soldering method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014017142A (ja) * | 2012-07-10 | 2014-01-30 | Toshiba Toko Meter Systems Co Ltd | ばね端子 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5664495A (en) | 1981-06-01 |
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