JPS6332262B2 - - Google Patents
Info
- Publication number
- JPS6332262B2 JPS6332262B2 JP56052048A JP5204881A JPS6332262B2 JP S6332262 B2 JPS6332262 B2 JP S6332262B2 JP 56052048 A JP56052048 A JP 56052048A JP 5204881 A JP5204881 A JP 5204881A JP S6332262 B2 JPS6332262 B2 JP S6332262B2
- Authority
- JP
- Japan
- Prior art keywords
- qip
- semiconductor device
- type semiconductor
- protective frame
- cylindrical body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 82
- 230000001681 protective effect Effects 0.000 claims description 36
- 238000004806 packaging method and process Methods 0.000 claims description 17
- 238000003825 pressing Methods 0.000 claims description 5
- 239000011347 resin Substances 0.000 description 21
- 229920005989 resin Polymers 0.000 description 21
- 238000007789 sealing Methods 0.000 description 21
- 238000000034 method Methods 0.000 description 8
- 239000005022 packaging material Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000012858 packaging process Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229920005830 Polyurethane Foam Polymers 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000011496 polyurethane foam Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Landscapes
- Packaging Frangible Articles (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56052048A JPS57166050A (en) | 1981-04-07 | 1981-04-07 | Packing body for shipment of semiconductor device |
US06/356,767 US4483441A (en) | 1981-03-26 | 1982-03-10 | Flat-type semiconductor device and packing thereof |
DE19823209756 DE3209756A1 (de) | 1981-03-26 | 1982-03-17 | Chip- oder plattenfoermige halbleitervorrichtung und ihre verpackung |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56052048A JPS57166050A (en) | 1981-04-07 | 1981-04-07 | Packing body for shipment of semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57166050A JPS57166050A (en) | 1982-10-13 |
JPS6332262B2 true JPS6332262B2 (ko) | 1988-06-29 |
Family
ID=12903927
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56052048A Granted JPS57166050A (en) | 1981-03-26 | 1981-04-07 | Packing body for shipment of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57166050A (ko) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4703920A (en) * | 1986-08-25 | 1987-11-03 | Amp Incorporated | Manufacturing method for integrated circuit chip carriers and work holder for use in the method |
JP4811064B2 (ja) * | 2006-03-15 | 2011-11-09 | 日本ゼオン株式会社 | コンテナ |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5380969A (en) * | 1976-12-27 | 1978-07-17 | Hitachi Ltd | Manufacture of resin shield type semiconductor device and lead frame used for the said process |
JPS5742974A (en) * | 1980-08-27 | 1982-03-10 | Kuraray Co | Fire retardant treatment of cloth |
-
1981
- 1981-04-07 JP JP56052048A patent/JPS57166050A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5380969A (en) * | 1976-12-27 | 1978-07-17 | Hitachi Ltd | Manufacture of resin shield type semiconductor device and lead frame used for the said process |
JPS5742974A (en) * | 1980-08-27 | 1982-03-10 | Kuraray Co | Fire retardant treatment of cloth |
Also Published As
Publication number | Publication date |
---|---|
JPS57166050A (en) | 1982-10-13 |
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